JPS58142943U - Module with leadless package - Google Patents

Module with leadless package

Info

Publication number
JPS58142943U
JPS58142943U JP3789082U JP3789082U JPS58142943U JP S58142943 U JPS58142943 U JP S58142943U JP 3789082 U JP3789082 U JP 3789082U JP 3789082 U JP3789082 U JP 3789082U JP S58142943 U JPS58142943 U JP S58142943U
Authority
JP
Japan
Prior art keywords
leadless package
module
package
circuit board
leadless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3789082U
Other languages
Japanese (ja)
Inventor
宇佐美　和男
健之 鈴木
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP3789082U priority Critical patent/JPS58142943U/en
Publication of JPS58142943U publication Critical patent/JPS58142943U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案を用いた一実施例の斜視図、第２図、第
３図は本考案の一実施例であるリードレースパッケージ
、セラミック基板の断面図、第４図は本考案の実装状態
を説明する手順図である。 １・・・セラミック基板、２・・・リードレスパッケー
ジ、３・・・位置合わせ用凸部、４・・・位置合わせ両
凹部、５・・・キャップ、６・・・パッケージベース、
７・・・リードレスパッケージ側パレド、８．・・・セ
ラミック基板側パッド、９・・・半田。Fig. 1 is a perspective view of an embodiment using the present invention, Figs. 2 and 3 are cross-sectional views of a lead race package and ceramic substrate as an embodiment of the present invention, and Fig. 4 is an implementation of the present invention. It is a procedure diagram explaining a state. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 2... Leadless package, 3... Convex part for alignment, 4... Both recessed parts for alignment, 5... Cap, 6... Package base,
7... Leadless package side paredo, 8. ... Ceramic board side pad, 9... Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 位置合わせ用凸部を持つ回路基板と、同じく凹部を持つ
り一ルスパッケージｊりなるものにおいて、実装時、位
置合わせを容易に行なえ、それ”　と同時に、リードレ
スパッケージと回路基板との間に洗浄可能なギャップを
設けたことを特徴とする、リードレスパッケージ搭載モ
ジュール。When mounting a circuit board with a protrusion for positioning and a leadless package that also has a recess, alignment can be easily performed, and at the same time, there is no space between the leadless package and the circuit board. A module equipped with a leadless package that features a washable gap.
JP3789082U 1982-03-19 1982-03-19 Module with leadless package Pending JPS58142943U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3789082U JPS58142943U (en) 1982-03-19 1982-03-19 Module with leadless package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3789082U JPS58142943U (en) 1982-03-19 1982-03-19 Module with leadless package

Publications (1)

Publication Number Publication Date
JPS58142943U true JPS58142943U (en) 1983-09-27

Family

ID=30049257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3789082U Pending JPS58142943U (en) 1982-03-19 1982-03-19 Module with leadless package

Country Status (1)

Country Link
JP (1) JPS58142943U (en)

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