JPS60231391A - Method and device for melting solder of electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method and apparatus for melting solder of electronic components, and in particular to a method and apparatus for melting solder of electronic components without adversely affecting adjacent electronic components. The present invention relates to a method and apparatus for removing electronic components from printed circuit boards by melting them with hot air.

PRIOR ART Conventionally, a faulty child component was removed from a printed circuit board by melting the solder on its leads with hot air, but in the conventional method or device, one electronic component There is a fatal drawback in that the hot air used in the solder melting process hits the solder of another electronic component adjacent to the electronic component and melts the solder as well.

Still, the work of melting the solder of the electronic component and the work of removing the electronic component from the printed circuit board are performed separately, which has the drawback of poor work efficiency.

Furthermore, since this device can only be used for electronic components of a specific shape or size, it has the disadvantage that multiple devices having hot air outlets matching the shapes of electronic components are required for electronic components of various shapes. Ta.

Further, due to its structure, the flow velocity of the hot air is not uniform throughout, resulting in temperature differences in the hot air, and the solubility of the solder 1 of the electronic component becomes uneven depending on the location, making it difficult to remove the electronic component from the printed circuit board. There was a drawback. Furthermore, in the conventional example, the electronic components were not removed in conjunction with the rise of the duct, so melting the solder and removing the electronic components had to be done manually using tweezers or the like. Not necessarily, but in the meantime
- There was a drawback that the solder might solidify again.

Purpose The present invention has been made to eliminate the drawbacks of the prior art described above, and its purpose is to apply hot air only to the leads located around specific electronic components on a printed circuit board. The hot air melts the solder in that part while guiding the hot air to the central part surrounded by the lead part 6-1 and discharging it to the outside. The purpose is to melt only the solder of a specific electronic component without touching the electronic component. In addition, other purposes are
This device is provided with a suction mechanism so that when the solder of the electronic component sold at the vending machine melts, the electronic component can be suctioned and automatically removed from the printed circuit board in conjunction with the rise of the duct. This also aims to improve work efficiency. Another purpose is to make the hot air blowing part of this device replaceable, and by replacing it with a hot air blowing part that has a hot air blowing outlet of the same shape and size as the electronic parts, it can be used in various shapes. The purpose is to make it applicable to electronic components. Another object of the present invention is to configure the main part of the duct to include a main flow path for hot air and a sub flow path outside the main flow path in order to guide hot air to electronic components on a printed circuit board, and to extend a predetermined range into the main flow path. By providing a heater, the air sent (by the fan) is rapidly heated to a predetermined temperature, and a portion of the heated hot air is released to the outside via the sub-channel, thereby making the nuclear hot air uniform throughout. The purpose is to melt the solder of the electronic component with a uniform solubility in a predetermined time by guiding the solder to the electronic component on the printed circuit board at a flow rate of . Another purpose is to provide this device with a duct lifting mechanism that allows the hot air blowing part of the duct to be manually moved toward and away from the electronic components on the printed circuit board. To facilitate the removal of the electronic component from the printed circuit board and to facilitate the next positioning of the printed circuit board.

