JPS61121304A - Apparatus for forming thick film resistor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for manufacturing a thick film circuit that can be used in radio receivers, television receivers, and measuring instruments.

Conventional structure and problems Conventionally, thick film circuits have been manufactured by forming conductor paste, resistor paste, etc. onto a substrate into the desired shape using screen printing, and then drying and baking. .

However, since the screen printing method uses a mask pattern, it takes time to replace the mask pattern and to clean the mask pattern and the squeegee, making it unsuitable for small-lot production or when there are many product changes.

In response, a method has been devised and proposed in which the paste is directly extruded from a nozzle without using a mask pattern, and the paste is drawn on a moving substrate.・This method is superior to that 19, and may be effective for the above-mentioned problem. However, since actual substrates have "warpage" or "twisting", there is a problem in that the film thickness and line width of the thick film paste formed on the substrate are not constant. In order to solve these problems, a method has been proposed in which the drawing nozzle 1 is equipped with a touch piece 12 as shown in FIG. In this method, when a resistor is formed between the electrodes 16 as shown in Fig. 2, there is a step in the electrode 15 and the contact piece is in front of the discharge hole = 9, so when the contact piece rides on the electrode, there is a constriction. This had the disadvantage that resistance value accuracy was poor and clear drawing was not possible.

OBJECTS OF THE INVENTION The present invention eliminates the above-mentioned drawbacks of the prior art and provides an excellent device capable of accurately drawing thick film resistors.

Structure of the Invention In order to eliminate the above-mentioned conventional drawbacks, the present invention has a thick film paste discharge hole at the tip of the nozzle and a touch piece for keeping the distance between the substrate and the discharge hole constant, and the touch piece is It is a device for forming a thick film resistor adjacent to the discharge hole, and the contact piece is installed at a position substantially perpendicular to the direction of relative movement of the nozzle during drawing with respect to the discharge hole, and the step formed by the electrode is When drawing a certain part, the touch piece and the discharge hole have the effect of descending and climbing at the same time, so that constriction does not occur and it is possible to draw with high precision.

DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described based on FIGS. 3 and 4. FIG. The drawing nozzle 1 is fixed to a nozzle elevating section 2, and is further connected to an X-axis layer moving section 4 via a Y-axis moving section 3 of an X-Y drive device.
is fixed. In order to discharge the thick film paste 5, the drawing nozzle 1 is pressurized by air pressure, and the electromagnetic valve 6 controls pressurization and depressurization by the air pressure. The substrate 7 is vacuum-adsorbed by a substrate fixing table 8 that can be moved up and down, and a solenoid coil 9 generates a pressing force to the nozzle. Reference numeral 10 has a built-in microprocessor and controls the movement of the nozzle 1, the opening/closing of the electromagnetic valve 6, and the vertical movement of the substrate fixing table 8 by means of a control device. A discharge hole 11 for discharging the thick film paste 6 is provided at the tip of the nozzle 1, and a rectangular diamond tip 12 is adhered thereto. The diamond tip 12 is a contact piece for keeping the distance between the tip of the discharge hole 11 and the substrate edge constant, and a J rainbow contact piece is formed on the diamond tip 12 beside the discharge hole 11 with respect to the drawing direction.

Now, in order to draw a thick film circuit on the substrate 7, the nozzle 1 is lowered so that the diamond tip 12 touches the substrate 7, and then at least one of the X-axis laminated moving part 4 or the Y-axis moving part 3 is act and move the nozzle. At this time, the electromagnetic valve 6 is opened at a preset timing to pressurize the inside of the nozzle 1 with air pressure so that the thick film paste 5 is simultaneously discharged and the drawing circuit 14 is formed. Next, the electromagnetic valve 6 is closed to stop discharging the thick film paste 5, and at about the same time the nozzle 1 is raised to a desired length. Note that the force with which the substrate fixing table 8 is pressed against the diamond tip 7'i2 is adjusted by the electric power applied to the solenoid coil 9, and is set to about 501 in the embodiment. Further, the diamond tip 12, which is a part of the contact piece, is inserted into the fixing hole at the tip of the nozzle and is further glued, so that it is firmly fixed.

FIG. 6 shows a plan view of the F thick film resistor drawn in this example. Note that ruby, tungsten carbide, or the like may be used in the portion where the diamond tip is used in the embodiment.

As described in detail, according to the present invention, since the contact piece is always moving at the same time as the discharge hole, a constant film thickness can be obtained even when drawing the part where the step of the electrode is covered. Accurate thick film resistor can be obtained.

[Brief explanation of drawings]

Fig. 1 shows the cross-sectional opening of a conventional drawing nozzle, Fig. 2 shows a plan view when a 9 thick film resistor is drawn using the conventional method, and Fig. 3 shows the formation of a thick film resistor in an embodiment of the present invention. front view of the device,
FIG. 4 is a plan view of a nozzle in one embodiment of the present invention, and FIG. 5 is a plan view when a thick film resistor is drawn. 1... Nozzle, 5... Thick film paste,
7-...Substrate, 11...Discharge hole, 12...
...Diamond chip, 14...Thick film resistor, 16...Electrode. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure f2 Figure 2 = Zu〉 ■Ring = #shi 1 direction

Claims (1)

[Claims] The tip of the nozzle is equipped with a thick film paste discharge hole and a touch piece that can maintain a constant distance between the substrate and the discharge hole, and the touch piece is arranged in a direction in which the nozzle moves relative to the discharge hole during drawing. A device for forming a thick film resistor provided in a substantially vertical position.