JPS60233851A - 固体イメ−ジセンサ - Google Patents

固体イメ−ジセンサ

Info

Publication number
JPS60233851A
JPS60233851A JP59075782A JP7578284A JPS60233851A JP S60233851 A JPS60233851 A JP S60233851A JP 59075782 A JP59075782 A JP 59075782A JP 7578284 A JP7578284 A JP 7578284A JP S60233851 A JPS60233851 A JP S60233851A
Authority
JP
Japan
Prior art keywords
groove
photoelectric conversion
light
solid
image sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59075782A
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Yusa
遊佐 厚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp, Olympus Optical Co Ltd filed Critical Olympus Corp
Priority to JP59075782A priority Critical patent/JPS60233851A/ja
Priority to DE19853513196 priority patent/DE3513196A1/de
Publication of JPS60233851A publication Critical patent/JPS60233851A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/1443Devices controlled by radiation with at least one potential jump or surface barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1463Pixel isolation structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
JP59075782A 1984-04-17 1984-04-17 固体イメ−ジセンサ Pending JPS60233851A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59075782A JPS60233851A (ja) 1984-04-17 1984-04-17 固体イメ−ジセンサ
DE19853513196 DE3513196A1 (de) 1984-04-17 1985-04-12 Festkoerper-bildsensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59075782A JPS60233851A (ja) 1984-04-17 1984-04-17 固体イメ−ジセンサ

Publications (1)

Publication Number Publication Date
JPS60233851A true JPS60233851A (ja) 1985-11-20

Family

ID=13586125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59075782A Pending JPS60233851A (ja) 1984-04-17 1984-04-17 固体イメ−ジセンサ

Country Status (2)

Country Link
JP (1) JPS60233851A (de)
DE (1) DE3513196A1 (de)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01281001A (ja) * 1988-04-30 1989-11-13 Kobashi Kogyo Co Ltd トラクタヘの作業機装着装置
JPH0231153U (de) * 1988-08-20 1990-02-27
JPH04369273A (ja) * 1991-06-18 1992-12-22 Fujitsu Ltd 赤外線検知装置
KR100670606B1 (ko) 2005-08-26 2007-01-17 (주)이엠엘에스아이 크로스 토크를 감소시키는 이미지 센서의 소자 분리 구조체및 그 제조방법
JP2007227750A (ja) * 2006-02-24 2007-09-06 Seiko Instruments Inc 半導体装置及び半導体装置の製造方法
JP2014045198A (ja) * 2006-04-25 2014-03-13 Koninklijke Philips Nv (Bi)CMOSプロセスによるアバランシェフォトダイオードの製造方法
JP2015164210A (ja) * 2015-04-16 2015-09-10 ソニー株式会社 固体撮像装置、及び電子機器
US9570500B2 (en) 2009-02-10 2017-02-14 Sony Corporation Solid-state imaging device, method of manufacturing the same, and electronic apparatus
JP2017168869A (ja) * 2017-06-19 2017-09-21 ソニー株式会社 固体撮像装置、及び電子機器
CN108695399A (zh) * 2017-04-04 2018-10-23 浜松光子学株式会社 光半导体装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914301A (en) * 1987-04-21 1990-04-03 Kabushiki Kaisha Toshiba X-ray detector
DE4116694C2 (de) * 1990-05-31 2001-10-18 Fuji Electric Co Ltd Mit einer Fotodiode versehene Halbleitervorrichtung und Verfahren zu ihrer Herstellung
JP2817703B2 (ja) * 1996-04-25 1998-10-30 日本電気株式会社 光半導体装置
TWI251931B (en) * 2004-12-29 2006-03-21 Advanced Chip Eng Tech Inc Imagine sensor with a protection layer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067566A3 (de) * 1981-06-13 1985-08-07 Plessey Overseas Limited Integrierter Lichtdetektor oder -generator mit Verstärker