Summary In summary, the method of the present invention is a method for removing the electronic component from the printed circuit board by melting the solder on the lead portion of the electronic component soldered to the printed circuit board using hot air. The device is characterized in that hot air is directed to a central portion surrounded by the lead portion, and is discharged above the central portion. The present invention (second invention) also provides an apparatus for removing the electronic component from the printed circuit board by p-melting the solder of the lead portion of the electronic component soldered to the printed circuit board with hot air. a heater that heats the air sent by the fan; and a duct that guides the hot air heated by the heater to the electronic components on the printed circuit board, the duct configured to allow the hot air to flow downward. and an inner flow path in which hot air flowing from the outer flow path toward the lead portion of the electronic component flows in, rises, and is discharged to the outside. It is. In addition, the present invention (
A third invention provides an apparatus for removing the electronic component from the printed circuit board by melting the solder on the lead portion of the electronic component soldered to the printed circuit board with hot air, the fan of the blower and the air blown by the fan. and a duct that guides hot air heated by the heater to the electronic components on the printed circuit board, the duct includes an outer flow path through which the hot air flows downward, and a duct that guides hot air heated by the heater to the electronic components on the printed circuit board, A flow 9 from the flow path toward the lead portion of the electronic component is connected to an inner flow path through which hot air flows in, rises, and is discharged to the outside, and the duct is directed toward the electronic component. Or, the duct lifting mechanism movable in a direction away from the electronic component and the solder of the lead part of the electronic component are heated.
The present invention is characterized by comprising a suction mechanism for suctioning and removing the electronic component from the printed circuit board after it has been melted by lice. The present invention (fourth invention) also provides an apparatus for removing the electronic component from the printed circuit board by melting the solder on the lead portion of the electronic component soldered to the printed circuit board with hot air, the fan of the blower; The duct includes a heater that heats the air sent by the fan, and a duct that guides the hot air heated by the heater to the electronic components on the printed board, and the duct has an outer side that allows the hot air to flow downward. a hot air blowing section consisting of a flow path and an inner flow path through which hot air flowing from the outer flow path toward the lead portion of the electronic component flows in, rises, and is discharged to the outside; and a nuclear hot air blowing section. and a main section provided between the fan 10- and the fan, and the main section guides the air sent by the fan 10- to the hot air blowing section;
It has a double structure with a sub-flow path through which a part of the air flowing through the main flow path escapes to the outside, and the heater is disposed over a predetermined range in the main flow path, and the fan The sent air is rapidly heated to a predetermined temperature by the heater, and a portion of the heated hot air escapes to the outside from the sub-flow path, thereby uniformizing the flow rate of the hot air as a whole and improving the temperature distribution of the hot air. '#I' indicates that the uniformity has been achieved.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained below based on embodiments shown in the drawings. 1st
4, the solder bath disassembly f1 for electronic components includes a base 2, a support 3 provided upright on the base, and a lift mechanism 4 that connects the support in the vertical direction. The duct 5 is movably supported.

The duct 5 includes an air introduction section 6, a main section 7 that heats the air introduced from the air introduction section, and a hot air blowing section 8 that discharges hot air heated by the main section. An air inlet 6b is formed on the top surface 6a of the air inlet 6, and a support plate 10 is installed above the air inlet 6b across the air inlet 6b, and a support plate 10 is mounted above the air inlet 6b, and a support plate 10 is mounted on the support plate to pass the air. A ring-shaped air introduction member 11 is disposed adjacent to and concentric with the inlet 6b, and a fan 12 is disposed inside thereof. A motor 13 is fixed to the lower surface of the support plate 10, and a rotation shaft 13a of the motor
extends above the support plate in a customary manner through the support plate;
The fan 12 is fixed to the rotating shaft at its center, and the core fan and motor constitute a blower 16. Also duct 5
The main body 7 includes a rectangular vertical conduit 9 and a rectangular auxiliary conduit 9a extending laterally from the conduit below the conduit, and an outer conduit 9.
0, and a flange 9b is formed at the top of the vertical conduit, whereby the vertical conduit 9 is connected to the lower end of the air introduction part 6 and forms the bottom part 6C of the air introduction part. There is.

The main body 7 of the duct 5 further includes an inner conduit 91 disposed within the outer conduit 90 in combination therewith. The inner conduit has a cylindrical vertical conduit 92, the top of which is formed with a rectangular flange 92a, and the lower end of the n1 section cut out laterally to form a pair of wings 92b. Inner conduit 9
1 is inserted into the outer conduit 90, and the pair of wings fit into the inner surface of the ridge of the auxiliary conduit 9a of the outer conduit to function as a stopper to prevent the inner conduit from coming out of the outer conduit. It has become. In this case, the flange 92a of the inner conduit 91 rests on the flange 91 of the outer conduit 90, with its top opening 92c constricting the top-portion 9C of the outer conduit 90.

In this way, the main body part 7 of the duct 50 has a double structure consisting of the outer conduit 90 and the inner conduit 91, and this double structure allows the air to be introduced from the air introduction part 6 to be connected to the inner main stream 20 of the reservoir and the outer side. A sub-flow path 21 is formed, and the sub-flow 18 is communicated with the outside through a hole 9d formed in one side of the vertical conduit 9 of the outer conduit 90. The sub-flow path is the air flowing upstream of the air in the air introduction section 6 (I'1116
It is provided so that the air passing through the main channel can escape to the outside through the sub-channel. A heater support shaft 14 is inserted into the heater mounting section 20 and fixed to the lower end of the motor 13 provided in the air introduction section 6 so as to extend downward concentrically with the rotary shaft 13a of the motor.
4a, and a nichrome wire is wound around the heater receiving portion a predetermined number of times over a predetermined range to form a heater 15. Note that the diameter of the heater mounting portion 14a of the heater support shaft 14 is the diameter of the main flow path 20,
That is, the air flowing through the core main flow channel, which is set at a predetermined dimension with respect to the diameter of the inner conduit 91, flows in the immediate vicinity of the heater 15, so that the air introduced into the heater rapidly rises to a predetermined temperature. ing.

The hot air blowing part 8 of the duct 5 has an outer wall 8a extending in the vertical direction and an outer wall 8b extending in the horizontal direction to form a vertical part 80 having an air outlet 20 at the upper end and an overall opening 21 at the lower end. An outer wall 8 extending laterally at the upper side of the vertical part.
b forms a mounting portion 81 whose lateral end is projected as an opening 2214-. Further, in the hot air blowing section 8, an inner wall 8c extending in the vertical direction passes through the vertical portion 80 and opens at the lower end thereof, and forms an inner flow path 82 for hot air that communicates with the outside through the air outlet 20 at the upper end. , an outer flow path 83 of hot air is formed around the inner flow path and communicates with the opening 22 of the mounting portion 81 projecting laterally, so that the hot air flowing through the outer flow path can be connected to the leads 30 around the electronic component 30.
It hits the solder 31 of a and is guided to the center of the hindlimb electronic component, flows into the inner flow path 82, and is discharged above the center. The hot air blowing section 8 can be removably attached to the auxiliary conduit 9c of the main body 7 by fitting its attachment section 81 into the auxiliary conduit 9c of the main body 7. Therefore, the hot air blowing section 8 can be attached to the auxiliary conduit 9c of the main body 7 in various ways depending on the shape or size of the electronic component. It is designed so that it can be attached to the main body 7.

A suction mechanism 4o for suctioning the electronic component 30 is provided in the inner flow path 82 of the vertical portion 80 of the hot air blowing portion 8. The adsorption mechanism consists of a rod 40a, a suspension member 40b fixed to the upper end of the rod, and a magnet 40c fixed to the lower end of the rod. It is slightly longer than the axial length of. Moreover, the suspension member 40b crosses the upper air outlet 20 of the inner flow path 82 of the hot air blowing part 8 without sealing it, and is placed on the upper end of the vertical part 80, and the magnet 40c is placed on the upper end of the vertical part 80.
is suspended at a position slightly below the opening 21 below the vertical portion 80 via the rod 40a.

Another suction mechanism 50 shown in FIG. 5 may be used for the suction mechanism 400s. The suction mechanism is a vertical part 8 of the hot air blowing part 8.
0, a conduit 50a disposed in the inner flow path 82, an air suction type suction cup 50b fixed to the lower end of the conduit, and a conduit 50a protruding upward and outward from the inner flow path 82 of the vertical portion.
A vacuum source 50c such as a vacuum pump is provided at the upper end of the suction cup 50b.
It can be moved up and down along the inner flow path 82 via the conduit 50a, and the electronic component 30 can be attracted or released by the operation of the vacuum pump 50c.

Further, the duct 5 is supported by the support body 3 at its air introduction portion 6 via a duct lifting mechanism 4. The duct lowering mechanism 4
, a slide plate 42 fixed to one side of the air introduction part 6 via a pair of brackets 41, a guide plate 43 fixed to the support body 3, a vertical part 44a and a horizontal part 44 at the top thereof.
b, and a positioning member 44 fixed to the support body at the vertical portion, one side of the air introduction part 6 and the slide plate 4.
2, and a positioning screw 46 that passes through the horizontal portion 44b of the positioning member 44 and is screwed into the block. The positioning screw has a head 46a, so that by properly screwing the screw into the block 45, the head cooperates with the horizontal portion 44b of the positioning member 44 to determine the downward position of the duct 5 when in use. It looks like this. Further, the slide plate 42 has a protruding race 4 on its outer surface over the entire length of the slide plate 42 in the long plane direction.
2a is formed, and the race engages with a guide groove (not shown) formed in the guide plate 43, so that the duct 5 is connected to the support body 3.
It is possible to slide up and down in the directions of arrows A and B. In this case, the lower position of the duct 5 is determined by the cooperation between the upper surface of the horizontal part 44b of the positioning member 44 and the head 46a of the screw 46 as described above, and the upper position of the duct 5 is determined by sliding with the lower surface of the horizontal part. It is determined by cooperation with the upper end 42b of the plate 42. A pair of handles 49 are provided on both sides of the air introduction portion 60 of the duct to manually move the duct 5 between the upper and lower positions. The duct in this embodiment consists of an air introduction section 6, a main section 7, and a hot air blowout section 8, which are formed at right angles. The hot air may be provided so that the hot air flows downward through the outer flow path, is guided from the lower end to the inner flow path in the center, and is discharged upward.

