JPS6042757U - hybrid circuit module - Google Patents
hybrid circuit moduleInfo
- Publication number
- JPS6042757U JPS6042757U JP13574983U JP13574983U JPS6042757U JP S6042757 U JPS6042757 U JP S6042757U JP 13574983 U JP13574983 U JP 13574983U JP 13574983 U JP13574983 U JP 13574983U JP S6042757 U JPS6042757 U JP S6042757U
- Authority
- JP
- Japan
- Prior art keywords
- circuit module
- hybrid circuit
- board
- hole
- leadless chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図はそれぞれ従来のハイブリッド回路モジ
ュールの第１、第２の例を示す断面図、第３図ａ、 ｂ
は本考案のハイブリッド回路モジュールの一実施例を示
す断面図、Ａ−Ａ断面図および第４図は本考案のハイブ
リッド回路モジュールに用いられる基板の一構成例を示
す斜視図である。
図において、１・・・・・・リードレスチップキャリア
、２・・・・・・基板、３・・・・・・はんだ付は部、
４・聞・水または溶剤、５・・・・・・半導体チップ、
６・・・・・・貫通穴、７・・・・・・はんだ付は用パ
ッド、８・・・・・・蓋。Figures 1 and 2 are cross-sectional views showing first and second examples of conventional hybrid circuit modules, respectively, and Figures 3a and 3b are
FIG. 4 is a cross-sectional view showing an embodiment of the hybrid circuit module of the present invention, a cross-sectional view taken along line A-A, and FIG. In the figure, 1...leadless chip carrier, 2...board, 3...soldering part,
4. Water or solvent, 5. Semiconductor chip,
6...Through hole, 7...Soldering pad, 8...Lid.
Claims (1)
スチップキャリアのいずれかを実装してなるハイブリッ
ド回路モジュールにおいて、前記基板の前記実装品の下
方位置に少なくとも１つのｉ 貫通穴を設け、前記
実装品の下部の洗浄を行うための水および溶剤のいずれ
かを前記貫通穴を通して前記基板と実装品との間隙に送
るようになすことを特徴とするハイブリッド回路モジュ
ール。In a hybrid circuit module in which at least one of a leadless chip component and a leadless chip carrier is mounted on a board, at least one through hole is provided in a position below the mounted product on the board, and A hybrid circuit module characterized in that either water or a solvent for cleaning is sent through the through hole into a gap between the board and the mounted product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13574983U JPS6042757U (en) | 1983-09-01 | 1983-09-01 | hybrid circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13574983U JPS6042757U (en) | 1983-09-01 | 1983-09-01 | hybrid circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6042757U true JPS6042757U (en) | 1985-03-26 |
Family
ID=30305445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13574983U Pending JPS6042757U (en) | 1983-09-01 | 1983-09-01 | hybrid circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6042757U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0292938U (en) * | 1989-01-12 | 1990-07-24 |
-
1983
- 1983-09-01 JP JP13574983U patent/JPS6042757U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0292938U (en) * | 1989-01-12 | 1990-07-24 |
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