JPS6054497A - テ−ピングされたリ−ド線付電子部品の離テ−プ装置 - Google Patents

テ−ピングされたリ−ド線付電子部品の離テ−プ装置

Info

Publication number
JPS6054497A
JPS6054497A JP58162956A JP16295683A JPS6054497A JP S6054497 A JPS6054497 A JP S6054497A JP 58162956 A JP58162956 A JP 58162956A JP 16295683 A JP16295683 A JP 16295683A JP S6054497 A JPS6054497 A JP S6054497A
Authority
JP
Japan
Prior art keywords
wheel
tape
lead wire
support wheel
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58162956A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0151080B2 (enrdf_load_html_response
Inventor
林　憲世
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiwa Sangyo Co Ltd
Original Assignee
Seiwa Sangyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiwa Sangyo Co Ltd filed Critical Seiwa Sangyo Co Ltd
Priority to JP58162956A priority Critical patent/JPS6054497A/ja
Publication of JPS6054497A publication Critical patent/JPS6054497A/ja
Publication of JPH0151080B2 publication Critical patent/JPH0151080B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP58162956A 1983-09-05 1983-09-05 テ−ピングされたリ−ド線付電子部品の離テ−プ装置 Granted JPS6054497A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58162956A JPS6054497A (ja) 1983-09-05 1983-09-05 テ−ピングされたリ−ド線付電子部品の離テ−プ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58162956A JPS6054497A (ja) 1983-09-05 1983-09-05 テ−ピングされたリ−ド線付電子部品の離テ−プ装置

Publications (2)

Publication Number Publication Date
JPS6054497A true JPS6054497A (ja) 1985-03-28
JPH0151080B2 JPH0151080B2 (enrdf_load_html_response) 1989-11-01

Family

ID=15764465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58162956A Granted JPS6054497A (ja) 1983-09-05 1983-09-05 テ−ピングされたリ−ド線付電子部品の離テ−プ装置

Country Status (1)

Country Link
JP (1) JPS6054497A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298903A (ja) * 1988-10-05 1990-04-11 Taiyo Yuden Co Ltd チップ状電子部品搬送装置
US5562878A (en) * 1992-12-07 1996-10-08 Sumitomo Chemical Company, Limited Process for producing skin material laminated hollow molded article using fluid ejection pin
CN105398630A (zh) * 2015-11-16 2016-03-16 如皋市大昌电子有限公司 一种编带二极管自动拆编装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298903A (ja) * 1988-10-05 1990-04-11 Taiyo Yuden Co Ltd チップ状電子部品搬送装置
US5562878A (en) * 1992-12-07 1996-10-08 Sumitomo Chemical Company, Limited Process for producing skin material laminated hollow molded article using fluid ejection pin
CN105398630A (zh) * 2015-11-16 2016-03-16 如皋市大昌电子有限公司 一种编带二极管自动拆编装置

Also Published As

Publication number Publication date
JPH0151080B2 (enrdf_load_html_response) 1989-11-01

Similar Documents

Publication Publication Date Title
JPS63162406A (ja) チップ部品装填方法及び装置
CN1080533C (zh) 元器件供给装置
JPS6054497A (ja) テ−ピングされたリ−ド線付電子部品の離テ−プ装置
JP5800492B2 (ja) ラベル貼着装置
JPS61217456A (ja) テ−ピングカセツト式電子部品の送り装置
KR20170108652A (ko) 라벨공급장치
JPH054318Y2 (enrdf_load_html_response)
JP3554781B2 (ja) 電子部品の剥離装置及び剥離方法
JPH04215910A (ja) 固形物搬送装置のガイドプレート
JPS6329404B2 (enrdf_load_html_response)
JP3414056B2 (ja) マーキング装置
JPS63162416A (ja) チツプ電子部品のテ−ピング装置
JPH08288690A (ja) 電子部品供給装置
JP2935892B2 (ja) チップ型電子部品分離供給装置
JPH0376247A (ja) ウエハの移し替え方法
JP3732421B2 (ja) 電子部品の供給装置
JPH0151049B2 (enrdf_load_html_response)
KR101070896B1 (ko) 캐리어테이프 피더
JP3089088U (ja) テープカバー
JPH06340324A (ja) 振込パーツフィーダ供給装置
JPS58171813A (ja) コンデンサ素子等の保留または供給用装置
JPH10101178A (ja) キャリアテープとこれを用いた部品供給方法
JP3029737B2 (ja) 円筒型電池の整列装置
JPH0515484Y2 (enrdf_load_html_response)
JPH0252873B2 (enrdf_load_html_response)