JPS6025159U - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS6025159U
JPS6025159U JP1983117523U JP11752383U JPS6025159U JP S6025159 U JPS6025159 U JP S6025159U JP 1983117523 U JP1983117523 U JP 1983117523U JP 11752383 U JP11752383 U JP 11752383U JP S6025159 U JPS6025159 U JP S6025159U
Authority
JP
Japan
Prior art keywords
lead frame
external lead
bent
lead part
radius
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983117523U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6336703Y2 (enExample
Inventor
瑛一 綱島
Original Assignee
松下電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電子工業株式会社 filed Critical 松下電子工業株式会社
Priority to JP1983117523U priority Critical patent/JPS6025159U/ja
Publication of JPS6025159U publication Critical patent/JPS6025159U/ja
Application granted granted Critical
Publication of JPS6336703Y2 publication Critical patent/JPS6336703Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/754—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP1983117523U 1983-07-28 1983-07-28 リ−ドフレ−ム Granted JPS6025159U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983117523U JPS6025159U (ja) 1983-07-28 1983-07-28 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983117523U JPS6025159U (ja) 1983-07-28 1983-07-28 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS6025159U true JPS6025159U (ja) 1985-02-20
JPS6336703Y2 JPS6336703Y2 (enExample) 1988-09-28

Family

ID=30270498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983117523U Granted JPS6025159U (ja) 1983-07-28 1983-07-28 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS6025159U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211204A (ja) * 1991-11-29 1993-08-20 Akira Kitahara 表面実装電子部品
JPH06120411A (ja) * 1992-10-07 1994-04-28 Nec Corp 実装型パッケージ
JP2012094713A (ja) * 2010-10-27 2012-05-17 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置及び弾性接続子

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211204A (ja) * 1991-11-29 1993-08-20 Akira Kitahara 表面実装電子部品
JPH06120411A (ja) * 1992-10-07 1994-04-28 Nec Corp 実装型パッケージ
JP2012094713A (ja) * 2010-10-27 2012-05-17 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置及び弾性接続子

Also Published As

Publication number Publication date
JPS6336703Y2 (enExample) 1988-09-28

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