JPS605530A - 半導体ウエハ洗浄装置 - Google Patents

半導体ウエハ洗浄装置

Info

Publication number
JPS605530A
JPS605530A JP8178484A JP8178484A JPS605530A JP S605530 A JPS605530 A JP S605530A JP 8178484 A JP8178484 A JP 8178484A JP 8178484 A JP8178484 A JP 8178484A JP S605530 A JPS605530 A JP S605530A
Authority
JP
Japan
Prior art keywords
wafer
cleaning
drying
cartridge
rotary table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8178484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0347574B2 (enrdf_load_stackoverflow
Inventor
Hiroto Nagatomo
長友　宏人
Hisao Seki
関　久夫
Tetsuya Takagaki
哲也 高垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8178484A priority Critical patent/JPS605530A/ja
Publication of JPS605530A publication Critical patent/JPS605530A/ja
Publication of JPH0347574B2 publication Critical patent/JPH0347574B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP8178484A 1984-04-25 1984-04-25 半導体ウエハ洗浄装置 Granted JPS605530A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8178484A JPS605530A (ja) 1984-04-25 1984-04-25 半導体ウエハ洗浄装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8178484A JPS605530A (ja) 1984-04-25 1984-04-25 半導体ウエハ洗浄装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13999177A Division JPS5473475A (en) 1977-11-24 1977-11-24 Device for washing and drying

Publications (2)

Publication Number Publication Date
JPS605530A true JPS605530A (ja) 1985-01-12
JPH0347574B2 JPH0347574B2 (enrdf_load_stackoverflow) 1991-07-19

Family

ID=13756106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8178484A Granted JPS605530A (ja) 1984-04-25 1984-04-25 半導体ウエハ洗浄装置

Country Status (1)

Country Link
JP (1) JPS605530A (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987007077A3 (en) * 1986-05-16 1987-12-17 Eastman Kodak Co Method and apparatus for cleaning semiconductor wafers
US4722355A (en) * 1985-08-19 1988-02-02 Rolf Moe Machine and method for stripping photoresist from wafers
US5213118A (en) * 1990-11-28 1993-05-25 Tokyo Electron Limited Treatment apparatus
US5261431A (en) * 1991-04-02 1993-11-16 Tokyo Electron Limited Washing apparatus
US5603777A (en) * 1994-06-27 1997-02-18 Dainippon Screen Mfg. Co., Ltd. Substrate surface treating apparatus and substrate surface treating method
US6527031B1 (en) 1998-11-06 2003-03-04 Canon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
US6629539B1 (en) * 1998-11-06 2003-10-07 Canon Kabushiki Kaisha Sample processing system
US6833312B2 (en) 2001-05-25 2004-12-21 Canon Kabushiki Kaisha Plate member separating apparatus and method
US6867110B2 (en) 2001-05-25 2005-03-15 Canon Kabushiki Kaisha Separating apparatus and processing method for plate member
WO2014027517A1 (ja) * 2012-08-17 2014-02-20 株式会社プレテック スピンテーブルを用いた洗浄装置
US9666456B2 (en) 2006-07-07 2017-05-30 Tel Fsi, Inc. Method and apparatus for treating a workpiece with arrays of nozzles
CN107497749A (zh) * 2017-08-21 2017-12-22 成都菲斯普科技有限公司 一种医疗器械清洗消毒装置
CN111015341A (zh) * 2020-01-13 2020-04-17 郑香丽 一种用于三通阀门流道的环保切屑清理装置及其清理工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216875A (en) * 1975-07-30 1977-02-08 Hitachi Ltd Splash prevnter for rotational dryer
JPS5295967A (en) * 1976-02-09 1977-08-12 Hitachi Ltd Wafer washing and drying unit
JPS5358458A (en) * 1976-11-08 1978-05-26 Hitachi Shipbuilding Eng Co Device for automatically gouging periphery of cylinder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216875A (en) * 1975-07-30 1977-02-08 Hitachi Ltd Splash prevnter for rotational dryer
JPS5295967A (en) * 1976-02-09 1977-08-12 Hitachi Ltd Wafer washing and drying unit
JPS5358458A (en) * 1976-11-08 1978-05-26 Hitachi Shipbuilding Eng Co Device for automatically gouging periphery of cylinder

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4722355A (en) * 1985-08-19 1988-02-02 Rolf Moe Machine and method for stripping photoresist from wafers
WO1987007077A3 (en) * 1986-05-16 1987-12-17 Eastman Kodak Co Method and apparatus for cleaning semiconductor wafers
US5213118A (en) * 1990-11-28 1993-05-25 Tokyo Electron Limited Treatment apparatus
US5261431A (en) * 1991-04-02 1993-11-16 Tokyo Electron Limited Washing apparatus
US5421905A (en) * 1991-04-02 1995-06-06 Tokyo Electron Limited Method for washing wafers
US5603777A (en) * 1994-06-27 1997-02-18 Dainippon Screen Mfg. Co., Ltd. Substrate surface treating apparatus and substrate surface treating method
US7579257B2 (en) 1998-11-06 2009-08-25 Canon Kabuhsiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
US6629539B1 (en) * 1998-11-06 2003-10-07 Canon Kabushiki Kaisha Sample processing system
EP0999576A3 (en) * 1998-11-06 2005-01-12 Canon Kabushiki Kaisha Sample processing system
US6527031B1 (en) 1998-11-06 2003-03-04 Canon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
US6833312B2 (en) 2001-05-25 2004-12-21 Canon Kabushiki Kaisha Plate member separating apparatus and method
US6867110B2 (en) 2001-05-25 2005-03-15 Canon Kabushiki Kaisha Separating apparatus and processing method for plate member
US6946052B2 (en) 2001-05-25 2005-09-20 Canon Kabushiki Kaisha Separating apparatus and processing method for plate member
US9666456B2 (en) 2006-07-07 2017-05-30 Tel Fsi, Inc. Method and apparatus for treating a workpiece with arrays of nozzles
WO2014027517A1 (ja) * 2012-08-17 2014-02-20 株式会社プレテック スピンテーブルを用いた洗浄装置
JP2014038959A (ja) * 2012-08-17 2014-02-27 Pre-Tech Co Ltd スピンテーブルを用いた洗浄装置
CN107497749A (zh) * 2017-08-21 2017-12-22 成都菲斯普科技有限公司 一种医疗器械清洗消毒装置
CN111015341A (zh) * 2020-01-13 2020-04-17 郑香丽 一种用于三通阀门流道的环保切屑清理装置及其清理工艺
CN111015341B (zh) * 2020-01-13 2021-03-12 郑香丽 一种用于三通阀门流道的环保切屑清理装置及其清理工艺

Also Published As

Publication number Publication date
JPH0347574B2 (enrdf_load_stackoverflow) 1991-07-19

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