JPS6028220A - 電子部品の外装方法 - Google Patents

電子部品の外装方法

Info

Publication number
JPS6028220A
JPS6028220A JP13608983A JP13608983A JPS6028220A JP S6028220 A JPS6028220 A JP S6028220A JP 13608983 A JP13608983 A JP 13608983A JP 13608983 A JP13608983 A JP 13608983A JP S6028220 A JPS6028220 A JP S6028220A
Authority
JP
Japan
Prior art keywords
resin material
capacitor element
external lead
resin
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13608983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0324767B2 (enExample
Inventor
徹 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP13608983A priority Critical patent/JPS6028220A/ja
Publication of JPS6028220A publication Critical patent/JPS6028220A/ja
Publication of JPH0324767B2 publication Critical patent/JPH0324767B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP13608983A 1983-07-26 1983-07-26 電子部品の外装方法 Granted JPS6028220A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13608983A JPS6028220A (ja) 1983-07-26 1983-07-26 電子部品の外装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13608983A JPS6028220A (ja) 1983-07-26 1983-07-26 電子部品の外装方法

Publications (2)

Publication Number Publication Date
JPS6028220A true JPS6028220A (ja) 1985-02-13
JPH0324767B2 JPH0324767B2 (enExample) 1991-04-04

Family

ID=15166996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13608983A Granted JPS6028220A (ja) 1983-07-26 1983-07-26 電子部品の外装方法

Country Status (1)

Country Link
JP (1) JPS6028220A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528466A (en) * 1975-07-11 1977-01-22 Fujitsu Ltd Resinous sealing of electronic parts
JPS528465A (en) * 1975-07-11 1977-01-22 Fujitsu Ltd Sheathing of electronic parts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528466A (en) * 1975-07-11 1977-01-22 Fujitsu Ltd Resinous sealing of electronic parts
JPS528465A (en) * 1975-07-11 1977-01-22 Fujitsu Ltd Sheathing of electronic parts

Also Published As

Publication number Publication date
JPH0324767B2 (enExample) 1991-04-04

Similar Documents

Publication Publication Date Title
JPH065760A (ja) 表面実装型半導体装置用パッケージリード
CN101378630B (zh) 印刷电路板和电子设备的生产方法
JPH04260358A (ja) 電子装置及びその製造方法
JPS6219062B2 (enExample)
JPS6028220A (ja) 電子部品の外装方法
JP3836263B2 (ja) アキシャルリード型電子部品及びアキシャルリード型電子部品実装回路基板装置
JPH0760881B2 (ja) 半導体装置の半田塗布方法
JP4045019B2 (ja) 半田付け方法
CN100444706C (zh) 在布线板上安装电子部件的方法
JPS60120588A (ja) 印刷配線板
JP3656690B2 (ja) 電子部品の製造方法
JP3967989B2 (ja) 半田バンプ付き配線基板の製造方法
JP3468876B2 (ja) プリント配線板およびその製造方法
JP2717199B2 (ja) フィルムキャリアにおけるバンプの形成方法
JPS589318A (ja) 電子部品の外装方法
JPS61220447A (ja) 半導体パツケ−ジ
JPH0311903Y2 (enExample)
JPH04151894A (ja) プリント配線板への電子部品取付法
JPS6197809A (ja) インダクタンス素子
JPH10270594A (ja) 配線基板
JPS61284947A (ja) 電子部品の製造方法
JPS59161056A (ja) セラミツクパツケ−ジ半導体装置
JPH1167957A (ja) 電子部品および電子部品の製造方法
JPH0312992A (ja) 電気的接合部
JPS6050350B2 (ja) ハイブリッドicの製造方法