JPS60246657A - α線照射防止用樹脂膜の形成方法 - Google Patents

α線照射防止用樹脂膜の形成方法

Info

Publication number
JPS60246657A
JPS60246657A JP59103906A JP10390684A JPS60246657A JP S60246657 A JPS60246657 A JP S60246657A JP 59103906 A JP59103906 A JP 59103906A JP 10390684 A JP10390684 A JP 10390684A JP S60246657 A JPS60246657 A JP S60246657A
Authority
JP
Japan
Prior art keywords
film
resin
resin film
ray irradiation
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59103906A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0318739B2 (cg-RX-API-DMAC7.html
Inventor
Kyusaku Nishioka
西岡　久作
Masayuki Nakajima
真之 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59103906A priority Critical patent/JPS60246657A/ja
Publication of JPS60246657A publication Critical patent/JPS60246657A/ja
Publication of JPH0318739B2 publication Critical patent/JPH0318739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59103906A 1984-05-21 1984-05-21 α線照射防止用樹脂膜の形成方法 Granted JPS60246657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59103906A JPS60246657A (ja) 1984-05-21 1984-05-21 α線照射防止用樹脂膜の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59103906A JPS60246657A (ja) 1984-05-21 1984-05-21 α線照射防止用樹脂膜の形成方法

Publications (2)

Publication Number Publication Date
JPS60246657A true JPS60246657A (ja) 1985-12-06
JPH0318739B2 JPH0318739B2 (cg-RX-API-DMAC7.html) 1991-03-13

Family

ID=14366466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59103906A Granted JPS60246657A (ja) 1984-05-21 1984-05-21 α線照射防止用樹脂膜の形成方法

Country Status (1)

Country Link
JP (1) JPS60246657A (cg-RX-API-DMAC7.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56165345A (en) * 1980-05-23 1981-12-18 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56165345A (en) * 1980-05-23 1981-12-18 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPH0318739B2 (cg-RX-API-DMAC7.html) 1991-03-13

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