JPS643670B2 - - Google Patents
Info
- Publication number
- JPS643670B2 JPS643670B2 JP58171641A JP17164183A JPS643670B2 JP S643670 B2 JPS643670 B2 JP S643670B2 JP 58171641 A JP58171641 A JP 58171641A JP 17164183 A JP17164183 A JP 17164183A JP S643670 B2 JPS643670 B2 JP S643670B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- protective film
- extraction
- print head
- thermal print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000605 extraction Methods 0.000 claims description 27
- 230000001681 protective effect Effects 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 この発明はサーマルプリントヘツドに関する。[Detailed description of the invention] The present invention relates to thermal print heads.
周知のようにサーマルプリントヘツドは、基板
の表面に発熱ドツト部を設け、これに連なるリー
ドの一端をリード取出部とし、ここで外部回路の
リードと接続するようにしている。そして前記発
熱ドツト部と、リード取出部を除くリードの表面
を保護膜でコーテイングするのを普通としてい
る。第１図はこの保護膜のコーテイング時の状況
を示すもので、１は基板、２は発熱ドツト部、３
はリード、４はリード取出部で、このように構成
されたヘツド５は、リード取出部４をセラミツ
ク、ステンレス等のようなマスク６で覆い、保護
膜材料（たとえばSiO2とTa2O5）を順次スパツタ
する。 As is well known, a thermal print head has a heat generating dot section on the surface of the substrate, and one end of the lead connected to the dot section is used as a lead extraction section, from which it is connected to a lead of an external circuit. It is common practice to coat the surfaces of the leads, except for the heating dots and lead extraction parts, with a protective film. Figure 1 shows the situation during coating with this protective film, where 1 is the substrate, 2 is the heating dot part, and 3 is the heating dot part.
4 is a lead, and 4 is a lead extraction part. The head 5 constructed in this manner covers the lead extraction part 4 with a mask 6 made of ceramic, stainless steel, etc., and is coated with a protective film material (for example, SiO 2 and Ta 2 O 5 ). Sequentially sputter.
第２図はスパツタされたヘツド５を示し、７は
保護膜である。しかしこのスパツタの際基板１と
マスク６とが正確に密着していないと、スパツタ
粒子がまわりこむことがあり、具体的には図に示
すように保護膜端縁７Ａが、リード取出部４側に
向かつてたれこむようになる。このような現象が
発生すると、リード取出部４がマスク６で覆われ
ていた部分より短かくなつてしまう。前述のよう
にリード取出部４は外部回路のリード（たとえば
フレキシブルワイヤのリード等）に重ね合わせる
などして接続されるべきものであるから、その長
さは所定値に維持されていなければならないの
に、現実には前記のようにマスク６で覆われてい
た部分より短かくなつてしまうので、リード取出
部４を所定値に維持しようとするためには、マス
ク６で覆われる部分を所定値より長くしておかな
ければならないことになる。このようにすれば基
板１したがつてヘツド５として、リード取出部４
の長手方向に沿つて必要以上に長く製作しなけれ
ばならず、これがヘツド５を大型化する原因とな
る。 FIG. 2 shows the sputtered head 5, and 7 is a protective film. However, if the substrate 1 and the mask 6 are not in precise contact during this sputtering, the spatter particles may get around. Specifically, as shown in the figure, the protective film edge 7A is on the lead extraction part 4 side. You will start to lean towards it. When such a phenomenon occurs, the lead extraction portion 4 becomes shorter than the portion covered by the mask 6. As mentioned above, the lead extraction part 4 should be connected to the external circuit lead (for example, a flexible wire lead) by overlapping it, so its length must be maintained at a predetermined value. However, in reality, the portion covered by the mask 6 becomes shorter than the portion covered by the mask 6, so in order to maintain the lead extraction portion 4 at a predetermined value, the portion covered by the mask 6 must be shortened to a predetermined value. It will have to be made longer. In this way, the board 1 can be used as the head 5, and the lead extraction portion 4 can be used as the head 5.
The head 5 has to be made longer than necessary in the longitudinal direction, which causes the head 5 to become larger.
この発明は基板の大型化、マスキングの高密着
化をともなうことなく、リードの取出部を高精度
に維持することを目的とする。 The object of the present invention is to maintain a lead extraction portion with high precision without increasing the size of the substrate or increasing the adhesion of masking.
この発明は保護膜でコーテイングされなかつた
リード取出部の表面からこれに連続して保護膜の
表面にまでまたがつて所定の長さだけ取出用のリ
ードを重ねて形成したことを特徴とする。 The present invention is characterized in that a predetermined length of lead-out leads are formed so as to extend continuously from the surface of the lead-out portion that is not coated with the protective film to the surface of the protective film.
