JPS6234445Y2 - - Google Patents
Info
- Publication number
- JPS6234445Y2 JPS6234445Y2 JP1982085735U JP8573582U JPS6234445Y2 JP S6234445 Y2 JPS6234445 Y2 JP S6234445Y2 JP 1982085735 U JP1982085735 U JP 1982085735U JP 8573582 U JP8573582 U JP 8573582U JP S6234445 Y2 JPS6234445 Y2 JP S6234445Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- package
- welding frame
- semiconductor device
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/07141—
-
- H10W72/07521—
-
- H10W72/5363—
-
- H10W72/5449—
-
- H10W72/932—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982085735U JPS58187149U (ja) | 1982-06-09 | 1982-06-09 | 半導体素子用パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982085735U JPS58187149U (ja) | 1982-06-09 | 1982-06-09 | 半導体素子用パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58187149U JPS58187149U (ja) | 1983-12-12 |
| JPS6234445Y2 true JPS6234445Y2 (cg-RX-API-DMAC10.html) | 1987-09-02 |
Family
ID=30094583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982085735U Granted JPS58187149U (ja) | 1982-06-09 | 1982-06-09 | 半導体素子用パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58187149U (cg-RX-API-DMAC10.html) |
-
1982
- 1982-06-09 JP JP1982085735U patent/JPS58187149U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58187149U (ja) | 1983-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6234445Y2 (cg-RX-API-DMAC10.html) | ||
| JPS60161646A (ja) | 半導体装置用リ−ドフレ−ム | |
| JPH0233961A (ja) | リードフレーム | |
| JPS60154652A (ja) | 半導体装置 | |
| JP2002026168A5 (cg-RX-API-DMAC10.html) | ||
| JPS5839046U (ja) | 半導体パツケ−ジ | |
| JPH01128440A (ja) | 樹脂封止型半導体装置 | |
| JPS647502B2 (cg-RX-API-DMAC10.html) | ||
| JPH01270338A (ja) | モールド封止半導体装置 | |
| JPS5954942U (ja) | 樹脂封止型半導体装置 | |
| JPH0595074A (ja) | 半導体装置 | |
| JPS6016546U (ja) | 半導体装置用保護素子 | |
| JPH0167743U (cg-RX-API-DMAC10.html) | ||
| JPS5929033U (ja) | 半導体装置用パツケ−ジ | |
| JPH03110841U (cg-RX-API-DMAC10.html) | ||
| JPH0373444U (cg-RX-API-DMAC10.html) | ||
| JPS63140642U (cg-RX-API-DMAC10.html) | ||
| JPS5842947U (ja) | 半導体装置用パツケ−ジ | |
| JPH0323945U (cg-RX-API-DMAC10.html) | ||
| JPH01200658A (ja) | 半導体装置 | |
| JPH0317650U (cg-RX-API-DMAC10.html) | ||
| JPS6196557U (cg-RX-API-DMAC10.html) | ||
| JPH06260528A (ja) | 半導体集積回路装置 | |
| JPS6188253U (cg-RX-API-DMAC10.html) | ||
| JPH03101524U (cg-RX-API-DMAC10.html) |