JPS60253252A - リ−ドフレ−ムの製造方法 - Google Patents

リ−ドフレ−ムの製造方法

Info

Publication number
JPS60253252A
JPS60253252A JP60019687A JP1968785A JPS60253252A JP S60253252 A JPS60253252 A JP S60253252A JP 60019687 A JP60019687 A JP 60019687A JP 1968785 A JP1968785 A JP 1968785A JP S60253252 A JPS60253252 A JP S60253252A
Authority
JP
Japan
Prior art keywords
lead
insulating film
pieces
piece
lead piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60019687A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0314225B2 (cg-RX-API-DMAC10.html
Inventor
Masao Hino
日野　雅夫
Susumu Sato
奨 佐藤
Akira Watanabe
章 渡辺
Toshio Kasuga
春日　寿夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP60019687A priority Critical patent/JPS60253252A/ja
Publication of JPS60253252A publication Critical patent/JPS60253252A/ja
Publication of JPH0314225B2 publication Critical patent/JPH0314225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
JP60019687A 1985-02-04 1985-02-04 リ−ドフレ−ムの製造方法 Granted JPS60253252A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60019687A JPS60253252A (ja) 1985-02-04 1985-02-04 リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60019687A JPS60253252A (ja) 1985-02-04 1985-02-04 リ−ドフレ−ムの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP56183309A Division JPS5921175B2 (ja) 1981-11-16 1981-11-16 リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS60253252A true JPS60253252A (ja) 1985-12-13
JPH0314225B2 JPH0314225B2 (cg-RX-API-DMAC10.html) 1991-02-26

Family

ID=12006148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60019687A Granted JPS60253252A (ja) 1985-02-04 1985-02-04 リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS60253252A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988009575A1 (en) * 1987-05-20 1988-12-01 Olin Corporation Process for providing an improved electroplated tape automated bonding tape and the product produced thereby

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988009575A1 (en) * 1987-05-20 1988-12-01 Olin Corporation Process for providing an improved electroplated tape automated bonding tape and the product produced thereby

Also Published As

Publication number Publication date
JPH0314225B2 (cg-RX-API-DMAC10.html) 1991-02-26

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