JPS60254753A - Ｅｐｒｏｍチツプ搭載パツケ−ジ - Google Patents
Ｅｐｒｏｍチツプ搭載パツケ−ジInfo
- Publication number
- JPS60254753A JPS60254753A JP11167784A JP11167784A JPS60254753A JP S60254753 A JPS60254753 A JP S60254753A JP 11167784 A JP11167784 A JP 11167784A JP 11167784 A JP11167784 A JP 11167784A JP S60254753 A JPS60254753 A JP S60254753A
- Authority
- JP
- Japan
- Prior art keywords
- sapphire
- cap
- eprom chip
- eprom
- mounting package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 23
- 239000010980 sapphire Substances 0.000 claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 7
- 229910000833 kovar Inorganic materials 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052737 gold Inorganic materials 0.000 abstract description 5
- 239000010931 gold Substances 0.000 abstract description 5
- 230000035939 shock Effects 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052721 tungsten Inorganic materials 0.000 abstract description 3
- 239000010937 tungsten Substances 0.000 abstract description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 2
- 239000011733 molybdenum Substances 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/18—Circuits for erasing optically
Landscapes
- Non-Volatile Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11167784A JPS60254753A (ja) | 1984-05-31 | 1984-05-31 | Ｅｐｒｏｍチツプ搭載パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11167784A JPS60254753A (ja) | 1984-05-31 | 1984-05-31 | Ｅｐｒｏｍチツプ搭載パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60254753A true JPS60254753A (ja) | 1985-12-16 |
| JPH031836B2 JPH031836B2 (enrdf_load_html_response) | 1991-01-11 |
Family
ID=14567382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11167784A Granted JPS60254753A (ja) | 1984-05-31 | 1984-05-31 | Ｅｐｒｏｍチツプ搭載パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60254753A (enrdf_load_html_response) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158950A (ja) * | 1982-03-16 | 1983-09-21 | Nec Corp | 半導体装置 |
-
1984
- 1984-05-31 JP JP11167784A patent/JPS60254753A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158950A (ja) * | 1982-03-16 | 1983-09-21 | Nec Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031836B2 (enrdf_load_html_response) | 1991-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |