JPS60231391A - 電子部品の半田溶解装置 - Google Patents
電子部品の半田溶解装置Info
- Publication number
- JPS60231391A JPS60231391A JP8731284A JP8731284A JPS60231391A JP S60231391 A JPS60231391 A JP S60231391A JP 8731284 A JP8731284 A JP 8731284A JP 8731284 A JP8731284 A JP 8731284A JP S60231391 A JPS60231391 A JP S60231391A
- Authority
- JP
- Japan
- Prior art keywords
- hot air
- duct
- electronic component
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 80
- 238000002844 melting Methods 0.000 title claims description 43
- 230000008018 melting Effects 0.000 title claims description 42
- 238000000034 method Methods 0.000 title claims description 19
- 238000007664 blowing Methods 0.000 claims description 43
- 239000000155 melt Substances 0.000 claims description 7
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 235000014676 Phragmites communis Nutrition 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 206010011224 Cough Diseases 0.000 description 1
- 241001674048 Phthiraptera Species 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 210000003414 extremity Anatomy 0.000 description 1
- 238000001595 flow curve Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 210000003141 lower extremity Anatomy 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8731284A JPS60231391A (ja) | 1984-04-29 | 1984-04-29 | 電子部品の半田溶解装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8731284A JPS60231391A (ja) | 1984-04-29 | 1984-04-29 | 電子部品の半田溶解装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60231391A true JPS60231391A (ja) | 1985-11-16 |
| JPH0234471B2 JPH0234471B2 (enrdf_load_stackoverflow) | 1990-08-03 |
Family
ID=13911320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8731284A Granted JPS60231391A (ja) | 1984-04-29 | 1984-04-29 | 電子部品の半田溶解装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60231391A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02140000A (ja) * | 1988-02-22 | 1990-05-29 | Pace Inc | 電子コンポーネントを基板に着脱するための装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0462664U (enrdf_load_stackoverflow) * | 1990-10-05 | 1992-05-28 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57166378U (enrdf_load_stackoverflow) * | 1981-04-15 | 1982-10-20 | ||
| JPS5874096A (ja) * | 1981-10-28 | 1983-05-04 | 富士通株式会社 | 電子部品自動取外し装置の熱風ノズルユニツトの構造 |
| JPS598342A (ja) * | 1982-06-28 | 1984-01-17 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | はんだ接続されている半導体素子を除去する方法及び装置 |
-
1984
- 1984-04-29 JP JP8731284A patent/JPS60231391A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57166378U (enrdf_load_stackoverflow) * | 1981-04-15 | 1982-10-20 | ||
| JPS5874096A (ja) * | 1981-10-28 | 1983-05-04 | 富士通株式会社 | 電子部品自動取外し装置の熱風ノズルユニツトの構造 |
| JPS598342A (ja) * | 1982-06-28 | 1984-01-17 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | はんだ接続されている半導体素子を除去する方法及び装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02140000A (ja) * | 1988-02-22 | 1990-05-29 | Pace Inc | 電子コンポーネントを基板に着脱するための装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0234471B2 (enrdf_load_stackoverflow) | 1990-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4620659A (en) | Device for attaching modular electronic components to or removing them from an insulative substrate | |
| JPS6249760B2 (enrdf_load_stackoverflow) | ||
| JPH02140000A (ja) | 電子コンポーネントを基板に着脱するための装置 | |
| US4605152A (en) | Device for attaching modular electronic components to or removing them from an insulative substrate | |
| JPS60231391A (ja) | 電子部品の半田溶解装置 | |
| JPH0855601A (ja) | 誘導結合プラズマ分析装置用の試料導入装置 | |
| CN217253495U (zh) | 用于将印刷电路板沿运输方向连续钎焊的钎焊设备 | |
| JP3062456B2 (ja) | 半導体装置の製造用のクリーンルームのファンフィルタユニット駆動監視装置及び駆動制御システム | |
| CN201002161Y (zh) | 焊锡炉改良结构 | |
| JP3443452B2 (ja) | 部品取り外し装置 | |
| CN212070715U (zh) | 一种焊锡机的锡液回流防溅射装置 | |
| CN214212525U (zh) | 一种回流焊机加热装置 | |
| JP2003069212A (ja) | リフロー半田付け装置 | |
| CN204303775U (zh) | 可视化自动空跳晶圆挑粒机 | |
| JPH0437098A (ja) | 部品装着装置及び部品装着方法 | |
| CN109413863A (zh) | 一种pcb机械背钻孔防焊塞孔的加工装置及其加工方法 | |
| JPH0622689Y2 (ja) | チツプ吸着ピンの構造 | |
| CN113337726B (zh) | 一种金属制品铸造件生产用脱硫装置 | |
| JPH01164094A (ja) | 基板スルーホールのはんだ除去装置 | |
| JPS61147030A (ja) | 清浄作業台 | |
| JPH01143762A (ja) | 噴流式はんだ付け装置 | |
| JPH0143868Y2 (enrdf_load_stackoverflow) | ||
| JPH07245476A (ja) | はんだ付け部品取り外し装置 | |
| JPS61232650A (ja) | はんだ付け方法およびその装置 | |
| KR100685656B1 (ko) | 리플로우 납땜기의 타공노즐장치 |