JPS60262427A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS60262427A
JPS60262427A JP11776884A JP11776884A JPS60262427A JP S60262427 A JPS60262427 A JP S60262427A JP 11776884 A JP11776884 A JP 11776884A JP 11776884 A JP11776884 A JP 11776884A JP S60262427 A JPS60262427 A JP S60262427A
Authority
JP
Japan
Prior art keywords
resist film
film
resist
semiconductor device
fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11776884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0518253B2 (enrdf_load_stackoverflow
Inventor
Hitoshi Tsuji
均 辻
Chiharu Kato
千晴 加藤
Kazuyuki Saito
斉藤　和行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP11776884A priority Critical patent/JPS60262427A/ja
Publication of JPS60262427A publication Critical patent/JPS60262427A/ja
Publication of JPH0518253B2 publication Critical patent/JPH0518253B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
JP11776884A 1984-06-08 1984-06-08 半導体装置の製造方法 Granted JPS60262427A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11776884A JPS60262427A (ja) 1984-06-08 1984-06-08 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11776884A JPS60262427A (ja) 1984-06-08 1984-06-08 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60262427A true JPS60262427A (ja) 1985-12-25
JPH0518253B2 JPH0518253B2 (enrdf_load_stackoverflow) 1993-03-11

Family

ID=14719839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11776884A Granted JPS60262427A (ja) 1984-06-08 1984-06-08 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60262427A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2105950A1 (en) * 2008-03-27 2009-09-30 United Radiant Technology Corp. Thin film etching method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2105950A1 (en) * 2008-03-27 2009-09-30 United Radiant Technology Corp. Thin film etching method

Also Published As

Publication number Publication date
JPH0518253B2 (enrdf_load_stackoverflow) 1993-03-11

Similar Documents

Publication Publication Date Title
JPS60262427A (ja) 半導体装置の製造方法
US4612274A (en) Electron beam/optical hybrid lithographic resist process in acoustic wave devices
JPS63246821A (ja) パタ−ン形成方法
JPH02140914A (ja) 半導体装置の製造方法
US3951659A (en) Method for resist coating of a glass substrate
JPS63246822A (ja) パタ−ン形成方法
JP2712407B2 (ja) ２層フォトレジストを用いた微細パターンの形成方法
JPH0544169B2 (enrdf_load_stackoverflow)
JPS6321831A (ja) パタ−ン形成方法
JPH0471331B2 (enrdf_load_stackoverflow)
JPH11204414A (ja) パターン形成法
JPH0253060A (ja) 半導体装置の製造方法
JPH01239928A (ja) パターン形成方法
JPH06349728A (ja) レジストパターンの形成方法
JPS58219738A (ja) 半導体装置の製造方法
JPH01239938A (ja) パターン形成方法
JPS6335010B2 (enrdf_load_stackoverflow)
JP2589470B2 (ja) 半導体装置の製造方法
JP2666420B2 (ja) 半導体装置の製造方法
JPH0653107A (ja) 半導体装置の製造方法
JPH0458245A (ja) 微細パターン形成用マスク及びその製造方法
JPS58153932A (ja) 写真蝕刻方法
JPS6154629A (ja) フオト・レジストパタ−ンの形成方法
JPH03147315A (ja) パターン形成方法
JPS6129844A (ja) パタ−ン作成方法