JPS605064A - 窒化系セラミツクス成形用バインダ - Google Patents
窒化系セラミツクス成形用バインダInfo
- Publication number
- JPS605064A JPS605064A JP58110366A JP11036683A JPS605064A JP S605064 A JPS605064 A JP S605064A JP 58110366 A JP58110366 A JP 58110366A JP 11036683 A JP11036683 A JP 11036683A JP S605064 A JPS605064 A JP S605064A
- Authority
- JP
- Japan
- Prior art keywords
- binder
- weight
- parts
- silicon nitride
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011230 binding agent Substances 0.000 title claims description 21
- 239000000919 ceramic Substances 0.000 title claims description 18
- 150000004767 nitrides Chemical class 0.000 title description 7
- 238000000465 moulding Methods 0.000 claims description 13
- 229920000098 polyolefin Polymers 0.000 claims description 5
- 239000004094 surface-active agent Substances 0.000 claims description 4
- 150000003863 ammonium salts Chemical class 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 15
- 229910052581 Si3N4 Inorganic materials 0.000 description 14
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005238 degreasing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 238000009837 dry grinding Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 101150097115 dop-3 gene Proteins 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58110366A JPS605064A (ja) | 1983-06-20 | 1983-06-20 | 窒化系セラミツクス成形用バインダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58110366A JPS605064A (ja) | 1983-06-20 | 1983-06-20 | 窒化系セラミツクス成形用バインダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS605064A true JPS605064A (ja) | 1985-01-11 |
| JPH0143708B2 JPH0143708B2 (enrdf_load_stackoverflow) | 1989-09-22 |
Family
ID=14533968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58110366A Granted JPS605064A (ja) | 1983-06-20 | 1983-06-20 | 窒化系セラミツクス成形用バインダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS605064A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5602405A (en) * | 1994-09-05 | 1997-02-11 | Ngk Insulators, Ltd. | Semiconductor device with base formed by the junction of two semiconductors of the same conductive type |
| US5648665A (en) * | 1994-04-28 | 1997-07-15 | Ngk Insulators, Ltd. | Semiconductor device having a plurality of cavity defined gating regions and a fabrication method therefor |
| US5847417A (en) * | 1994-08-26 | 1998-12-08 | Ngk Insulators, Ltd. | Semiconductor device and method of manufacturing same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113511A (en) * | 1979-02-27 | 1980-09-02 | Asahi Glass Co Ltd | Method of molding ceramics or metallic powder |
-
1983
- 1983-06-20 JP JP58110366A patent/JPS605064A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113511A (en) * | 1979-02-27 | 1980-09-02 | Asahi Glass Co Ltd | Method of molding ceramics or metallic powder |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5648665A (en) * | 1994-04-28 | 1997-07-15 | Ngk Insulators, Ltd. | Semiconductor device having a plurality of cavity defined gating regions and a fabrication method therefor |
| US5930651A (en) * | 1994-04-28 | 1999-07-27 | Ngk Insulators, Ltd. | Method of forming a semiconductor device having a plurality of cavity defined gating regions |
| US5847417A (en) * | 1994-08-26 | 1998-12-08 | Ngk Insulators, Ltd. | Semiconductor device and method of manufacturing same |
| US6159776A (en) * | 1994-08-26 | 2000-12-12 | Ngk Insulators, Ltd. | Method for manufacturing semiconductor device |
| US5602405A (en) * | 1994-09-05 | 1997-02-11 | Ngk Insulators, Ltd. | Semiconductor device with base formed by the junction of two semiconductors of the same conductive type |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0143708B2 (enrdf_load_stackoverflow) | 1989-09-22 |
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