JPS6035429B2 - スパツタリング装置 - Google Patents
スパツタリング装置Info
- Publication number
- JPS6035429B2 JPS6035429B2 JP51125438A JP12543876A JPS6035429B2 JP S6035429 B2 JPS6035429 B2 JP S6035429B2 JP 51125438 A JP51125438 A JP 51125438A JP 12543876 A JP12543876 A JP 12543876A JP S6035429 B2 JPS6035429 B2 JP S6035429B2
- Authority
- JP
- Japan
- Prior art keywords
- drum
- anode
- cover
- voltage
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3438—Electrodes other than cathode
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Electrostatic Spraying Apparatus (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US641481 | 1975-12-17 | ||
US05/641,481 US4014779A (en) | 1974-11-01 | 1975-12-17 | Sputtering apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5275669A JPS5275669A (en) | 1977-06-24 |
JPS6035429B2 true JPS6035429B2 (ja) | 1985-08-14 |
Family
ID=24572585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51125438A Expired JPS6035429B2 (ja) | 1975-12-17 | 1976-10-19 | スパツタリング装置 |
Country Status (17)
Country | Link |
---|---|
JP (1) | JPS6035429B2 (sv) |
AT (1) | AT344501B (sv) |
AU (1) | AU511961B2 (sv) |
BE (1) | BE847413A (sv) |
CA (1) | CA1077437A (sv) |
CH (1) | CH617965A5 (sv) |
DD (1) | DD127637A5 (sv) |
DE (1) | DE2647149C2 (sv) |
DK (1) | DK149926C (sv) |
FR (1) | FR2335615A1 (sv) |
GB (1) | GB1503301A (sv) |
IL (1) | IL50722A (sv) |
IT (1) | IT1066543B (sv) |
LU (1) | LU76026A1 (sv) |
MX (1) | MX145314A (sv) |
NL (1) | NL7611563A (sv) |
SE (1) | SE429108B (sv) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0427567B2 (sv) * | 1984-09-03 | 1992-05-12 | Brother Ind Ltd |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4151059A (en) * | 1977-12-27 | 1979-04-24 | Coulter Stork U.S.A., Inc. | Method and apparatus for sputtering multiple cylinders simultaneously |
FR2527233A1 (fr) * | 1982-05-24 | 1983-11-25 | Asu Composants Sa | Installation pour le depot d'un revetement sur des substrats |
US4417968A (en) * | 1983-03-21 | 1983-11-29 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
FR2548589B1 (fr) * | 1983-07-07 | 1987-02-20 | Aerospatiale | Procede et dispositif d'impregnation metallique d'un substrat se presentant sous la forme d'une nappe de fibres conductrices du courant electrique |
US4443318A (en) * | 1983-08-17 | 1984-04-17 | Shatterproof Glass Corporation | Cathodic sputtering apparatus |
EP0157991A1 (fr) * | 1984-04-10 | 1985-10-16 | INTERPATENT ANSTALT (INDELEC Abteilung) | Dispositif pour effectuer en continu la métallisation sélective de pièces industrielles, notamment en électronique |
FR2940321B1 (fr) * | 2008-12-19 | 2011-12-23 | Carewave Shielding Technologies | Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique. |
JP5969953B2 (ja) * | 2013-05-31 | 2016-08-17 | 株式会社神戸製鋼所 | 成膜装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL136984C (sv) * | 1964-06-04 | |||
DE2115590A1 (en) * | 1971-03-31 | 1972-10-05 | Leybold Heraeus Gmbh & Co Kg | Cathode sputtering device - has cathode with projecting rim |
US3905887A (en) * | 1973-01-12 | 1975-09-16 | Coulter Information Systems | Thin film deposition method using segmented plasma |
US3829373A (en) * | 1973-01-12 | 1974-08-13 | Coulter Information Systems | Thin film deposition apparatus using segmented target means |
-
1976
- 1976-10-18 MX MX166694A patent/MX145314A/es unknown
- 1976-10-19 BE BE171612A patent/BE847413A/xx not_active IP Right Cessation
- 1976-10-19 AT AT776076A patent/AT344501B/de not_active IP Right Cessation
- 1976-10-19 JP JP51125438A patent/JPS6035429B2/ja not_active Expired
