JPS6053118B2 - 電着されるパラジウム−ニツケル合金の耐食性を高める方法 - Google Patents

電着されるパラジウム−ニツケル合金の耐食性を高める方法

Info

Publication number
JPS6053118B2
JPS6053118B2 JP57155320A JP15532082A JPS6053118B2 JP S6053118 B2 JPS6053118 B2 JP S6053118B2 JP 57155320 A JP57155320 A JP 57155320A JP 15532082 A JP15532082 A JP 15532082A JP S6053118 B2 JPS6053118 B2 JP S6053118B2
Authority
JP
Japan
Prior art keywords
palladium
nickel
corrosion resistance
electrodeposited
increasing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57155320A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5855586A (ja
Inventor
ロベルト・ブルガ−
クラウス・シユルツエ−ベルゲ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RANGUBAIN FUANHAUZERU UERUKE AG
Original Assignee
RANGUBAIN FUANHAUZERU UERUKE AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RANGUBAIN FUANHAUZERU UERUKE AG filed Critical RANGUBAIN FUANHAUZERU UERUKE AG
Publication of JPS5855586A publication Critical patent/JPS5855586A/ja
Publication of JPS6053118B2 publication Critical patent/JPS6053118B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP57155320A 1981-09-11 1982-09-08 電着されるパラジウム−ニツケル合金の耐食性を高める方法 Expired JPS6053118B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3136003.3 1981-09-11
DE3136003 1981-09-11

Publications (2)

Publication Number Publication Date
JPS5855586A JPS5855586A (ja) 1983-04-01
JPS6053118B2 true JPS6053118B2 (ja) 1985-11-22

Family

ID=6141378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57155320A Expired JPS6053118B2 (ja) 1981-09-11 1982-09-08 電着されるパラジウム−ニツケル合金の耐食性を高める方法

Country Status (12)

Country Link
US (1) US4430172A (OSRAM)
JP (1) JPS6053118B2 (OSRAM)
AT (1) AT377790B (OSRAM)
AU (1) AU537532B2 (OSRAM)
BE (1) BE894190A (OSRAM)
BR (1) BR8205303A (OSRAM)
FR (1) FR2512845A1 (OSRAM)
GB (1) GB2106140B (OSRAM)
IT (1) IT1152087B (OSRAM)
NL (1) NL8203518A (OSRAM)
SE (1) SE8205087L (OSRAM)
ZA (1) ZA826663B (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
US6828898B2 (en) * 2003-04-03 2004-12-07 Cts Corporation Fuel tank resistor card having improved corrosion resistance
EP1892320A1 (de) * 2006-08-22 2008-02-27 Enthone, Incorporated Elektrolytzusammensetzung und Verfahren zur elektrolytischen Abscheidung von palladiumhaltigen Schichten
KR101953970B1 (ko) * 2016-06-29 2019-03-05 동국대학교 경주캠퍼스 산학협력단 미세분무용 다공성 필터의 제조방법 및 이를 이용하여 제조된 다공성 필터
WO2020129095A1 (en) * 2018-12-20 2020-06-25 Top Finish 2002 S.R.L. Galvanic bath for making a corrosion- and oxidation-resistant palladium and nickel alloy-based plating, preparation and use thereof
IT202000000391A1 (it) * 2020-01-13 2021-07-13 Italfimet Srl Procedimento galvanico, e relativo bagno, di elettrodeposizione di palladio ad alta resistenza alla corrosione.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1028407B (de) * 1956-08-22 1958-04-17 Heyden Chem Fab Bad und Verfahren zur galvanischen Abscheidung von glaenzenden Nickelueberzuegen
JPS4733176B1 (OSRAM) 1967-01-11 1972-08-23

Also Published As

Publication number Publication date
ATA338182A (de) 1984-09-15
AT377790B (de) 1985-04-25
AU537532B2 (en) 1984-06-28
AU8818982A (en) 1983-03-17
SE8205087D0 (sv) 1982-09-08
GB2106140B (en) 1985-05-15
JPS5855586A (ja) 1983-04-01
IT8222974A0 (it) 1982-08-25
US4430172A (en) 1984-02-07
IT8222974A1 (it) 1984-02-25
NL8203518A (nl) 1983-04-05
GB2106140A (en) 1983-04-07
BE894190A (fr) 1982-12-16
IT1152087B (it) 1986-12-24
FR2512845B1 (OSRAM) 1984-08-10
FR2512845A1 (fr) 1983-03-18
ZA826663B (en) 1983-07-27
SE8205087L (sv) 1983-03-12
BR8205303A (pt) 1983-08-16

Similar Documents

Publication Publication Date Title
US3677909A (en) Palladium-nickel alloy plating bath
JPS5929118B2 (ja) パラジウム・ニツケル合金メツキ液
ITTO950840A1 (it) Bagni alcalini elettrolitici e procedimenti per zinco e leghe di zinco
US4491507A (en) Galvanic depositing of palladium coatings
US3692641A (en) Electrodeposition of low stress ruthenium alloy
JPH0422990B2 (OSRAM)
KR930006123B1 (ko) 무전해 금 도금욕 및 이를 사용하는 방법
JPS6053118B2 (ja) 電着されるパラジウム−ニツケル合金の耐食性を高める方法
US3793162A (en) Electrodeposition of ruthenium
US3892638A (en) Electrolyte and method for electrodepositing rhodium-ruthenium alloys
JP2003530371A (ja) パラジウム錯塩及びパラジウム又はその合金の一つを析出させる電解浴のパラジウム濃度を調節するためのその使用
JPS61190089A (ja) 金／インジウム合金被膜を電気メツキによつて析出する浴
JPS60500296A (ja) パラジウム−銀合金の電気めっき浴
US5516419A (en) Hard iron plating of aluminum/aluminum alloys using sulfamate/sulfate solutions
JPS609116B2 (ja) パラジウム及びパラジウム合金の電着方法
US4778574A (en) Amine-containing bath for electroplating palladium
JPS5816089A (ja) パラジウム／ニッケル合金を電気的に析出する浴
US3930965A (en) Zinc-copper alloy electroplating baths
US4297179A (en) Palladium electroplating bath and process
US4416740A (en) Method and bath for the electrodeposition of palladium/nickel alloys
US3969198A (en) Ni-Fe electro-plating
US4411744A (en) Bath and process for high speed nickel electroplating
US3374156A (en) Electro-depositing stainless steel coatings on metal surfaces
CA1180677A (en) Bath and process for high speed nickel electroplating
KR100760420B1 (ko) 팔라듐 도금액