JPS6042895A - Method of printing paste to through hole - Google Patents
Method of printing paste to through holeInfo
- Publication number
- JPS6042895A JPS6042895A JP15123583A JP15123583A JPS6042895A JP S6042895 A JPS6042895 A JP S6042895A JP 15123583 A JP15123583 A JP 15123583A JP 15123583 A JP15123583 A JP 15123583A JP S6042895 A JPS6042895 A JP S6042895A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- paste
- thick film
- substrate
- printing paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はラジオ、テレビ、ビデオテープレコーダー等に
用いるスルーホールへのペースト印刷方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to a method for printing paste into through-holes used in radios, televisions, video tape recorders, etc.
従来例の構成とその問題点
第１図は厚膜回路の一例を示す。アルミナ基板１上に印
刷された厚膜ペーストは乾燥および焼成されて厚膜導体
層２．厚膜抵抗体３を形成している。導体用厚膜ペース
トは、−ｆｆに銀−パラジウム合金粉末とガラスフリッ
ト、樹脂バインダ、有機溶剤などから構成され、また抵
抗用の厚膜ペーストは銀−パラジウムの替りに酸化ルテ
ニウムが使用され、他は導体用ペーストと略等しいもの
で構成されている。アルミナ基板１の上にはチノプゴン
デン・す４が半田６により厚膜導体層２と接続されてい
る。最近の電子機器の小型化の要求に伴い、そこに含ま
れる回路基板の小型化、高集積化の必要性が増加してい
る。従って第１図に示すような従来の一般的な片面のみ
を利用する基板から第２図に示すようなアルミナ基板６
内のスルーホール７に形成した厚膜導体層８を用いて基
板両面を有効に活用した両面厚膜回路が使われるように
なってきた。Conventional structure and problems thereof FIG. 1 shows an example of a thick film circuit. The thick film paste printed on the alumina substrate 1 is dried and fired to form a thick film conductor layer 2. A thick film resistor 3 is formed. Thick film paste for conductors is composed of -ff, silver-palladium alloy powder, glass frit, resin binder, organic solvent, etc. Thick film paste for resistors uses ruthenium oxide instead of silver-palladium, and other materials. is made of a material that is approximately the same as conductor paste. On the alumina substrate 1, a tinoplast 4 is connected to the thick film conductor layer 2 by solder 6. With the recent demand for downsizing of electronic devices, there is an increasing need for circuit boards included therein to be downsized and highly integrated. Therefore, from the conventional general substrate using only one side as shown in FIG. 1 to the alumina substrate 6 as shown in FIG.
Double-sided thick-film circuits have come into use that effectively utilize both sides of the substrate by using thick-film conductor layers 8 formed in through-holes 7 inside.
スルーホール内に厚膜導体層を形成する方法は、基板裏
面より真空に吸引しながら導体ペーストをスクリーン印
刷法により印刷形成する方法である。A method for forming a thick film conductor layer in a through hole is to print a conductor paste using a screen printing method while drawing a vacuum from the back surface of the substrate.
この場合、通常の問題点として第３図のようにスルーホ
ール９のエッヂ部における厚膜導体層１゜の膜厚が非常
に薄くなり、導通不良の問題が発生しやすい０又、第４
図に示すように基板の厚さに比ベスルーホール１１の径
が極端に小さい場合、スルーホール内に導体ペースト１
２の゛詰まりが発生しやすい。この様Ｆペーストがスル
ーホール内に詰った場合、焼成時あるいは冷熱サイクル
中で熱膨張、収縮Ω差から基板と導体間にクラック。In this case, the usual problem is that the thickness of the thick film conductor layer 1° at the edge part of the through hole 9 becomes very thin as shown in FIG.
As shown in the figure, if the diameter of the through hole 11 is extremely small compared to the thickness of the board, conductive paste 1
2) Clogging is likely to occur. If F paste gets stuck in the through-hole like this, cracks will occur between the board and the conductor due to the difference in Ω of thermal expansion and contraction during firing or cooling/heating cycles.