- 1976-10-19 DK DK469976A patent/DK149926C/da not_active IP Right Cessation
- 1976-10-19 FR FR7631399A patent/FR2335615A1/fr active Granted
- 1976-10-19 DE DE2647149A patent/DE2647149C2/de not_active Expired
- 1976-10-19 IL IL50722A patent/IL50722A/xx unknown
- 1976-10-19 NL NL7611563A patent/NL7611563A/xx not_active Application Discontinuation
- 1976-10-19 IT IT51804/76A patent/IT1066543B/it active
- 1976-10-19 GB GB43369/76A patent/GB1503301A/en not_active Expired
- 1976-10-19 CA CA263,664A patent/CA1077437A/en not_active Expired
- 1976-10-19 CH CH1321176A patent/CH617965A5/fr not_active IP Right Cessation
- 1976-10-19 LU LU76026A patent/LU76026A1/xx unknown
- 1976-10-19 SE SE7611581A patent/SE429108B/sv unknown
- 1976-10-22 DD DD195409A patent/DD127637A5/xx unknown
- 1976-12-16 AU AU20598/76A patent/AU511961B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0427567B2 (sv) * | 1984-09-03 | 1992-05-12 | Brother Ind Ltd |
Also Published As
Publication number | Publication date |
---|---|
AT344501B (de) | 1978-07-25 |
CA1077437A (en) | 1980-05-13 |
BE847413A (nl) | 1977-04-19 |
SE7611581L (sv) | 1977-06-18 |
DK469976A (da) | 1977-06-18 |
NL7611563A (nl) | 1977-06-21 |
ATA776076A (de) | 1977-11-15 |
CH617965A5 (en) | 1980-06-30 |
AU2059876A (en) | 1978-06-22 |
IL50722A (en) | 1979-05-31 |
GB1503301A (en) | 1978-03-08 |
JPS5275669A (en) | 1977-06-24 |
FR2335615A1 (fr) | 1977-07-15 |
FR2335615B1 (sv) | 1981-12-04 |
SE429108B (sv) | 1983-08-15 |
DD127637A5 (sv) | 1977-10-05 |
DE2647149A1 (de) | 1977-06-30 |
MX145314A (es) | 1982-01-27 |
IL50722A0 (en) | 1976-12-31 |
DK149926C (da) | 1987-09-28 |
LU76026A1 (sv) | 1978-05-16 |
AU511961B2 (en) | 1980-09-18 |
DE2647149C2 (de) | 1983-08-25 |
IT1066543B (it) | 1985-03-12 |
DK149926B (da) | 1986-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4014779A (en) | Sputtering apparatus | |
US4204942A (en) | Apparatus for multilayer thin film deposition | |
US3829373A (en) | Thin film deposition apparatus using segmented target means | |
US5200049A (en) | Cantilever mount for rotating cylindrical magnetrons | |
US5096562A (en) | Rotating cylindrical magnetron structure for large area coating | |
US5108574A (en) | Cylindrical magnetron shield structure | |
US5100527A (en) | Rotating magnetron incorporating a removable cathode | |
US5470452A (en) | Shielding for arc suppression in rotating magnetron sputtering systems | |
US5106474A (en) | Anode structures for magnetron sputtering apparatus | |
US3884787A (en) | Sputtering method for thin film deposition on a substrate | |
US5888594A (en) | Process for depositing a carbon-rich coating on a moving substrate | |
US4013539A (en) | Thin film deposition apparatus | |
US5948166A (en) | Process and apparatus for depositing a carbon-rich coating on a moving substrate | |
US6841051B2 (en) | High-power ion sputtering magnetron | |
JPS6035429B2 (ja) | スパツタリング装置 | |
US4298444A (en) | Method for multilayer thin film deposition | |
US3756939A (en) | Target mounting device for sequential sputtering | |
US4026787A (en) | Thin film deposition apparatus using segmented target means | |
US3741886A (en) | Sputtering system and target electrode construction for use therewith | |
US3861353A (en) | System for vapor deposition of thin films | |
US3905887A (en) | Thin film deposition method using segmented plasma | |
US3544445A (en) | Floating shield in a triode sputtering apparatus protecting the base from the discharge | |
CN115466930B (zh) | 镀膜设备及其靶材承载装置 | |
JPH036220B2 (sv) |