JPS60254759A - リ−ドフレ−ム用複合金属材料 - Google Patents

リ−ドフレ−ム用複合金属材料

Info

Publication number
JPS60254759A
JPS60254759A JP11146784A JP11146784A JPS60254759A JP S60254759 A JPS60254759 A JP S60254759A JP 11146784 A JP11146784 A JP 11146784A JP 11146784 A JP11146784 A JP 11146784A JP S60254759 A JPS60254759 A JP S60254759A
Authority
JP
Japan
Prior art keywords
metal material
thermal expansion
alloy
lead frame
highly conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11146784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530071B2 (forum.php
Inventor
Teruo Nakanishi
中西　輝雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11146784A priority Critical patent/JPS60254759A/ja
Publication of JPS60254759A publication Critical patent/JPS60254759A/ja
Publication of JPH0530071B2 publication Critical patent/JPH0530071B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11146784A 1984-05-31 1984-05-31 リ−ドフレ−ム用複合金属材料 Granted JPS60254759A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11146784A JPS60254759A (ja) 1984-05-31 1984-05-31 リ−ドフレ−ム用複合金属材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11146784A JPS60254759A (ja) 1984-05-31 1984-05-31 リ−ドフレ−ム用複合金属材料

Publications (2)

Publication Number Publication Date
JPS60254759A true JPS60254759A (ja) 1985-12-16
JPH0530071B2 JPH0530071B2 (forum.php) 1993-05-07

Family

ID=14561980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11146784A Granted JPS60254759A (ja) 1984-05-31 1984-05-31 リ−ドフレ−ム用複合金属材料

Country Status (1)

Country Link
JP (1) JPS60254759A (forum.php)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324844U (forum.php) * 1986-07-31 1988-02-18
JPH0228359A (ja) * 1988-07-18 1990-01-30 Mitsui High Tec Inc リードフレーム材料
JPH03290957A (ja) * 1990-04-06 1991-12-20 Sumitomo Special Metals Co Ltd プラスチックスパッケージ用リードフレーム材料
JPH03290956A (ja) * 1990-04-06 1991-12-20 Sumitomo Special Metals Co Ltd プラスチックスパッケージ用リードフレーム材料
EP3185291A1 (en) * 2015-12-21 2017-06-28 Nexperia B.V. A leadframe and a method of manufacturing a leadframe

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037363A (forum.php) * 1973-08-06 1975-04-08
JPS5662345A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Load frame and semiconductor device
JPS58223274A (ja) * 1982-06-22 1983-12-24 株式会社東芝 リ−ド部品およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037363A (forum.php) * 1973-08-06 1975-04-08
JPS5662345A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Load frame and semiconductor device
JPS58223274A (ja) * 1982-06-22 1983-12-24 株式会社東芝 リ−ド部品およびその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324844U (forum.php) * 1986-07-31 1988-02-18
JPH0228359A (ja) * 1988-07-18 1990-01-30 Mitsui High Tec Inc リードフレーム材料
JPH03290957A (ja) * 1990-04-06 1991-12-20 Sumitomo Special Metals Co Ltd プラスチックスパッケージ用リードフレーム材料
JPH03290956A (ja) * 1990-04-06 1991-12-20 Sumitomo Special Metals Co Ltd プラスチックスパッケージ用リードフレーム材料
EP3185291A1 (en) * 2015-12-21 2017-06-28 Nexperia B.V. A leadframe and a method of manufacturing a leadframe
CN107026142A (zh) * 2015-12-21 2017-08-08 安世有限公司 引线框架以及制造引线框架的方法
CN114783976A (zh) * 2015-12-21 2022-07-22 安世有限公司 引线框架以及制造引线框架的方法

Also Published As

Publication number Publication date
JPH0530071B2 (forum.php) 1993-05-07

Similar Documents

Publication Publication Date Title
US4141029A (en) Integrated circuit device
JPS6089354A (ja) セラミツク−金属エレメント
US4732733A (en) Copper-base alloys for leadframes
JPS61183426A (ja) 高力高導電性耐熱銅合金
JPS60254759A (ja) リ−ドフレ−ム用複合金属材料
KR20020079898A (ko) 냉각부재 및 냉각부재의 제조방법
JPS6318648A (ja) 窒化アルミニウム回路基板
JP2643396B2 (ja) セラミックコンデンサに半田接合される板状のリード線
JP4557398B2 (ja) 電子素子
JPWO2006016479A1 (ja) ヒートシンク部材およびその製造方法
JP2815498B2 (ja) 耐熱衝撃性に優れたセラミックス−銅接合基板
JP4461268B2 (ja) 半導体装置部品およびその製造方法ならびにこれを用いた半導体装置
JP3850090B2 (ja) 電子部品用複合材料
JPH07120740B2 (ja) 半導体用リードフレームとその製造法
JPH02152267A (ja) Ｃｕ合金／Ｆｅ−Ｎｉ合金並接型リードフレーム
JPH04230063A (ja) 多層ヒートシンク
JPS60206053A (ja) リ−ドフレ−ム
JPH03284869A (ja) リードフレーム用クラッド材料
JPH02348A (ja) 半導体装置
JPH03179768A (ja) リードフレーム用部材
JPS59178754A (ja) 発熱体用放熱部材
JPH09312364A (ja) 電子部品用複合材料およびその製造方法
JPS62123755A (ja) リ−ドフレ−ム用複合条
JPH04335554A (ja) 複合リードピン
JPS62141747A (ja) 半導体リ−ドフレ−ム