JPS60234336A - インナ−リ−ドボンダ− - Google Patents
インナ−リ−ドボンダ−Info
- Publication number
- JPS60234336A JPS60234336A JP59091377A JP9137784A JPS60234336A JP S60234336 A JPS60234336 A JP S60234336A JP 59091377 A JP59091377 A JP 59091377A JP 9137784 A JP9137784 A JP 9137784A JP S60234336 A JPS60234336 A JP S60234336A
- Authority
- JP
- Japan
- Prior art keywords
- die
- carrier tape
- bonding
- wafer
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001629 suppression Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 82
- 239000000758 substrate Substances 0.000 description 32
- 210000000078 claw Anatomy 0.000 description 15
- 238000001514 detection method Methods 0.000 description 13
- 125000006850 spacer group Chemical group 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- XBWAZCLHZCFCGK-UHFFFAOYSA-N 7-chloro-1-methyl-5-phenyl-3,4-dihydro-2h-1,4-benzodiazepin-1-ium;chloride Chemical compound [Cl-].C12=CC(Cl)=CC=C2[NH+](C)CCN=C1C1=CC=CC=C1 XBWAZCLHZCFCGK-UHFFFAOYSA-N 0.000 description 1
- 206010008631 Cholera Diseases 0.000 description 1
- 241000257465 Echinoidea Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59091377A JPS60234336A (ja) | 1984-05-07 | 1984-05-07 | インナ−リ−ドボンダ− |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59091377A JPS60234336A (ja) | 1984-05-07 | 1984-05-07 | インナ−リ−ドボンダ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60234336A true JPS60234336A (ja) | 1985-11-21 |
| JPH023543B2 JPH023543B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-01-24 |
Family
ID=14024678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59091377A Granted JPS60234336A (ja) | 1984-05-07 | 1984-05-07 | インナ−リ−ドボンダ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60234336A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1984
- 1984-05-07 JP JP59091377A patent/JPS60234336A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH023543B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59161040A (ja) | インナ−リ−ドボンダ− | |
| JP3024457B2 (ja) | 電子部品実装装置および電子部品実装方法 | |
| JPS6320846A (ja) | 外部リ−ド接合装置 | |
| JP6717630B2 (ja) | 電子部品の実装装置 | |
| JPS60234336A (ja) | インナ−リ−ドボンダ− | |
| KR20030060163A (ko) | 반도체 패키지 제조용 테이프의 접착 장치 및 그 방법 | |
| JPH0465845A (ja) | アウターリードボンディング方法 | |
| JP3175737B2 (ja) | 電子部品実装装置および電子部品実装方法 | |
| JPS6245146A (ja) | 治具およびこの治具を有する整列供給装置 | |
| JPH0151055B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JP3049785B2 (ja) | バンプの整形方法 | |
| JPH08148529A (ja) | Ｉｃチップ実装装置及び実装方法 | |
| JPS59186334A (ja) | ボンデイング装置 | |
| JP2785484B2 (ja) | インナーリードボンディング装置およびインナーリードボンディング方法 | |
| JPH032346B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JP3440801B2 (ja) | 電子部品の接合装置 | |
| JPH08139096A (ja) | 電子部品及び電子部品の実装方法並びに電子部品の実装装置 | |
| JPH0547770A (ja) | バンプ形成方法 | |
| JPH04350950A (ja) | チップの位置決め装置 | |
| JPH03129844A (ja) | インナーリードボンデイング装置 | |
| JP3233137B2 (ja) | 電子部品実装装置および電子部品実装方法 | |
| JP2701174B2 (ja) | バンプ付け方法 | |
| JPH08279534A (ja) | ボンディング装置 | |
| JP3351372B2 (ja) | 電子部品実装装置および電子部品実装方法 | |
| JP3473380B2 (ja) | 電子部品の接合装置 |