JPS6037287A - ビ−ム移動型レ−ザ加工装置 - Google Patents

ビ−ム移動型レ−ザ加工装置

Info

Publication number
JPS6037287A
JPS6037287A JP58145175A JP14517583A JPS6037287A JP S6037287 A JPS6037287 A JP S6037287A JP 58145175 A JP58145175 A JP 58145175A JP 14517583 A JP14517583 A JP 14517583A JP S6037287 A JPS6037287 A JP S6037287A
Authority
JP
Japan
Prior art keywords
laser
moving
laser beam
laser processing
optical element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58145175A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0339796B2 (en:Method
Inventor
Eikichi Hayashi
林　栄吉
Masayuki Matsunaga
松永　正征
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58145175A priority Critical patent/JPS6037287A/ja
Publication of JPS6037287A publication Critical patent/JPS6037287A/ja
Publication of JPH0339796B2 publication Critical patent/JPH0339796B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP58145175A 1983-08-09 1983-08-09 ビ−ム移動型レ−ザ加工装置 Granted JPS6037287A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58145175A JPS6037287A (ja) 1983-08-09 1983-08-09 ビ−ム移動型レ−ザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58145175A JPS6037287A (ja) 1983-08-09 1983-08-09 ビ−ム移動型レ−ザ加工装置

Publications (2)

Publication Number Publication Date
JPS6037287A true JPS6037287A (ja) 1985-02-26
JPH0339796B2 JPH0339796B2 (en:Method) 1991-06-14

Family

ID=15379164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58145175A Granted JPS6037287A (ja) 1983-08-09 1983-08-09 ビ−ム移動型レ−ザ加工装置

Country Status (1)

Country Link
JP (1) JPS6037287A (en:Method)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6487094A (en) * 1987-09-30 1989-03-31 Matsushita Electric Industrial Co Ltd Laser beam machine
JPH03161188A (ja) * 1989-11-16 1991-07-11 Matsushita Electric Ind Co Ltd レーザ加工装置
JPH04200990A (ja) * 1990-11-30 1992-07-21 Fanuc Ltd 光路移動型レーザ切断機
JPH0530810U (ja) * 1989-10-20 1993-04-23 ヒユーズ・エアクラフト・カンパニー 光フアイバスプライス装置
DE102010004084A1 (de) * 2010-01-06 2011-07-07 Held Systems Ag Laserbearbeitungsvorrichtung für groß dimensionierte Bauteile
JP5203506B2 (ja) * 2009-11-05 2013-06-05 日本オートマチックマシン株式会社 電線の絶縁被覆をレーザー光で切断する方法および装置
JP2016147293A (ja) * 2015-02-13 2016-08-18 株式会社アマダミヤチ レーザ加工装置および出射ユニット

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118881A (en) * 1981-01-16 1982-07-23 Nec Corp Laser scanning device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118881A (en) * 1981-01-16 1982-07-23 Nec Corp Laser scanning device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6487094A (en) * 1987-09-30 1989-03-31 Matsushita Electric Industrial Co Ltd Laser beam machine
JPH0530810U (ja) * 1989-10-20 1993-04-23 ヒユーズ・エアクラフト・カンパニー 光フアイバスプライス装置
JPH03161188A (ja) * 1989-11-16 1991-07-11 Matsushita Electric Ind Co Ltd レーザ加工装置
JPH04200990A (ja) * 1990-11-30 1992-07-21 Fanuc Ltd 光路移動型レーザ切断機
JP5203506B2 (ja) * 2009-11-05 2013-06-05 日本オートマチックマシン株式会社 電線の絶縁被覆をレーザー光で切断する方法および装置
DE102010004084A1 (de) * 2010-01-06 2011-07-07 Held Systems Ag Laserbearbeitungsvorrichtung für groß dimensionierte Bauteile
DE102010004084B4 (de) 2010-01-06 2023-08-03 Gunnar Held Laserbearbeitungsvorrichtung für groß dimensionierte Bauteile
JP2016147293A (ja) * 2015-02-13 2016-08-18 株式会社アマダミヤチ レーザ加工装置および出射ユニット

Also Published As

Publication number Publication date
JPH0339796B2 (en:Method) 1991-06-14

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