JPS59181695A - Method of forming through hole conductor of circuit board - Google Patents
Method of forming through hole conductor of circuit boardInfo
- Publication number
- JPS59181695A JPS59181695A JP5611483A JP5611483A JPS59181695A JP S59181695 A JPS59181695 A JP S59181695A JP 5611483 A JP5611483 A JP 5611483A JP 5611483 A JP5611483 A JP 5611483A JP S59181695 A JPS59181695 A JP S59181695A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- diameter
- forming
- green sheet
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔従来技術と発明の目的〕本発明はセラミックグリーン
シートに設り−たスルホールに４体を形成する方法に関
するものである。配線基板の小型化、高密度化に伴い、
両面配線、多層配線か行なわねるようになり、配線基板
にスルホールを設け、該スルホールに導体を形成するこ
とか必要になっている。従来の導体形成法は銀、パラジ
ウム、白金あるいはとね−らの合金等の２ｎ篭住金属の
粉末と有機バインダーとよりなる導電ペーストを金属マ
スクを介してスクリーン印刷法によシスクリーンメソシ
ュを通してスキージゴムによって充填する方法が行なわ
れていた。DETAILED DESCRIPTION OF THE INVENTION [Prior Art and Objects of the Invention] The present invention relates to a method for forming four bodies in through holes provided in a ceramic green sheet. With the miniaturization and higher density of wiring boards,
Double-sided wiring and multilayer wiring have become impossible, and it has become necessary to provide through holes in the wiring board and form conductors in the through holes. The conventional method for forming a conductor is to apply a conductive paste consisting of powder of a 2N metal such as silver, palladium, platinum, or an alloy of silver and an organic binder through a screen printing method through a metal mask. A filling method using squeegee rubber was used.
この方法は導電ペーストをスルホールに十分に充填する
ためにグリーンシートの裏ｎｌｊから真空服引を行なう
か、あるいはグリーンシートを裏返しにして裏側面から
再度、同様々印刷工程を繰返して行なう必要がある。In this method, in order to sufficiently fill the through-holes with conductive paste, it is necessary to perform vacuuming from the back side of the green sheet, or to turn the green sheet over and repeat the printing process again from the back side. .
ところで真空吸引をするとグリーンシートの支持台に導
電性ペーストが付着するので、１回の印刷毎にふき取る
作業を必要とすることや、４電性ペースト中の溶剤が除
々に蒸促して粘度が高く々シ、均一な充填が行なわれな
い々どの問題があり、また、裏返し２回印刷の場合は設
備や作業工程がふえ、かつ表裏両面〃・らの印刷を均等
に行なうことは困難であるなどの問題がある。本発明は
上記のような問題、のない配線基板のスルホール導体形
成法を提供することを目的とするものである。By the way, when vacuum suction is applied, the conductive paste adheres to the support base of the green sheet, which requires wiping off after each printing, and the solvent in the 4-conductor paste gradually evaporates, resulting in a high viscosity. However, there are problems such as not being able to fill the product uniformly.Furthermore, printing twice inside out requires more equipment and work steps, and it is difficult to print evenly on both the front and back sides. There is a problem. An object of the present invention is to provide a method for forming through-hole conductors on a wiring board that does not have the above-mentioned problems.
〔発明の栴成〕本発明はセラミックグリーンシートに設
ケたスルホールの直径よシも大きい貫通孔を有する金属
マスクを前記セラミツフグ人
リーンシート上に配置し、前記スル怜−ルの直径よシも
大きく、前記金属マスクの貫通孔の直径よりも小さいは
径の導電性金属粉末と樹脂とよりなる球状乾式の塗着導
体を前記金属マスクを介して前記スルホールに充填した
後、これを加熱硬化して導体を形成することを肋依とづ
−る配線基板のスルホール導体形成法である。[Development of the Invention] The present invention provides a metal mask having a through hole which is larger in diameter than the through holes provided in the ceramic green sheet, and is arranged on the ceramic green sheet, and A spherical dry-applied conductor made of conductive metal powder and resin having a diameter smaller than the diameter of the through-hole of the metal mask is filled into the through-hole through the metal mask, and then heated and cured. This is a method for forming through-hole conductors on wiring boards, which relies on forming conductors through holes.
