JPS60255831A - エポキシ樹脂積層板の製造方法 - Google Patents
エポキシ樹脂積層板の製造方法Info
- Publication number
- JPS60255831A JPS60255831A JP11085584A JP11085584A JPS60255831A JP S60255831 A JPS60255831 A JP S60255831A JP 11085584 A JP11085584 A JP 11085584A JP 11085584 A JP11085584 A JP 11085584A JP S60255831 A JPS60255831 A JP S60255831A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- laminate
- resin
- bisphenol
- resin laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004593 Epoxy Substances 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 229920003986 novolac Polymers 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract 2
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000035939 shock Effects 0.000 abstract description 8
- 239000002966 varnish Substances 0.000 abstract description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 3
- 229930185605 Bisphenol Natural products 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000004132 cross linking Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11085584A JPS60255831A (ja) | 1984-06-01 | 1984-06-01 | エポキシ樹脂積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11085584A JPS60255831A (ja) | 1984-06-01 | 1984-06-01 | エポキシ樹脂積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60255831A true JPS60255831A (ja) | 1985-12-17 |
| JPH0374256B2 JPH0374256B2 (enrdf_load_stackoverflow) | 1991-11-26 |
Family
ID=14546372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11085584A Granted JPS60255831A (ja) | 1984-06-01 | 1984-06-01 | エポキシ樹脂積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60255831A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62259847A (ja) * | 1986-04-25 | 1987-11-12 | リユ−トガ−スヴエルケ・アクチエンゲゼルシヤフト | 複合材料およびその製造法 |
| JPS63135434A (ja) * | 1986-11-26 | 1988-06-07 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂積層板の製造法 |
| JPH05301980A (ja) * | 1992-04-24 | 1993-11-16 | Toshiba Chem Corp | 印刷配線板用プリプレグ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51129498A (en) * | 1975-04-02 | 1976-11-11 | Hitachi Ltd | Thermosetting resin composition |
| JPS5717516A (en) * | 1980-07-08 | 1982-01-29 | Hitachi Ltd | Prepreg sheet for electric insulation |
-
1984
- 1984-06-01 JP JP11085584A patent/JPS60255831A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51129498A (en) * | 1975-04-02 | 1976-11-11 | Hitachi Ltd | Thermosetting resin composition |
| JPS5717516A (en) * | 1980-07-08 | 1982-01-29 | Hitachi Ltd | Prepreg sheet for electric insulation |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62259847A (ja) * | 1986-04-25 | 1987-11-12 | リユ−トガ−スヴエルケ・アクチエンゲゼルシヤフト | 複合材料およびその製造法 |
| JPS63135434A (ja) * | 1986-11-26 | 1988-06-07 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂積層板の製造法 |
| JPH05301980A (ja) * | 1992-04-24 | 1993-11-16 | Toshiba Chem Corp | 印刷配線板用プリプレグ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0374256B2 (enrdf_load_stackoverflow) | 1991-11-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |