JPS6053056A - 半導体装置用セラミックパッケ−ジ - Google Patents

半導体装置用セラミックパッケ−ジ

Info

Publication number
JPS6053056A
JPS6053056A JP58161653A JP16165383A JPS6053056A JP S6053056 A JPS6053056 A JP S6053056A JP 58161653 A JP58161653 A JP 58161653A JP 16165383 A JP16165383 A JP 16165383A JP S6053056 A JPS6053056 A JP S6053056A
Authority
JP
Japan
Prior art keywords
ceramic package
semiconductor device
bonding
wire
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58161653A
Other languages
English (en)
Japanese (ja)
Other versions
JPS647502B2 (cg-RX-API-DMAC10.html
Inventor
Masao Ueda
植田　正夫
Hiroshi Kubo
宏 久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP58161653A priority Critical patent/JPS6053056A/ja
Publication of JPS6053056A publication Critical patent/JPS6053056A/ja
Publication of JPS647502B2 publication Critical patent/JPS647502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—

Landscapes

  • Wire Bonding (AREA)
JP58161653A 1983-09-02 1983-09-02 半導体装置用セラミックパッケ−ジ Granted JPS6053056A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58161653A JPS6053056A (ja) 1983-09-02 1983-09-02 半導体装置用セラミックパッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58161653A JPS6053056A (ja) 1983-09-02 1983-09-02 半導体装置用セラミックパッケ−ジ

Publications (2)

Publication Number Publication Date
JPS6053056A true JPS6053056A (ja) 1985-03-26
JPS647502B2 JPS647502B2 (cg-RX-API-DMAC10.html) 1989-02-09

Family

ID=15739271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58161653A Granted JPS6053056A (ja) 1983-09-02 1983-09-02 半導体装置用セラミックパッケ−ジ

Country Status (1)

Country Link
JP (1) JPS6053056A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100562681B1 (ko) 2000-05-24 2006-03-23 가부시키가이샤 네오맥스 복수의 강자성상을 포함하는 영구자석 및 그 제조방법
JPWO2020246159A1 (cg-RX-API-DMAC10.html) * 2019-06-04 2020-12-10

Also Published As

Publication number Publication date
JPS647502B2 (cg-RX-API-DMAC10.html) 1989-02-09

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