1 to 3 and 6, a work plate 25 is provided on the top of the base 2, and on the work plate, a plurality of electronic components 30 each have a lead portion 30a around them. A printed circuit board 32 fixed with solder 31 is properly positioned with respect to the hot air blowing section 8 of the duct 5, and in this case, a specific electronic component on the printed circuit board is placed at the lower end of the hot air blowing section. It is located directly below the opening 21.

Further, an electronic control section (not shown) using a microcomputer is provided inside the base 2, and an operation section, a display section, and the like are provided on the front panel 26 of the base. That is, the electronic control unit is powered on by operating the power switch 60, and at the same time, the blue indicator lamp 61 lights up to indicate that the power has been switched on, and then the start switch 62 is turned on. When operated, the electronic control section repeats a predetermined routine and starts, and at the same time, the red indicator lamp 63 lights up to indicate that the electronic control section has started. Next, when the temperature setting dial 64 is rotated to an arbitrary position at, the temperature obtained at that position is digitally displayed on the temperature display section 6i, and when the set switch 66 is then operated, the temperature displayed on the temperature display section 65 is displayed. is latched in the electronic control section and timer 7
0 is activated, and the temperature displayed on the temperature display section 65 on the time display section 71 digitally displays a specific time required for melting the solder 31 of the electronic component 30. Further, in the count display section 72 of the timer 70, a counter (not shown) that operates during the melting work of the electronic component 300 and the solder 31 counts the time displayed on the time display section 71 and displays this digitally. It has become. Furthermore, a temperature sensor (not shown) that constitutes a part of the electronic control section is provided inside the auxiliary conduit 9a extending laterally of the main section 7 of the duct 50, and measures the temperature of the hot air flowing through the auxiliary conduit. When the temperature of the hot air is detected and there is an error in comparison with the temperature displayed on the display section 65, an error signal is sent to the micro combinator of the electronic control section to correct the temperature of the heater 15. There is.

Function The present invention is constructed as described above, and its function will be explained below. In FIGS. 1 to 3 and 6, first, a hot air blowing section 8 that matches the shape and size of a specific electronic component 30 on a printed circuit board 32 is appropriately selected and attached to the main section 7 of the duct 5. After installation, set the positioning screw 46 of the duct elevator 4 on point a, and set the uppermost position of the duct 5 shown in FIG. 1 and the lowermost position shown in FIG. Set by considering
Next, the plurality of electronic components 30 are each connected to the lead portions 30 around them.
a takes the printed circuit board 32 fixed with solder 31, and attaches the printed circuit board to the base 20 work plate so that one specific electronic component is located directly below the opening 21 at the lower end of the hot air blowing part 8 of the duct 5. 25.

Next, when the power switch 60 of the electronic control section (not shown) by the microcomputer is operated from the OFF side to the ON side, the power is turned on to the electronic control section, and at the same time, the blue indicator lamp 61 lights up and the electronic control section is turned on. Displays that the power is turned on. Next, when the start switch 62 is pressed, the electronic control section repeats a predetermined routine and starts, and at the same time, the red indicator lamp 63 lights up to indicate that the electronic control section has started. Next, turn the temperature setting dial to any position to specify the temperature, for example 250°C, and this value will be displayed digitally on the temperature display section 65. Next, when you operate the set switch 66 from the OFF side to the ON side. The temperature value displayed on the temperature display section is latched in the electronic control section, and at the same time, the timer 70 operates and the temperature (250° C.) displayed on the temperature display section 65 is displayed on the time display section 71 when the electronic component 300 is soldered. The time required for dissolving 31, that is, the number of seconds, is displayed digitally.

