JPS60214591A - Screen printing machine - Google Patents

Screen printing machine

Info

Publication number
JPS60214591A
JPS60214591A JP7112684A JP7112684A JPS60214591A JP S60214591 A JPS60214591 A JP S60214591A JP 7112684 A JP7112684 A JP 7112684A JP 7112684 A JP7112684 A JP 7112684A JP S60214591 A JPS60214591 A JP S60214591A
Authority
JP
Japan
Prior art keywords
squeegee
screen
paste
printing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7112684A
Other languages
Japanese (ja)
Inventor
佐伯 啓二
山本 重之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7112684A priority Critical patent/JPS60214591A/en
Publication of JPS60214591A publication Critical patent/JPS60214591A/en
Pending legal-status Critical Current

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 2ベノ 本発明はラジオ、テレビ、ビデオテープレコーダー等に
利用可能な厚膜回路の製造におけるスクリーン印刷機に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION INDUSTRIAL APPLICATION FIELD OF THE INVENTION The present invention relates to a screen printing machine for producing thick film circuits that can be used in radios, televisions, video tape recorders, etc.

従来例の構成とその問題点 第1図は、厚膜回路の一例を示す。アルミナ基板1上に
印刷された厚膜ペーストは、乾燥および焼成されて、厚
膜導体層2.厚膜抵抗体3を形成している。導体用厚膜
ペースI・は、一般に銀−パラジウム合金粉末とガラス
フリット、樹脂バインダー、有機溶剤などから構成され
る。寸だ抵抗用の厚膜ペーストけ銀−パラジウムのかわ
りに酸化ルテニウムが使用され、他は、導体用ペースト
と略等しいもので構成されている。アルミナ基板1の上
にはチップコンデンサー4が半田6により厚膜導体層2
と接続されている。最近の電子機器の小型化の要求に伴
い、そこに使用される回路基板は小型化、高集積化の必
要性が高まっている。従って第1図に示す」:うな従来
の一般的な片面のみを利用する基板から第2図に示すよ
うなアルミナ基板1内のスルホール6に形成した厚膜導
体層23ペノ を用いて基板両面を有効に活用した両面厚膜回路が使わ
れるようになってきた。
Conventional structure and problems thereof FIG. 1 shows an example of a thick film circuit. The thick film paste printed on the alumina substrate 1 is dried and fired to form a thick film conductor layer 2. A thick film resistor 3 is formed. Thick film paste I for conductors is generally composed of silver-palladium alloy powder, glass frit, resin binder, organic solvent, etc. Ruthenium oxide is used in place of the silver-palladium thick film paste for the resistors, and the rest is made up of approximately the same paste as the conductor paste. A chip capacitor 4 is mounted on a thick film conductor layer 2 with solder 6 on an alumina substrate 1.
is connected to. With the recent demand for smaller electronic devices, there is an increasing need for circuit boards used there to be smaller and more highly integrated. Therefore, as shown in Fig. 1, from the conventional general board that uses only one side to the one shown in Fig. 2, a thick film conductor layer 23 formed in the through hole 6 in the alumina substrate 1 is used to cover both sides of the board. Effective use of double-sided thick film circuits has come into use.

従来の両面厚膜回路の製造工程に使用されるスクリーン
印刷機は、第3図に示す゛ように、板厚0.5++++
+1〜0.6箇のアルミナ基板1を基板固定用ステージ
10にセットし、銀−パラジウムペースト2をインク返
しで7で予じめスクリーン8上にひろげて1本のスキー
ジ9で、吸引口11より真空に引きながら基板上の導体
回路部13とスルホール6内に導電性ペースト2を塗布
する方法が一般に行なわれている。しかし、この方法で
はスクリーン全面にペーストがひろげてあり、スキージ
が下降したさいに吸引をはじめるとスクリーン全面が基
板に吸着されスクリーンのパターン部よりペーストが吸
引され乳剤12にペーストが付着しニジミを発生する場
合がある。特にスキージの刷り回、じめの位置に対し刷
り終り側のパターン部が吸引時間が長いためペーストの
ニジミ出す量が多く々リニジミの原因となっている。又
、ペーストのニジミ出す量を少なくするために吸引力を
小さくするとパターン部のニジミは減少傾向にあるがス
ルホール内にペーストが充分に塗着しない問題があった
。これは、第4図に示すように従来のスクリーン印刷で
は刷りはじめと刷り終りに於いで、吸引力が前者で最大
になり後者の方へ近づくにつれ、減少する1、つ捷り、
吸引力が印刷時に一定になっていないために、前述の問
題が発生17ていた。
The screen printing machine used in the conventional manufacturing process of double-sided thick film circuits has a board thickness of 0.5++++, as shown in Figure 3.
+1 to 0.6 alumina substrates 1 are set on the substrate fixing stage 10, and the silver-palladium paste 2 is spread on the screen 8 using an ink spatula 7, and the suction port 11 is spread with one squeegee 9. A method generally used is to apply the conductive paste 2 to the conductor circuit portion 13 and through holes 6 on the substrate while drawing a vacuum. However, in this method, the paste is spread over the entire surface of the screen, and when the squeegee starts suctioning while descending, the entire surface of the screen is attracted to the substrate and the paste is sucked from the patterned part of the screen, and the paste adheres to the emulsion 12, causing bleeding. There are cases where In particular, when the squeegee is printed, the suction time is longer for the pattern portion at the end of printing compared to the initial position, so the amount of paste that smudges out is large and causes smearing. Furthermore, if the suction force is reduced in order to reduce the amount of paste smearing out, the smearing in the pattern area tends to decrease, but there is a problem in that the paste is not sufficiently applied within the through-holes. As shown in Figure 4, in conventional screen printing, at the beginning and end of printing, the suction force is maximum at the former and decreases as it approaches the latter.
The above-mentioned problem occurs because the suction force is not constant during printing.

