CN100444706C - 在布线板上安装电子部件的方法 - Google Patents

在布线板上安装电子部件的方法 Download PDF

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CN100444706C
CN100444706C CNB200310101775XA CN200310101775A CN100444706C CN 100444706 C CN100444706 C CN 100444706C CN B200310101775X A CNB200310101775X A CN B200310101775XA CN 200310101775 A CN200310101775 A CN 200310101775A CN 100444706 C CN100444706 C CN 100444706C
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加治木笃典
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Shinko Electric Industries Co Ltd
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Abstract

在布线板上安装电子部件的方法，其中通过倒装芯片接合借助薄焊料层将裸芯片接合到连接焊盘，并且至少其它的焊接部件借助薄焊料层焊接到板上的安装焊盘，所述方法包括以下步骤：在连接焊盘和安装焊盘上形成粘合剂树脂层的步骤；分散开由锡银合金制成的直径小的焊料颗粒，由此焊料颗粒临时地粘附到连接焊盘和安装焊盘的步骤；将焊接部件放置在安装焊盘上并回流，由此焊料颗粒被回流以用薄焊料层预涂覆连接焊盘，同时焊接部件借助通过回流焊料颗粒获得的薄焊料层安装在安装焊盘上的步骤；以及将要定位的裸芯片放置在薄焊料层上，并通过倒装芯片接合将裸芯片倒装接合到连接焊盘的步骤。

Description

在布线板上安装电子部件的方法
技术领域
本发明涉及在布线板上安装电子部件的方法，特别涉及在布线板上安装裸芯片和其它任何焊接部件(借助焊料安装在板上的电子部件)的方法。
背景技术
当借助倒装芯片接合将裸芯片接合到布线板以及借助焊接将除裸芯片之外如IC器件(即，容纳半导体芯片的封装)、电阻器、电容器等的其它任何电子部件安装在布线板上时，通常使用以下方法。
首先，薄焊料层预涂覆在连接焊盘上，用于接合裸芯片。用于接合的这些连接焊盘很小。例如，用于接合的一个焊盘的尺寸为40μm2。用于接合的这些很小的焊盘以如100μm的非常细微间距排列，并形成预定的图形。因此，涂覆焊膏的常规方法不可能在以上非常细微的焊盘图形上形成薄焊料层。
因此，有关在以上非常细微的焊盘图形上预涂覆薄焊料层的方法，现已开发了称做“Super Jufit Method”的方法。例如，参考日本专利No.2592757(JP-A-7-7244)。
根据该方法，由预定材料制成的粘合剂树脂层形成在用于接合的焊盘上。接下来，通过粘合剂树脂层焊料颗粒被分散开并临时地粘结到用于焊接合的焊盘。然后，回流焊料颗粒，由此预涂覆了薄焊料层。当使用小颗粒尺寸的焊料颗粒时，甚至可以在以上非常细微的焊盘图形上形成薄焊料层。
通过丝网印刷的常规方法涂覆薄焊料层之后，在其上安装要焊接的部件(除了借助倒装芯片接合而接合的裸芯片之外的电子部件)的焊盘上，涂覆混有助熔剂的焊膏并将要焊接的部件放置在焊盘上。然后，在用于回流的炉中加热焊盘以回流含在焊膏中的焊料颗粒。以此方式，借助焊接来接合要焊接的部件。
含在焊膏中的焊料颗粒例如由熔点较低的锡铅共晶焊料制成。另一方面，分散在用于接合的焊盘上的焊料颗粒例如由熔点高于焊膏中含有的焊料颗粒熔点的锡银合金制成。
进行清洁以除去助熔剂之后，裸芯片定位在其上预涂覆有薄焊料层的用于接合的焊盘上，并仅使用倒装芯片接合器加热，由此借助倒装芯片接合来接合裸芯片。
然而，以上电子部件安装法具有以下缺点。
涂覆在用于安装的焊盘上的焊膏含有助熔剂和其它树脂成份。当在回流炉中加热时，助熔剂和其它树脂成份的一部分会变成气体。由此形成的杂质会附着到预先形成在用于接合的焊盘上的薄焊料层(预涂覆层)，并形成膜。
因此，需要提供除去这些杂质的清洁工艺，这很麻烦。此外，清洁单元必须添加到装置中，并且需要用于清洁的时间和设备。而且，需要用于清洁超细微部分的如洗涤剂和替代剂的化学制品，并且必须提供专门的设备，这增加了制造成本。
对于有机板，板会受到残留物的腐蚀，也就是，板被损伤的可能性很大。由于以上原因，当进行清洁时，板的可靠性降低。
发明内容
为解决现有技术的以上问题，完成了本发明。
本发明的一个目的是提供一种在布线板上安装电子部件的方法，特点在于可以减少工艺的时间和数量并且可以降低成本。
为了解决以上问题，根据本发明，提供一种在布线板上安装电子部件的方法，其中通过倒装芯片接合借助薄焊料层将裸芯片接合到连接焊盘，并且至少其它的焊接部分借助薄焊料层焊接到板上的安装焊盘，所述方法包括以下步骤：在连接焊盘和安装焊盘上形成粘合剂树脂层的步骤；分散开由锡银合金制成的直径小的焊料颗粒，由此焊料颗粒临时地粘附到连接焊盘和安装焊盘的步骤；将焊接部件放置在安装焊盘上并回流，由此焊料颗粒被回流以用薄焊料层预涂覆连接焊盘，同时焊接部件借助通过回流焊料颗粒获得的薄焊料层安装在安装焊盘上的步骤；以及将要定位的裸芯片放置在连接焊盘的薄焊料层上，并通过倒装芯片接合将裸芯片倒装接合到连接焊盘的步骤。
通过将板浸泡在增粘剂化合物的溶液中，粘合剂层形成在连接焊盘和安装焊盘上。
此外，可以通过用增粘剂化合物的溶液涂覆连接焊盘和安装焊盘形成粘合剂树脂层。焊料颗粒由锡银合金制成比较有利。
附图说明
图1为示出了布线板的示意图；
图2为示出了焊料颗粒临时地接合状态的示意图，并包括连接焊盘和安装焊盘的放大图；
图3为示出了预涂覆薄焊料层并且同时安装焊接部件的状态的示意图，并包括连接焊盘的放大图；以及
图4为示出了借助倒装芯片接合来接合裸芯片的状态的示意图。
具体实施方式
参考附图，下面详细介绍本发明的优选实施例。
图1示意性地示出了布线板10的模型。布线板10由多层组成。在其上安装电子部件的板12的表面层上，提供了用于接合的连接焊盘14，在焊盘14上要安装裸芯片，也提供一种用于安装的焊盘16，在焊盘16上要安装如IC器件、电阻器、电容器等的焊接部件。形成并露出这些焊盘14和16。
根据本发明，通过“Super Jufit Method”薄焊料层同时形成在用于接合的焊盘14和用于安装的焊盘16上。
当如以上的日本专利No.2592757所示，板12浸泡在增粘剂化合物的溶液中时，或者当用增粘剂化合物的溶液涂覆板12时，可以在为金属性露出部分的用于接合的焊盘14和用于安装的焊盘16上形成粘合剂树脂层18(图2)。在日本专利No.2592757中公开的增粘剂化合物的例子为萘并三唑衍生物、苯并三唑衍生物、咪唑衍生物、苯并咪唑衍生物以及巯基苯并噻唑衍生物。因此，在本发明中，至少可以使用这些增粘剂化合物中的一种。
接下来，如图2所示，分散开由锡银合金制成直径较小的焊料颗粒20，由此通过以上提到的粘合剂树脂层18分散开的焊料颗粒20临时地粘附到用于接合的焊盘14和用于安装的焊盘16上。
之后，焊接部分22放置在用于安装的焊盘16上，并容纳在炉(未示出)中，以回流焊料颗粒20并预涂覆用于接合的焊盘14上的薄焊料层24(图4)。以此方式，借助熔化的焊料将焊接部件22安装在用于安装的焊盘16上(如图3所示)。
此后，如图4所示，裸芯片26定位并放置在用于接合的焊盘14的薄焊料层24上，用芯片接合机(未示出)加热裸芯片26，由此借助倒装芯片接合将裸芯片26接合到用于接合的焊盘14上。以此方式，可以提供多种电子部件安装在板12上的布线板10。
根据以上工艺，由于没有使用助熔剂，因此不需要提供除去助熔剂的清洁工艺。
可以在同一工艺中进行用于接合的焊盘14上的薄焊料层24的预涂覆工艺以及用于安装焊接部件的回流工艺。因此，可以减少需要的时间。而且，可以减少工艺的数量。由此，可以降低成本。
就此而言，预涂覆薄焊料层时，可以采用“超焊料法”代替以上提到的“Super Jufit Method”。
如上所述，根据本发明，在薄焊料层预涂覆在用于倒装芯片接合的焊盘上的工艺中，可以同时安装焊接部件。因此，可以减少安装焊接部件需要的工艺数量。从而，节约了时间。
由于没有使用助熔剂，所以可以省略助熔剂的清洁工艺。
此外，由于可以省略预涂覆薄焊料层的工艺与倒装芯片接合的工艺之间在加热炉中安装焊接部件的工艺，因此可以防止其它的物质粘附到已预涂覆的薄焊料层并与其混合。
由于节约了时间，由此减少了给予板的热滞后，并极大地提高了可靠性。
本领域中的技术人员应该理解以上说明仅涉及公开的发明的优选实施例，可以不脱离本发明的精神和范围对本发明进行各种修改和变化。