本発明の方法を図面によって説明する。１はセラミック
グリーンシートよシなる配線基板、２はと１に設けたス
ルホール、６は金属マスク、４はその貫通孔、５は導電
性金属粉末と接凋性欄脂とよシなる球状乾式の塗着導体
である。金属マスク３は塗着導体５をスルホール２のみ
に充填するのか目的であって、その貫通孔４の直径ａは
塗着導体５の′ｒ１′−１径すおよびスルホールの直径
Ｃよシも大きく、゛また塗着導体５の直径すはスルホー
ルの直径Ｃよシも大キく、ａ ） ｂ ）Ｃである。し
たがりて塗着導体５はし１示してないスキージゴムによ
り金属マスク乙の貫通孔４を通過してスルボール２に充
填され、加熱硬化することによって導ｐドロが形成さｉ
Ｌる。The method of the present invention will be explained with reference to the drawings. 1 is a wiring board made of a ceramic green sheet, 2 is a through hole provided in the dot 1, 6 is a metal mask, 4 is the through hole, and 5 is a spherical dry type made of conductive metal powder and adhesive ballast. It is a coated conductor. The purpose of the metal mask 3 is to fill only the through holes 2 with the coated conductor 5, and the diameter a of the through hole 4 is larger than the 'r1'-1 diameter of the coated conductor 5 and the diameter C of the through hole. , ``Also, the diameter of the coated conductor 5 is larger than the diameter C of the through hole, a) b) C. Therefore, the coated conductor 5 passes through the through hole 4 of the metal mask B using a squeegee rubber (not shown) and is filled into the through ball 2, and is heated and hardened to form a conductive puddle.
L.
〔実施例〕板厚０８鵠のアルミナセラミックグリ−？シ
ート１に０５調ψのスルホール２を設り、厚さ０．１
ｍ＋ｎのステンレス板にエツチングによＦ） （Ｉｌ、
７ ｆｆ１ｍψの貫通孔４を設はプζ金λ・Ｍマスク
３を配置した。このとき、グリーンシート１と金嬉マス
ク３との間に１１１１＋ＩＩの１１ｉ］隙をおいて貫通
孔４とスルホール２との位置合せをした。塗着導体５は
溶湯噴霧法でえた粒径０５酬のノ（ラジウムを下記の樹
脂に下記の割合で分散させ、これを２本のロール（キャ
ンプ０．５て）で混合した後粉砕し、ふるいてかけて′
９．度を拮・シえ、［］、５５〜０．６５ ＋＋＋ｍの
球状に成形した。[Example] Alumina ceramic green with plate thickness 08? A through hole 2 of 05 tone ψ is provided on the sheet 1, and the thickness is 0.1
By etching on a stainless steel plate of m+n F) (Il,
A through hole 4 of 7ff1 mψ was formed and a gold λ/M mask 3 was placed thereon. At this time, a gap 1111+II 11i] was left between the green sheet 1 and the Kinki mask 3, and the through holes 4 and through holes 2 were aligned. The coated conductor 5 was prepared by dispersing radium with a particle diameter of 05 (radium) in the resin shown below in the proportion shown below, which was obtained by a molten metal spraying method, and then mixing the mixture with two rolls (Camp 0.5) and pulverizing it. Sift and sprinkle
9. It was molded into a spherical shape with a diameter of 55 to 0.65 +++ m.
オリエステル樹脂 １００重量部υｊ化剤（ＰＭ
ＤＡ） ６．５７９存尚・。Oleester resin 100 parts by weight υj-forming agent (PM
DA) 6.579 living.