発明の目的 本発明は−に記欠点全解決し基板上の導体パターン部の
印刷とスルホール内部の導体塗布を同時に行ない導体パ
ターン部にニジミがなくスルホールの信頼性を高めるス
クリーン印刷機を提供することを目的とするものである
OBJECTS OF THE INVENTION It is an object of the present invention to provide a screen printing machine which solves all of the drawbacks mentioned in (-) and simultaneously prints a conductor pattern on a substrate and coats a conductor inside the through-hole, thereby eliminating smearing on the conductor pattern and increasing the reliability of the through-hole. The purpose is to

発明の構成 本発明は、基板を固定し、かつ基板の一方の向側から真
空吸引可能に設けられた基板固定用ステージと、基板の
他の面と当接可能で、導体用ペーストを載置可能なスク
リーンと、このスクリーン上の導体用ペーストをスクリ
ーンをi[fl Lで前記基板固定用ステージの真空吸
引により前記基板に塗6ペノ 布可能なスキージとを有したスクリーン印刷機であって
、前記スキージは、往復道可能で、かつ移動方向側に前
記導体用ペーストを有してなるよう構成され、印刷開始
から完了まで吸引圧が一定であり、印刷精度の良い基板
が得られる。
Structure of the Invention The present invention provides a stage for fixing a board, which is provided to fix a board and to be able to draw vacuum from one side of the board, and a stage which can come into contact with the other side of the board, and on which a conductor paste is placed. and a squeegee capable of applying conductor paste on the screen to the substrate by vacuum suction of the substrate fixing stage, The squeegee is configured to be able to move back and forth and to have the conductive paste on the moving direction side, and the suction pressure is constant from the start of printing to the completion of printing, so that a substrate with high printing accuracy can be obtained.

実施例の説明 以下、本発明の第一実施例を第6図にて説明する。基板
サイズ100Tn100Tn″×0.8t7で、直径が
0.6−のスルホール6を有するアルミナ基板1を基板
固定用ステージ1゜にセットし吸引口11より真空ポン
プで吸引しながらスキージの一方の面9aをスキージダ
ウンストップ0.5 mで銀−パラジウムペーストをス
クリーンを保持する取付枠14に取付けられた360メ
ツシユのステンレス製スクリーン8上を5 ayn、 
7秒のスピードでスクリーン印刷を行ない印刷完了後ス
キージ9を」二昇させペースト2上をスキージの他方の
面9bで印刷可能な位置まで6ペ/ 移動し、印刷された基板を排出し第6図に示すように新
たなアルミナ基板1′を往路印刷時と同様に基板固定用
ステージ10にセットし往路印刷で使用された銀−パラ
ジウムペースト2をスキージ9の他方の面9bで往路印
刷と同様にスクリーン印刷を行斤い、往路印刷完了後と
同様にスキージ9を上昇しペースト2」二をスキージ9
aの面で印刷可能な位置丑で移動し基板制用を行なった
0 その結果第4図のように本発明によるスクリーン印刷で
は予じめスクリーンにペーストをひろばていないため吸
引圧が一定であるため、往路と復路に於いて全く同じ印
刷状態でありニジミもなくスルホール歩留り100%の
良品が得られた。
DESCRIPTION OF EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIG. An alumina substrate 1 with a substrate size of 100Tn100Tn'' x 0.8t7 and a through hole 6 with a diameter of 0.6- is set on the substrate fixing stage 1°, and while suctioning with a vacuum pump from the suction port 11 is applied to one side 9a of the squeegee. Apply silver-palladium paste with a squeegee down stop 0.5 m over the 360 mesh stainless steel screen 8 attached to the mounting frame 14 holding the screen,
Screen printing is performed at a speed of 7 seconds, and after printing is completed, the squeegee 9 is raised 2" and the other side 9b of the squeegee is moved over the paste 2 to a position where it can be printed for 6 pages, and the printed substrate is ejected. As shown in the figure, a new alumina substrate 1' is set on the substrate fixing stage 10 in the same way as in the outward printing, and the silver-palladium paste 2 used in the outward printing is applied to the other side 9b of the squeegee 9 in the same way as in the outward printing. Perform screen printing on the screen, and raise the squeegee 9 in the same way as after completing the outward printing, and remove the paste 2" from the squeegee 9.
As a result, as shown in Figure 4, in screen printing according to the present invention, the suction pressure is constant because the paste is not spread on the screen in advance. Therefore, the printing conditions were exactly the same on the outward and return passes, and a good product with no bleeding and a through-hole yield of 100% was obtained.

