JPS6028220A - 電子部品の外装方法 - Google Patents
電子部品の外装方法Info
- Publication number
- JPS6028220A JPS6028220A JP13608983A JP13608983A JPS6028220A JP S6028220 A JPS6028220 A JP S6028220A JP 13608983 A JP13608983 A JP 13608983A JP 13608983 A JP13608983 A JP 13608983A JP S6028220 A JPS6028220 A JP S6028220A
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- capacitor element
- external lead
- resin
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 9
- 230000005611 electricity Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 32
- 229920005989 resin Polymers 0.000 description 32
- 239000003990 capacitor Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 22
- 238000004806 packaging method and process Methods 0.000 description 7
- 239000007787 solid Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 238000007667 floating Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13608983A JPS6028220A (ja) | 1983-07-26 | 1983-07-26 | 電子部品の外装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13608983A JPS6028220A (ja) | 1983-07-26 | 1983-07-26 | 電子部品の外装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6028220A true JPS6028220A (ja) | 1985-02-13 |
| JPH0324767B2 JPH0324767B2 (enExample) | 1991-04-04 |
Family
ID=15166996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13608983A Granted JPS6028220A (ja) | 1983-07-26 | 1983-07-26 | 電子部品の外装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028220A (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528466A (en) * | 1975-07-11 | 1977-01-22 | Fujitsu Ltd | Resinous sealing of electronic parts |
| JPS528465A (en) * | 1975-07-11 | 1977-01-22 | Fujitsu Ltd | Sheathing of electronic parts |
-
1983
- 1983-07-26 JP JP13608983A patent/JPS6028220A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528466A (en) * | 1975-07-11 | 1977-01-22 | Fujitsu Ltd | Resinous sealing of electronic parts |
| JPS528465A (en) * | 1975-07-11 | 1977-01-22 | Fujitsu Ltd | Sheathing of electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0324767B2 (enExample) | 1991-04-04 |
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