Next, the operator grasps the handle 49 of the duct 5 and moves the duct downward from the upper position shown in FIG. lower it until it touches the In this case, the lower end of the outer wall 8a forming the opening 21 at the lower end of the hot air blowing part 8 of the duct 5 is connected to the lead part 30a around the electronic component 30 with a predetermined gap C1 from the upper surface of the printed board 32, as shown in FIG. The lower end of the inner wall 8C of the hot air blowing part 8 surrounds the outer periphery, and the lower end of the inner wall 8C of the electronic component 30 is located along the root of the lead part 3a of the electronic component 30 and at a predetermined gap C1 from the upper surface of the electronic component 30.
Surround it with. 22- The suction mechanism 40 in the hot air blowing section 8 contacts and suctions the cough electronic component with the magnet 40c at its lower end, and at the same time the rod 40a lifts upward, so that the suspension member 40b at the top of the rod does not absorb the hot air. Hot air outlet 20 of blowout section 8
completely open the air outlet by moving upward away from the air outlet.

When the duct 5 reaches the predetermined lowermost position shown in FIG. 3, a microswitch (not shown) operates to rotate the motor 13 in the air introduction part 6 of the duct 5 in the direction of the arrow.
At the same time, the electronic control section is operated, and the temperature value displayed on the temperature display section 65 and latched in the electronic control section is released to the microcomputer, and the combiator processes this value and sends it through the electronic control section. A current corresponding to the position of the limb is applied to the heater in the main part 7 of the duct 5 to heat it. At the same time, a counter (not shown) operates to start counting the value displayed on the time display section 71, and digitally counts the value displayed on the time display section 71 until the counted value reaches a predetermined value.
to be displayed.

While the counter is counting the predetermined value, the motor 13 rotates to rotate the fan 12, and as shown by arrow E, external air is introduced into the air introduction member 1 from the air introduction port 6b of the duct 5.
1 into the air introduction section 6, the air passes through the upstream side 6d of the air introduction section at a constant speed, flows into the main channel 20 of the main body 7, and is heated to a predetermined temperature by the heater 15. heats up rapidly. When the heated hot air reaches the downstream side 23 leading to the hot air outlet 8 of the main channel, the flow velocity on the outside of the right-angled flow is high and low pressure, and the flow velocity on the inside is low and pressure is high, so that the flow curves at right angles. The hot air inside the flow flows into the flow path 21 as shown by the arrow C and escapes to the outside through the hole 9d provided in the outer conduit 9 of the main body 7. As a result, the flow velocity of the hot air is made uniform throughout the downstream side 23, and the temperature distribution is also made uniform.

In this way, the hot air flows into the outer flow path 83 of the hot air blowing part 8 at an overall uniform flow rate, flows downward, and hits the solder 31 of the lead part 30a around the electronic component 30 at a predetermined speed. Dissolve this. In this case, the hot air leaks to the outside from the small gap C1 between the lower end of the hot air blowing part 8 and the upper surface 32a of the printed circuit board 32, but the flow resistance to the outside prevents it from flowing into the inner flow path 82 of the hot air blowing part 8. Since the large resistance of The hot air is discharged from the hot air outlet 20 to the outside as indicated by the arrow G after passing through the -F direction/\b1 of the central portion. Therefore, this hot air does not leak to the outside from the lower end of the hot air blowing section 8 and melt the solder on the leads of other electronic components adjacent to the specific electronic component 30.

During this period, if for some reason an error occurs in the temperature of the hot air compared to the set temperature of 9j', the temperature sensor in the duct 50 and the main body 7 detects this error and sends an error signal to the microcomputer in the electronic control section. The microcomputer receives the nuclear error signal and operates the electronic control unit to adjust the current to the heater 15 to adjust the temperature of the heater and maintain the hot air at a predetermined temperature.

During this time, the counter counts a predetermined time and is set to 25-, and at the same time, the electronic control section stops supplying current to the motor 13 and heater 15.

Therefore, when the operator grasps the handle 49 of the duct 5 and raises the duct through the lifting mechanism 4, the adsorption device $40 in the hot air blowing section 8 of the duct also rises, and the magnet of the adsorption mechanism rises. 40C attracts the electronic component 30 and removes it from the printed circuit board 32. After removing the electronic component from the magnet, when the duct 5 is moved to the lower position again, the microswitch is operated again to operate the electronic control section to supply current to the motor 13 and heater 15, and to remove the electronic component. The control unit operates the counter of the timer 70 to melt the solder on the lead portion of the next electronic component.