次に、本発明の第二実施例を第7図にて説明する。第一
実施例と同様の基板サイズで直径が0.6−のスルホー
ル6を有するアルミナ基板1を基板固定用ステージ1o
にセットし吸引口11より真空ポンプで吸引1〜ながら
乎スキージ9の角度を7ペノ 基板より7o度にし、銀−パラジウムペースト2を36
0メ・ンシュのステンレス製スクリーン8を用いて基板
上導体回路部13とスルホール内部6にスクリーン印刷
を行ない、その後半スキージ9を上昇させペースト2上
を平スキージ9の他方の而9bで印刷可能な位Itで移
動し、平スキージ9bの面が基板より70度になるよう
に角度をかえ、印刷された基板を排出し第8図に示すよ
うに新たなアルミナ基板1′を往路印刷時と同様に基板
固定用ステージ10にセットし往路印刷で使用された銀
−パラジウムペースト2をスキージ9の9b面で往路印
刷と同様にスクリーン印刷を行なった結果、第一実施例
と同じ印刷結果が得られた。
Next, a second embodiment of the present invention will be explained with reference to FIG. An alumina substrate 1 having a through hole 6 with a diameter of 0.6 mm and the same substrate size as in the first embodiment is mounted on a stage 1o for fixing the substrate.
Set the silver-palladium paste 2 to 36 degrees by setting the angle of the squeegee 9 to 7 degrees from the 7 pen board while suctioning from the vacuum pump through the suction port 11.
Screen printing is performed on the conductor circuit section 13 on the board and the inside of the through hole 6 using a 0-mesh stainless steel screen 8, and in the latter half, the squeegee 9 is raised and printing on the paste 2 is possible with the other side 9b of the flat squeegee 9. The angle of the flat squeegee 9b is changed so that the surface of the flat squeegee 9b is 70 degrees from the substrate, the printed substrate is ejected, and a new alumina substrate 1' is placed on a new alumina substrate 1' as shown in FIG. Similarly, the silver-palladium paste 2, which was set on the substrate fixing stage 10 and used in the forward printing, was screen printed on the 9b side of the squeegee 9 in the same manner as the forward printing. As a result, the same printing result as in the first example was obtained. It was done.

なお、スキージ角度は本発明のポイントではなく基板面
から30度から90度まで可変になっており70度に限
定するものではない。
Note that the squeegee angle is not a key point of the present invention, and is variable from 30 degrees to 90 degrees from the substrate surface, and is not limited to 70 degrees.