剥離が発生する。第３図、第４図の現象はオーバコート
印刷時にも同様に発生する。Peeling occurs. The phenomena shown in FIGS. 3 and 4 similarly occur during overcoat printing.
発明の目的
本発明は上記欠点を解決し、スルーホール内に厚膜ペー
ストを詰まらせず、かつスルーホールエッヂ部の厚膜層
の厚みを薄くせず均一にさせるものである。OBJECTS OF THE INVENTION The present invention solves the above-mentioned drawbacks, prevents thick film paste from clogging inside the through hole, and makes the thickness of the thick film layer at the edge of the through hole uniform without reducing it.
発明′の構成
本発明のスルー・ホールへのペースト印刷方法は、厚膜
ペーストを真空吸引しながら印刷してスルー・ホール内
にペーストを塗布し、後にペーストが乾燥凝固する前に
空気等のガス体をスルーホールを通して基板裏面より吹
き出させることにより厚膜ペーストのスルーホール内の
詰すゃ、スルーホールエッヂ部の膜厚の薄化を解消する
ものである。Structure of the Invention The paste printing method for through-holes of the present invention involves printing a thick film paste while vacuum suction, applying the paste inside the through-hole, and then blowing a gas such as air before the paste dries and solidifies. By blowing out the paste from the back surface of the substrate through the through-hole, the through-hole is filled with thick film paste, thereby eliminating the problem of thinning of the film at the edge of the through-hole.
実施例の説明 （実施例１） 第６図・により本発明の実施例の１つを説明する。Description of examples (Example 1) One embodiment of the present invention will be explained with reference to FIG.
（１）直径０．４−のスルーホール１３を有スる厚み０
．８間のアルミナ基板１４に粘度約１５０．α℃ｃｐｓ
の銀−パラジウ去系導体ペースト１５を１００ ｃｃ７
％の吸引下でスクリーン印刷をする。(1)Thickness 0 with through hole 13 with diameter 0.4-
．． The alumina substrate 14 between 8 and 8 has a viscosity of about 150. α℃cps
100 cc7 of silver-palladium conductor paste 15
Screen printing under % suction.
（２）ペーストが乾燥する前に空気をスル−ホールを通
して１００ ｃｃ／ＩＪの圧力で基板下方から上方へ吹
き出させる。(2) Before the paste dries, air is blown upward from below the substrate through the through-holes at a pressure of 100 cc/IJ.
上記の様な方法により、膜厚が均一で、スルーホール内
にペーストの詰まりのない良好な厚膜導体層１６を得る
ことができた。吹き出し時の圧力が高すぎた場合、ペー
ストが飛び散り、基板表面を汚し、不良となる。又、吹
き出し圧力が低すぎた場合、本発明の効果を得ることが
できない。By the method described above, it was possible to obtain a good thick film conductor layer 16 with a uniform thickness and no paste clogging in the through holes. If the pressure at the time of blowing is too high, the paste will scatter, staining the board surface, and resulting in defects. Furthermore, if the blowing pressure is too low, the effects of the present invention cannot be obtained.
（実施例２） 第６図により本発明の実施例の１つを説明する。(Example 2) One embodiment of the present invention will be explained with reference to FIG.
直径０．４ｔｍのスルーホール１７を有する厚み０．８
胴のアルミナ基板１８に厚膜導体層１９を印刷。Thickness 0.8 with through hole 17 of diameter 0.4tm
A thick film conductor layer 19 is printed on the alumina substrate 18 of the cylinder.
焼成により形成した上に、粘度約１００ 、０００ ｃ
ｐｓのエポキシ系オーバーコート樹脂ペーストヲ６０ｃ
ｃ／ｆｊの吸引下でスクリーン印刷する。ペーストが乾
燥する前に空気をスルーホールを通して６０ｃｃ／％の
圧力で基板下方から上方へ吹き出させる。It is formed by firing and has a viscosity of about 100,000 c.
PS epoxy overcoat resin paste 60c
Screen print under c/fj suction. Before the paste dries, air is blown upward from below the substrate through the through holes at a pressure of 60 cc/%.