この発明の実施例を第３図以降の各図によつて
説明する。第３図はすでに述べた従来のようにし
て構成されたヘツド５を示す。これは第２図と同
じ構成である。ただし保護膜７の形成のためのス
パツタの際のマスキングにあたつてマスクとヘツ
ドとの密着は少々雑であつても差支えない。この
発明にしたがいリード取出部４の表面及びこれに
続く保護膜７の表面に取出用のリード８を重ねて
形成する。この形成のためにはたとえばホトエツ
チングによるとよい。 Embodiments of the present invention will be described with reference to FIG. 3 and subsequent figures. FIG. 3 shows a head 5 constructed in the conventional manner previously described. This is the same configuration as in FIG. However, when performing masking during sputtering for forming the protective film 7, it is acceptable even if the contact between the mask and the head is a little rough. According to the present invention, leads 8 for lead extraction are formed overlappingly on the surface of the lead extraction portion 4 and the surface of the protective film 7 following this. For example, photoetching can be used for this formation.
そのためには第３図に示すヘツドに対して第４
図のようにヘツド５の表面にリード用の材料９を
蒸着しておいてから所要の部分にホトエツチング
を施す。これによつてリード８を第５図のように
形成する。リード８はスパツタ等により形成され
たものではないから、高寸法精度で形成できる。
したがつて所望の寸法長のものが確実に得られ
る。もつともリード８はリード取出部４から保護
膜７の表面にまでまたがつて形成されるので、そ
の長さは外部回路のリードとの重ね合わせに必要
な長さ以上に形成することは容易であるし、この
必要な長さ以上に形成しても、基板１として大型
のものとしなければならない理由が皆無である。
リード８はリード４よりもやや広い幅とする。 For this purpose, a fourth
As shown in the figure, a lead material 9 is deposited on the surface of the head 5 and then photo-etched at the required portions. As a result, the leads 8 are formed as shown in FIG. Since the leads 8 are not formed by sputtering or the like, they can be formed with high dimensional accuracy.
Therefore, the desired length can be reliably obtained. Since the lead 8 is naturally formed to extend from the lead extraction part 4 to the surface of the protective film 7, it is easy to form the lead 8 to have a length longer than that required for overlapping with the external circuit lead. However, even if the length is longer than the required length, there is no reason why the substrate 1 needs to be large.
The lead 8 has a slightly wider width than the lead 4.
リード８を外部回路のリードたとえばフレキシ
プルケーブルのリードに重ね合わせて接続する。
この重ね合わせ部分を機械的に圧接することもあ
るが、場合によつてはハンダ付けすることもあ
る。そのためにリード８の表面にハンダの可能な
金属層１０を形成する。リード４がたとえばアル
ミニウムであるときは金又は銀をメツキにより形
成すればよい。もつともリードの表面をメツキす
ることは従来でも行われているが、もしリード８
を形成しない状態でリード４の表面にメツキした
とすると、第７図に示すようにメツキ層１０′は
保護膜７の表面にまで形成されず、境界部１１ま
でとなる。そのためこの境界部１１から湿気が侵
入することがある。しかしこの発明のようにリー
ド８を形成した上で金属層１０をメツキにより形
成しても、リード４と保護膜７との境界部にまた
がつて金属層１０が形成されるので、境界部から
の湿気の浸入は起らない。又リード８の周囲端面
を覆うようにカバーできる。なお金属層１０は半
田層であつてもよい。 The lead 8 is overlapped and connected to the lead of an external circuit, for example, the lead of a flexible cable.
This overlapping portion may be mechanically pressed together, but in some cases it may be soldered. For this purpose, a solderable metal layer 10 is formed on the surface of the lead 8. When the lead 4 is made of aluminum, for example, it may be formed by plating with gold or silver. Of course, plating the surface of the lead has been done in the past, but if the lead 8
If the surface of the lead 4 is plated without forming a plating layer 10', the plating layer 10' will not be formed on the surface of the protective film 7, but will extend to the boundary portion 11, as shown in FIG. Therefore, moisture may enter from this boundary portion 11. However, even if the metal layer 10 is formed by plating after forming the leads 8 as in the present invention, the metal layer 10 is formed straddling the boundary between the lead 4 and the protective film 7. No moisture infiltration occurs. Further, the peripheral end face of the lead 8 can be covered. Note that the metal layer 10 may be a solder layer.