パラジウム粉 ７２５ ＃
この球状の塗着冶・イ４５を金属マスク乙の上にのせ、
スクリーンｌユ」刷のτり領でスキージゴムによシかき
とってスルポール２に充填し／こ後、１８０℃で２０分
間加熱し２て校ｊ脂を（＋１．’ （ヒさぜたところ′
；ｊＡ６図に示すような完全な状態のスルポーノＶ導体
６がえら７した３゜
〔発明の効果〕本発明においてｔ−Ｓ坪状乾式の塗着導
体５を使用するため、金Ｊ［マスクを介してスルホール
に容易に充填することがてさ、しかも加熱によって塗着
導体５が軟化して流動性を生じ、スルホール全体に均一
に塗治される。Palladium powder 725 # Place this spherical coating tool A45 on the metal mask B,
Scrape it off with a rubber squeegee and fill it into Sulpol 2 with a rubber squeegee. After that, heat it at 180℃ for 20 minutes and add proofing fat (+1.'
; j A6 The complete Sulpono V conductor 6 has gills 7 at 3゜. The coated conductor 5 is softened by heating and becomes fluid, so that the coated conductor 5 can be uniformly filled in the entire through hole.
そして従来の導体ペーストを印刷する場１合のようにシ
ートを汚損することもなく、ま／ＣＳ真空吸引などの必
彼もない、さらに、微細なスルホールに導体を形成する
場合は塗着導体５を形成する金属粉末をふるいによって
分級さ１１プＣもののうちから細かいものを択べ（はよ
いから大小各種のスルホールに対応することができるな
ど、いくたの丁ぐれた効果を有する。Unlike conventional conductor paste printing, there is no need to stain the sheet, and there is no need for CS vacuum suction.Furthermore, when forming conductors in minute through-holes, the coated conductor paste The metal powder that forms the metal powder is sieved and selected from among the 11 types.
第１図二本究明におけるセラミックグリーンシート、金
属マスクおよび塗着導体を示
す図
第２図：スルホール導体形成前の状態′？ｆ：下す同第
６圓二本発明の方法で形成さｆた２１１月、−／し導体
を示す図
１・・・セラミックグリーンシート、２・・・スルホー
ル、６・・・金属マスク、４・・負通孔、５・・・塗着
導体、６・・・スルホール導体Figure 1: A diagram showing the ceramic green sheet, metal mask, and coated conductor in the second investigation Figure 2: State before formation of through-hole conductors'? 1. Ceramic green sheet, 2. Through hole, 6. Metal mask, 4.・Negative through hole, 5...Painted conductor, 6...Through hole conductor
Claims (1)
シも大きい貫通孔を有する貧属マスクを前記セラミック
グリーンシート上に配置し、前記スルホールの直径よシ
も大きく、前記金属マスクの貫通孔の直径よりも小さい
は径の導電性金属粉末と（÷ｊ脂とよりなる球状乾式の
檜沿導体を前記金籾マスクを介して前記スルホールに充
填しプ辷後、これを加熱硬化して導体を形成することを
特徴とする配線基板のスルホール導体−形成法A thin metal mask having a through hole larger in diameter than the through hole provided in the ceramic green sheet is placed on the ceramic green sheet, and the diameter of the through hole is also larger and smaller than the diameter of the through hole in the metal mask. A spherical dry cypress conductor made of conductive metal powder with a diameter of Features: Through-hole conductor formation method for wiring boards
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5611483A JPS59181695A (en) | 1983-03-31 | 1983-03-31 | Method of forming through hole conductor of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5611483A JPS59181695A (en) | 1983-03-31 | 1983-03-31 | Method of forming through hole conductor of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59181695A true JPS59181695A (en) | 1984-10-16 |
Family
ID=13018047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5611483A Pending JPS59181695A (en) | 1983-03-31 | 1983-03-31 | Method of forming through hole conductor of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59181695A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027504A (en) * | 2005-07-19 | 2007-02-01 | Sony Corp | Multilevel wiring board, and method and apparatus for manufacturing the same |
| JP2007201204A (en) * | 2006-01-26 | 2007-08-09 | Sony Corp | Multilayered wiring board, and manufacturing method and device thereof |
-
1983
- 1983-03-31 JP JP5611483A patent/JPS59181695A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027504A (en) * | 2005-07-19 | 2007-02-01 | Sony Corp | Multilevel wiring board, and method and apparatus for manufacturing the same |
| JP2007201204A (en) * | 2006-01-26 | 2007-08-09 | Sony Corp | Multilayered wiring board, and manufacturing method and device thereof |
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