CH617965A5 - Apparatus for cathodic sputtering - Google Patents

Apparatus for cathodic sputtering Download PDF

Info

Publication number
CH617965A5
CH617965A5 CH1321176A CH1321176A CH617965A5 CH 617965 A5 CH617965 A5 CH 617965A5 CH 1321176 A CH1321176 A CH 1321176A CH 1321176 A CH1321176 A CH 1321176A CH 617965 A5 CH617965 A5 CH 617965A5
Authority
CH
Switzerland
Prior art keywords
anode
drum
film
target
contacts
Prior art date
Application number
CH1321176A
Other languages
English (en)
French (fr)
Inventor
Manfred Rudolf Kuehnle
Original Assignee
Coulter Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/641,481 external-priority patent/US4014779A/en
Application filed by Coulter Systems Corp filed Critical Coulter Systems Corp
Publication of CH617965A5 publication Critical patent/CH617965A5/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrostatic Spraying Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CH1321176A 1975-12-17 1976-10-19 Apparatus for cathodic sputtering CH617965A5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/641,481 US4014779A (en) 1974-11-01 1975-12-17 Sputtering apparatus

Publications (1)

Publication Number Publication Date
CH617965A5 true CH617965A5 (en) 1980-06-30

Family

ID=24572585

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1321176A CH617965A5 (en) 1975-12-17 1976-10-19 Apparatus for cathodic sputtering

Country Status (17)

Country Link
JP (1) JPS6035429B2 (sv)
AT (1) AT344501B (sv)
AU (1) AU511961B2 (sv)
BE (1) BE847413A (sv)
CA (1) CA1077437A (sv)
CH (1) CH617965A5 (sv)
DD (1) DD127637A5 (sv)
DE (1) DE2647149C2 (sv)
DK (1) DK149926C (sv)
FR (1) FR2335615A1 (sv)
GB (1) GB1503301A (sv)
IL (1) IL50722A (sv)
IT (1) IT1066543B (sv)
LU (1) LU76026A1 (sv)
MX (1) MX145314A (sv)
NL (1) NL7611563A (sv)
SE (1) SE429108B (sv)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151059A (en) * 1977-12-27 1979-04-24 Coulter Stork U.S.A., Inc. Method and apparatus for sputtering multiple cylinders simultaneously
FR2527233A1 (fr) * 1982-05-24 1983-11-25 Asu Composants Sa Installation pour le depot d'un revetement sur des substrats
US4417968A (en) * 1983-03-21 1983-11-29 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
FR2548589B1 (fr) * 1983-07-07 1987-02-20 Aerospatiale Procede et dispositif d'impregnation metallique d'un substrat se presentant sous la forme d'une nappe de fibres conductrices du courant electrique
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
EP0157991A1 (fr) * 1984-04-10 1985-10-16 INTERPATENT ANSTALT (INDELEC Abteilung) Dispositif pour effectuer en continu la métallisation sélective de pièces industrielles, notamment en électronique
JPS6162117A (ja) * 1984-09-03 1986-03-31 Brother Ind Ltd キーボードの製造方法
FR2940321B1 (fr) * 2008-12-19 2011-12-23 Carewave Shielding Technologies Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique.
JP5969953B2 (ja) * 2013-05-31 2016-08-17 株式会社神戸製鋼所 成膜装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL136984C (sv) * 1964-06-04
DE2115590A1 (en) * 1971-03-31 1972-10-05 Leybold Heraeus Gmbh & Co Kg Cathode sputtering device - has cathode with projecting rim
US3905887A (en) * 1973-01-12 1975-09-16 Coulter Information Systems Thin film deposition method using segmented plasma
US3829373A (en) * 1973-01-12 1974-08-13 Coulter Information Systems Thin film deposition apparatus using segmented target means

Also Published As

Publication number Publication date
AT344501B (de) 1978-07-25
CA1077437A (en) 1980-05-13
BE847413A (nl) 1977-04-19
SE7611581L (sv) 1977-06-18
DK469976A (da) 1977-06-18
NL7611563A (nl) 1977-06-21
ATA776076A (de) 1977-11-15
AU2059876A (en) 1978-06-22
IL50722A (en) 1979-05-31
GB1503301A (en) 1978-03-08
JPS5275669A (en) 1977-06-24
FR2335615A1 (fr) 1977-07-15
FR2335615B1 (sv) 1981-12-04
SE429108B (sv) 1983-08-15
DD127637A5 (sv) 1977-10-05
DE2647149A1 (de) 1977-06-30
MX145314A (es) 1982-01-27
JPS6035429B2 (ja) 1985-08-14
IL50722A0 (en) 1976-12-31
DK149926C (da) 1987-09-28
LU76026A1 (sv) 1978-05-16
AU511961B2 (en) 1980-09-18
DE2647149C2 (de) 1983-08-25
IT1066543B (it) 1985-03-12
DK149926B (da) 1986-10-27

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Legal Events

Date Code Title Description
PL Patent ceased