以上詳述したようにこの発明によれば、発熱ド
ツト部に連なるリードの取出部の長さが保護膜形
成の際のマスキングの不都合により不揃いとなつ
ても、その表面にリードを形成して所定の寸法を
備えた外部回路接続のための取出用のリードと
し、これにより不揃いにリードが形成されても何
ら支障なく所望の長さのリードが得られるし、又
保護膜形成時のマスキングは少々雑であつても何
ら差支えないとともに、取出用リードの表面にメ
ツキ又は半田による金属層を形成したので、リー
ドを半田可能の状態で保護できるようになるとい
つた効果を奏する。 As detailed above, according to the present invention, even if the lengths of the lead extraction portions connected to the heating dot portions are uneven due to inconveniences in masking during the formation of the protective film, the leads can be formed on the surface of the lead extraction portions to achieve a predetermined length. The lead length for external circuit connection has dimensions of There is no problem even if it is rough, and since a metal layer is formed by plating or soldering on the surface of the lead for extraction, the lead can be protected in a solderable state.
第１図は保護膜形成の際のマスキング状態を示
す平面図、第２図は保護膜を形成したヘツドの平
面図、第３図、第４図はこの発明による取出用リ
ードの形成の工程を示す平面図、第５図はこの発
明の実施例を示す平面図、第６図は要部の拡大断
面図、第７図はこの発明によらない場合の拡大断
面図である。
１……基板、２……発熱ドツト部、３……リー
ド、４……リード取出部、７……保護膜、８……
取出用リード、１０……金属層。
FIG. 1 is a plan view showing the masking state when forming the protective film, FIG. 2 is a plan view of the head on which the protective film is formed, and FIGS. 3 and 4 show the process of forming the lead for extraction according to the present invention. FIG. 5 is a plan view showing an embodiment of the present invention, FIG. 6 is an enlarged sectional view of a main part, and FIG. 7 is an enlarged sectional view of a case not according to the present invention. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Heating dot part, 3...Lead, 4...Lead extraction part, 7...Protective film, 8...
Retrieval lead, 10...metal layer.
Claims (1)
ツト部に連なるリードを備え、前記リードの一部
をリード取出部とし、前記リード取出部を残して
表面に保護膜を設けてなるサーマルプリントヘツ
ドにおいて、前記リード取出部の表面から前記保
護膜の表面にまたがつて取出用リードを設けてな
るサーマルプリントヘツド。 ２ 基板の表面に、発熱ドツト部及び前記発熱ド
ツト部に連なるリードを備え、前記リードの一部
をリード取出部とし、前記リード取出部を残して
表面に保護膜を設けてなるサーマルプリントヘツ
ドにおいて、前記リード取出部の表面から前記保
護膜の表面にまたがつて取出用リードを設け、更
に前記取出用リードの表面に半田可能の金属層を
設けてなるサーマルプリントヘツド。 ３ 金属層はメツキ層である特許請求の範囲第２
項記載のサーマルプリントヘツド。 ４ 金属層は半田層である特許請求の範囲第２項
記載のサーマルプリントヘツド。[Claims] 1. A heating dot portion and a lead connected to the heating dot portion are provided on the surface of the substrate, a part of the lead is used as a lead extraction portion, and a protective film is provided on the surface leaving the lead extraction portion. A thermal print head comprising an extraction lead extending from the surface of the lead extraction portion to the surface of the protective film. 2. A thermal print head comprising a heat-generating dot portion and a lead connected to the heat-generating dot portion on the surface of a substrate, a part of the lead serving as a lead extraction portion, and a protective film provided on the surface leaving the lead extraction portion. . A thermal print head, wherein an extraction lead is provided spanning from the surface of the lead extraction portion to the surface of the protective film, and a solderable metal layer is further provided on the surface of the extraction lead. 3 Claim 2 in which the metal layer is a plating layer
Thermal print head described in section. 4. The thermal print head according to claim 2, wherein the metal layer is a solder layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58171641A JPS6063175A (en) | 1983-09-16 | 1983-09-16 | Thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58171641A JPS6063175A (en) | 1983-09-16 | 1983-09-16 | Thermal printing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6063175A JPS6063175A (en) | 1985-04-11 |
| JPS643670B2 true JPS643670B2 (en) | 1989-01-23 |
Family
ID=15926967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58171641A Granted JPS6063175A (en) | 1983-09-16 | 1983-09-16 | Thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6063175A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10242595A (en) * | 1997-02-26 | 1998-09-11 | Brother Ind Ltd | Circuit board |
-
1983
- 1983-09-16 JP JP58171641A patent/JPS6063175A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6063175A (en) | 1985-04-11 |
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