発明の効果 以上のように、本発明によれば従来のスクリーン印刷機
のようにインク返しで予じめスクリーンにペーストをひ
ろげないため印刷開始から印刷完了まで吸引圧が一定に
なるため極めて印刷精度の良い基板が得られる。又、従
来はスキージの1往復で1回の印刷であったのが本発明
では往路と復路で2回の印刷が可能であるため生産性向
上が図れるものである。
Effects of the Invention As described above, according to the present invention, unlike conventional screen printing machines, the paste is not spread on the screen by ink return in advance, and the suction pressure remains constant from the start of printing to the completion of printing, resulting in extremely high printing accuracy. A good substrate can be obtained. Furthermore, whereas in the past, printing was performed once in one reciprocation of the squeegee, in the present invention, printing can be performed twice in the forward and backward passes, thereby improving productivity.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は厚膜回路の一例を示す断面図、第2図は基板両
面を用いた厚膜回路を示す断面図、第3図は従来法のス
クリーン印刷機の断面図、第4図は従来のスクリーン印
刷機と本発明のスクリーン印刷機にJ:るスキージ位置
と真空吸引力の関係を示した図、第5図は本発明の第1
実施例を実施する装置の往路印刷時の断面図、第6図は
復路印刷時の同断面図、第7図は本発明の第2実施例を
実施する装置の往路印刷時の断面図、第8図は復路印刷
時の同断面図である。 1・・・・・・アルミナ基板 1/、旧・・新たなアル
ミナ基板、2・・・・・・銀−パラジウムペースト、7
・川・・インク返し、8・・・・・・スクリーン、9・
川・・スキージ、1o・・・・・・基板固定用ステージ
、11・川・・吸引口、9() 13・・・・・・導体回路部、14・・印・取付枠。 代理人の氏名 弁理士 中 尾 敏 男 はが1名綜 
− 第4図 の ス〒−ジ゛イit → 第581 第6図
Fig. 1 is a cross-sectional view showing an example of a thick film circuit, Fig. 2 is a cross-sectional view showing a thick film circuit using both sides of a substrate, Fig. 3 is a cross-sectional view of a conventional screen printing machine, and Fig. 4 is a conventional screen printing machine. Figure 5 is a diagram showing the relationship between the squeegee position and the vacuum suction force in the screen printing machine of the present invention and the screen printing machine of the present invention.
FIG. 6 is a sectional view of the apparatus for carrying out the embodiment during forward printing; FIG. 7 is a sectional view of the apparatus for carrying out the second embodiment of the present invention during outward printing; FIG. FIG. 8 is a cross-sectional view of the same during backward printing. 1...Alumina substrate 1/, old...new alumina substrate, 2...Silver-palladium paste, 7
・River...Ink return, 8...Screen, 9.
River: squeegee, 1o: board fixing stage, 11: river: suction port, 9 () 13: conductor circuit section, 14: mark: mounting frame. Name of agent: Patent attorney Toshio Nakao (1 person)
- Figure 4 swipe → 581 Figure 6

Claims (1)

【特許請求の範囲】[Claims] (1) 基板を固定し、かつ基板の一方の面側から真空
吸引可能に設けられた基板固定用ステージと、基板の他
の面と当接可能で、導体用ペーストを載置可能なスクリ
ーンと、このスクリーン上の導体用ペーストをスクリー
ンを通して前記基板固定用ステージの真空吸引により前
記基板に塗布可能なスキージとを有したスクリーン印刷
機であって、前記スキージは、往復道可能でかつ移動方
向側に前記導体用ペーストを有してなるよう構成された
スクリーン印刷機。 (≧ スキージは、一方向に移動後、上昇してさらに同
方向に所定量移動し、次に下降して逆方向に移動するよ
う 設けられた特許請求の範囲第1項記載のスクリーン
印刷機。
(1) A board fixing stage that fixes the board and is capable of vacuum suction from one side of the board, and a screen that can come into contact with the other side of the board and on which conductive paste can be placed. , a screen printing machine comprising a squeegee capable of applying conductive paste on the screen to the substrate by vacuum suction of the substrate fixing stage through the screen, the squeegee being capable of reciprocating movement and facing the direction of movement; A screen printing machine configured to include the conductor paste. (≧ The screen printing machine according to claim 1, wherein the squeegee is provided so that after moving in one direction, the squeegee is moved up, further moved in the same direction by a predetermined amount, and then lowered and moved in the opposite direction.
JP7112684A 1984-04-10 1984-04-10 Screen printing machine Pending JPS60214591A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7112684A JPS60214591A (en) 1984-04-10 1984-04-10 Screen printing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7112684A JPS60214591A (en) 1984-04-10 1984-04-10 Screen printing machine

Publications (1)

Publication Number Publication Date
JPS60214591A true JPS60214591A (en) 1985-10-26

Family

ID=13451560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7112684A Pending JPS60214591A (en) 1984-04-10 1984-04-10 Screen printing machine

Country Status (1)

Country Link
JP (1) JPS60214591A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289994A (en) * 1987-05-22 1988-11-28 Matsushita Electric Ind Co Ltd Manufacture of printed multilayer interconnection substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289994A (en) * 1987-05-22 1988-11-28 Matsushita Electric Ind Co Ltd Manufacture of printed multilayer interconnection substrate

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