JPS6027115A - 光照射炉による半導体ウエハ−の熱処理法 - Google Patents
光照射炉による半導体ウエハ−の熱処理法Info
- Publication number
- JPS6027115A JPS6027115A JP58134369A JP13436983A JPS6027115A JP S6027115 A JPS6027115 A JP S6027115A JP 58134369 A JP58134369 A JP 58134369A JP 13436983 A JP13436983 A JP 13436983A JP S6027115 A JPS6027115 A JP S6027115A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- circumference
- heat treatment
- light irradiation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P10/00—
Landscapes
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58134369A JPS6027115A (ja) | 1983-07-25 | 1983-07-25 | 光照射炉による半導体ウエハ−の熱処理法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58134369A JPS6027115A (ja) | 1983-07-25 | 1983-07-25 | 光照射炉による半導体ウエハ−の熱処理法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6027115A true JPS6027115A (ja) | 1985-02-12 |
| JPH025295B2 JPH025295B2 (OSRAM) | 1990-02-01 |
Family
ID=15126764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58134369A Granted JPS6027115A (ja) | 1983-07-25 | 1983-07-25 | 光照射炉による半導体ウエハ−の熱処理法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6027115A (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02159720A (ja) * | 1988-12-14 | 1990-06-19 | Nec Corp | 半導体装置の熱処理方法 |
| WO1997033306A1 (fr) * | 1996-03-07 | 1997-09-12 | Shin-Etsu Handotai Co., Ltd. | Procede de traitement thermique et substrat a semi-conducteur monocristal |
| JP2006179837A (ja) * | 2004-12-24 | 2006-07-06 | Fujitsu Ltd | 半導体装置の製造方法、ウェハおよびウェハの製造方法 |
| JP2014120664A (ja) * | 2012-12-18 | 2014-06-30 | Dainippon Screen Mfg Co Ltd | 剥離補助方法および剥離補助装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169125A (ja) * | 1983-03-16 | 1984-09-25 | Ushio Inc | 半導体ウエハ−の加熱方法 |
-
1983
- 1983-07-25 JP JP58134369A patent/JPS6027115A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169125A (ja) * | 1983-03-16 | 1984-09-25 | Ushio Inc | 半導体ウエハ−の加熱方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02159720A (ja) * | 1988-12-14 | 1990-06-19 | Nec Corp | 半導体装置の熱処理方法 |
| WO1997033306A1 (fr) * | 1996-03-07 | 1997-09-12 | Shin-Etsu Handotai Co., Ltd. | Procede de traitement thermique et substrat a semi-conducteur monocristal |
| US5913974A (en) * | 1996-03-07 | 1999-06-22 | Shin-Etsu Handotai Co., Ltd. | Heat treating method of a semiconductor single crystal substrate |
| JP2006179837A (ja) * | 2004-12-24 | 2006-07-06 | Fujitsu Ltd | 半導体装置の製造方法、ウェハおよびウェハの製造方法 |
| JP2014120664A (ja) * | 2012-12-18 | 2014-06-30 | Dainippon Screen Mfg Co Ltd | 剥離補助方法および剥離補助装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025295B2 (OSRAM) | 1990-02-01 |
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