Claims (4)

1.一种在布线板上安装电子部件的方法，其中通过倒装芯片接合借助薄焊料层将裸芯片接合到连接焊盘，并且至少其它的焊接部件借助薄焊料层焊接到板上的安装焊盘上，所述方法包括以下步骤：
在连接焊盘和安装焊盘上形成粘合剂树脂层的步骤；
分散开由锡银合金制成的直径小的焊料颗粒，由此焊料颗粒临时地粘附到连接焊盘和安装焊盘的步骤；
将焊接部件放置在安装焊盘上并回流，由此焊料颗粒被回流以用薄焊料层预涂覆连接焊盘，同时焊接部件借助通过回流焊料颗粒获得的薄焊料层安装在安装焊盘上的步骤；以及
将要定位的裸芯片放置在连接焊盘的薄焊料层上，并通过倒装芯片接合将裸芯片倒装接合到连接焊盘的步骤。
2.根据权利要求1的方法，其中通过将板浸泡在增粘剂化合物的溶液中，粘合剂树脂层形成在连接焊盘和安装焊盘上。
3.根据权利要求1的方法，其中通过用增粘剂化合物的溶液涂覆连接焊盘和安装焊盘形成粘合剂树脂层。
4.根据权利要求1的方法，其中焊料颗粒由锡银合金制成。
CNB200310101775XA 2002-10-29 2003-10-23 在布线板上安装电子部件的方法 Expired - Fee Related CN100444706C (zh)

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JP2001308268A (ja) * 2000-04-19 2001-11-02 Matsushita Electric Ind Co Ltd 小型モジュールの製造方法

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