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01281001A (ja) * 1988-04-30 1989-11-13 Kobashi Kogyo Co Ltd トラクタヘの作業機装着装置
JPH0231153U (de) * 1988-08-20 1990-02-27
JPH04369273A (ja) * 1991-06-18 1992-12-22 Fujitsu Ltd 赤外線検知装置
KR100670606B1 (ko) 2005-08-26 2007-01-17 (주)이엠엘에스아이 크로스 토크를 감소시키는 이미지 센서의 소자 분리 구조체및 그 제조방법
JP2007227750A (ja) * 2006-02-24 2007-09-06 Seiko Instruments Inc 半導体装置及び半導体装置の製造方法
JP4584159B2 (ja) * 2006-02-24 2010-11-17 セイコーインスツル株式会社 半導体装置及び半導体装置の製造方法
JP2014045198A (ja) * 2006-04-25 2014-03-13 Koninklijke Philips Nv (Bi)CMOSプロセスによるアバランシェフォトダイオードの製造方法
US9570500B2 (en) 2009-02-10 2017-02-14 Sony Corporation Solid-state imaging device, method of manufacturing the same, and electronic apparatus
US9647025B2 (en) 2009-02-10 2017-05-09 Sony Corporation Solid-state imaging device, method of manufacturing the same, and electronic apparatus
US9799698B2 (en) 2009-02-10 2017-10-24 Sony Corporation Solid-state imaging device having improved light-collection, method of manufacturing the same, and electronic apparatus
US10141365B2 (en) 2009-02-10 2018-11-27 Sony Corporation Solid-state imaging device having improved light-collection, method of manufacturing the same, and electronic apparatus
US11735620B2 (en) 2009-02-10 2023-08-22 Sony Group Corporation Solid-state imaging device having optical black region, method of manufacturing the same, and electronic apparatus
JP2015164210A (ja) * 2015-04-16 2015-09-10 ソニー株式会社 固体撮像装置、及び電子機器
CN108695399A (zh) * 2017-04-04 2018-10-23 浜松光子学株式会社 光半导体装置
JP2018181911A (ja) * 2017-04-04 2018-11-15 浜松ホトニクス株式会社 光半導体装置
US11088190B2 (en) 2017-04-04 2021-08-10 Hamamatsu Photonics K.K. Optical semiconductor device
JP2017168869A (ja) * 2017-06-19 2017-09-21 ソニー株式会社 固体撮像装置、及び電子機器

Also Published As

Publication number Publication date
DE3513196A1 (de) 1985-10-17

Similar Documents

Publication Publication Date Title
US7166880B2 (en) Vertical color filter sensor group with carrier-collection elements of different size and method for fabricating such a sensor group
US6894265B2 (en) Vertical color filter sensor group and semiconductor integrated circuit fabrication method for fabricating same
US6841816B2 (en) Vertical color filter sensor group with non-sensor filter and method for fabricating such a sensor group
US7760254B2 (en) Single plate-type color solid-state image sensing device
JPS60233851A (ja) 固体イメ−ジセンサ
US6914314B2 (en) Vertical color filter sensor group including semiconductor other than crystalline silicon and method for fabricating same
JPH09266296A (ja) 固体撮像装置
JPS61133660A (ja) 固体イメ−ジセンサ
CN100573907C (zh) 垂直滤色片传感器组及其制造所用的半导体集成电路制造方法
KR102667510B1 (ko) 이미지 센싱 장치
CN100505321C (zh) 含非晶硅半导体的垂直滤色片传感器组及其制造方法
JP2521789B2 (ja) 固体撮像装置の感光部構造
WO2005119792A1 (en) Vertical color filter sensor group
JPS6242426B2 (de)
JPS63312669A (ja) 固体撮像素子
US6555855B2 (en) Solid state imaging device
JPH01168059A (ja) 固体撮像素子
JP2922688B2 (ja) 赤外固体撮像素子
Sakakibara et al. A 1" format 1.5 M pixel IT-CCD image sensor for an HDTV camera system
JPH03190272A (ja) 固体撮像装置
KR910005407B1 (ko) 매몰형 전하 결합소자
JPH01241161A (ja) 固体撮像装置
JPS60173978A (ja) 固体撮像装置
JPH01248659A (ja) 固体撮像装置
JPS61265865A (ja) 固体撮像素子