JPH0234471B2 - - Google Patents

Info

Publication number
JPH0234471B2
JPH0234471B2 JP59087312A JP8731284A JPH0234471B2 JP H0234471 B2 JPH0234471 B2 JP H0234471B2 JP 59087312 A JP59087312 A JP 59087312A JP 8731284 A JP8731284 A JP 8731284A JP H0234471 B2 JPH0234471 B2 JP H0234471B2
Authority
JP
Japan
Prior art keywords
hot air
flow path
duct
electronic component
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59087312A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60231391A (ja
Inventor
Hachiji Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP8731284A priority Critical patent/JPS60231391A/ja
Publication of JPS60231391A publication Critical patent/JPS60231391A/ja
Publication of JPH0234471B2 publication Critical patent/JPH0234471B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP8731284A 1984-04-29 1984-04-29 電子部品の半田溶解装置 Granted JPS60231391A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8731284A JPS60231391A (ja) 1984-04-29 1984-04-29 電子部品の半田溶解装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8731284A JPS60231391A (ja) 1984-04-29 1984-04-29 電子部品の半田溶解装置

Publications (2)

Publication Number Publication Date
JPS60231391A JPS60231391A (ja) 1985-11-16
JPH0234471B2 true JPH0234471B2 (enrdf_load_stackoverflow) 1990-08-03

Family

ID=13911320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8731284A Granted JPS60231391A (ja) 1984-04-29 1984-04-29 電子部品の半田溶解装置

Country Status (1)

Country Link
JP (1) JPS60231391A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0462664U (enrdf_load_stackoverflow) * 1990-10-05 1992-05-28

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4972990A (en) * 1988-02-22 1990-11-27 Pace Incorporated Apparatus for removal and installing electronic components with respect to a substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166378U (enrdf_load_stackoverflow) * 1981-04-15 1982-10-20
JPS5874096A (ja) * 1981-10-28 1983-05-04 富士通株式会社 電子部品自動取外し装置の熱風ノズルユニツトの構造
US4444559A (en) * 1982-06-28 1984-04-24 International Business Machines Corporation Process and apparatus for unsoldering solder bonded semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0462664U (enrdf_load_stackoverflow) * 1990-10-05 1992-05-28

Also Published As

Publication number Publication date
JPS60231391A (ja) 1985-11-16

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