上記の様な方法により、膜厚が均一で、スルーホール内
にペーストの詰まりのない良好なオーバーコート層２ｏ
を得ることができた。吹き出し圧力の高すぎ又は、低す
ぎの場合、前述の実施例１に示すようカニ都合が生じた
。By the method described above, a good overcoat layer 2o with a uniform thickness and no paste clogging in the through holes can be obtained.
I was able to get If the blowing pressure was too high or too low, a problem occurred as shown in Example 1 above.
発明の効果
見上のように本発明はスルーホール内に厚膜層を形成す
る場合、厚膜ペーストを印刷し、スルーホール内にペー
ストを塗布後、乾燥する前にスルーホールを通して基板
裏面より表面に向けて空気等のガス体を吹き出させるこ
とによりスルーホール内のペーストの詰まりを解消し、
か２スルーホール内の厚膜層の厚みを均一にするもので
あり、スルーホール導通およびオーバーク１−トの信頼
性を大きく向上させるものである。Effects of the Invention As seen above, when forming a thick film layer inside a through hole, the present invention prints a thick film paste, applies the paste inside the through hole, and then passes the paste through the through hole from the back side of the substrate to the front surface before drying. By blowing out gas such as air towards the through hole, the paste can be unclogged.
This makes the thickness of the thick film layer in the through-hole uniform, and greatly improves the through-hole conduction and the reliability of the overboard.
第１図は厚膜回路の一例を示す断面図、第２図は基板両
面を用いた厚膜回路を示す断面図、第３図及び第４図は
従来のスルーホール印刷法によるスルーホール部の断面
図、第６図、第６図は本発明の実施によるスルーホール
部の断面図である。
１．６，１４．１８・・・・・・アルミナ基板、２，８
゜１０．１６．１９・・・・・・厚膜導体層、３・・・
・・厚膜抵抗体−４・・・・・・チップコンデンサ、５
・・・・・・半田、７゜９．１１．１３．１７・・・・
・・スルーホール、１２゜１５・・・・・導体ペースト
、２０・・・・・・オーバーコート層。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名＠１
図
４
”４２ 、。
第５図
４
■
第６図
８Fig. 1 is a sectional view showing an example of a thick film circuit, Fig. 2 is a sectional view showing a thick film circuit using both sides of a substrate, and Figs. 6 is a cross-sectional view of a through-hole portion according to an embodiment of the present invention. 1.6,14.18...Alumina substrate, 2,8
゜10.16.19 Thick film conductor layer, 3...
...Thick film resistor-4...Chip capacitor, 5
...Solder, 7゜9.11.13.17...
...Through hole, 12゜15...Conductor paste, 20...Overcoat layer. Name of agent: Patent attorney Toshio Nakao and 1 other person @1
Figure 4 ``42.'' Figure 5 4 ■ Figure 6 8
Claims (1)
て真空吸引によって厚膜ペーストを片面より塗布し、そ
の後、この厚膜ペーストが乾燥する前に前記スルーホー
ルを通じてガス体を前記真空吸引の方向とへ向けて吹き
出させるスルーホールへのペースト印刷方法。A thick film paste is applied from one side into a through hole provided in a substrate by vacuum suction through the through hole, and then, before the thick film paste dries, a gas is applied through the through hole in the direction of the vacuum suction. A method of printing paste into a through-hole that blows out towards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15123583A JPS6042895A (en) | 1983-08-18 | 1983-08-18 | Method of printing paste to through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15123583A JPS6042895A (en) | 1983-08-18 | 1983-08-18 | Method of printing paste to through hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6042895A true JPS6042895A (en) | 1985-03-07 |
| JPH0518280B2 JPH0518280B2 (en) | 1993-03-11 |
Family
ID=15514200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15123583A Granted JPS6042895A (en) | 1983-08-18 | 1983-08-18 | Method of printing paste to through hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6042895A (en) |
-
1983
- 1983-08-18 JP JP15123583A patent/JPS6042895A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0518280B2 (en) | 1993-03-11 |
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