Note that when the suction mechanism 50 on the separate male side shown in FIG. When the duct 5 is lowered and the electronic control unit operates, the electronic control unit operates the motor 13.
and the adsorption mechanism 50 at the same time as supplying current to the heater 15.
-26=9 The source 50c is operated and the suction cup 50 is connected via the conduit 50a.
b is activated to suck the electronic component 30 on the printed circuit board 32. When the duct 5 rises, the suction mechanism 50 also rises, and the suction cup 50b removes the electronic component 30 from the printed board 32. When the electronic component is removed from the suction cup 50b, the vacuum source 50C stops operating, and at the same time, the related parts of the electronic control section are reset.

Effect Since the present invention is constructed and operates as described above, hot air is applied only to the lead portion located around a specific electronic component on a printed circuit board, and the hot air melts the solder in that portion. However, since the nuclear hot air is guided to the central part surrounded by the lead part and discharged to the outside, the hot air does not hit other electronic components adjacent to the electronic component, and the soldering of the specific electronic component is prevented. This has the effect that only the liquid can be dissolved. Furthermore, since this device is equipped with an electronic component suction mechanism, it is possible to suction the electronic component and automatically remove it from the printed circuit board once the solder of the electronic component has melted, thereby improving work efficiency. This has the effect of being able to. In addition, since the hot air outlet is replaceable, it can be used for electronic components of various shapes by replacing the hot air outlet with a hot air outlet of the same shape and size as the electronic component. Effects can be obtained. In addition, in order to guide the hot air to the electronic components on the printed circuit board, the main part of the duct is made up of a main flow path and a sub flow path outside the core main flow path, and a heater is provided over a predetermined range in the main flow path. The air being sent is rapidly heated to a predetermined temperature, and a portion of the heated hot air is released to the outside through the sub-channel, so that the core hot air has a uniform flow rate and temperature throughout. The solder of the electronic component is guided to the electronic component on the printed circuit board in a distributed manner, and the solder of the electronic component is melted with uniform solubility in a predetermined time. In addition, a duct lifting/lowering mechanism was installed to allow the hot air blowing part of the duct to be manually moved toward and away from the electronic components on the printed circuit board, so that once the solder melted, the electronic components could be removed from the printed circuit board. The effect is that removal is facilitated and the next positioning of the printed circuit board is facilitated.

[Brief explanation of the drawing]

The drawings relate to embodiments of the present invention; FIG. 1 is a partial vertical cross-sectional side view of a solder melting device for electronic components; and FIG. 2 is a side view of a duct.
Fig. 3 is an enlarged vertical cross-sectional view showing the state in which the solder of the lead part of an electronic component is melted with hot air; Fig. 4 is a part showing the main part of the duct and the hot air blowing part. FIG. 5 is a schematic diagram showing the separate male side of the suction mechanism; FIG. 6 is a front view of the solder melting device for electronic components; FIG.
The figure is a cross-sectional view taken along the line ■-■ in FIG. 6. 1 is a solder melting device for electronic components, 4 is a duct lifting mechanism, 5 is
is a duct, 7 is a main body, 8 is a hot air blower, 12 is a fan, 15 is a heater, 16 is a blower, 30 is an electronic component, 30
A blank lead part, 31 is solder, 32 is a printed circuit board, 40
, 50 is an adsorption mechanism, 82 is an inner flow path, and 83 is an outer flow path. 29- Procedural amendment (voluntary) Manabu Shiga, Commissioner of the Japan Patent Office1, Indication of the case, 1982 Patent Application No. 873122, Title of the invention Method and apparatus for melting solder of electronic parts3, Relationship with the person making the amendment and the case Patent applicant representative: Sentabe Yokota 4, agent: 1931000426 (24)
1137 (Claim) 5, Date of amendment order (]) The title of the invention in the specification of the present application is amended as follows. [Solder melting method and apparatus for electronic components-1 (2) The claims of the present specification are amended as follows. 1. Melt the solder or semi-finished solder on a printed circuit board with hot air, and then blow the hot air onto the lead part located around the part to remove the solder from the center of the 41 strands. 1. A method for melting solder for electronic components, characterized in that 1. the hot air is directed above the central portion t11; a fan for melting the electronic components with hot air; a heater for heating the air sent by the fan; and a duct for guiding the hot air heated by the heater to the electronic components on the printed circuit board; An outer flow path in which the hot air flows downward, and an inner flow path in which the hot air flowing from the outer flow path toward the lead portion of the electronic component flows in, rises up, and is discharged to the outside. An electronic component A characterized by comprising:
A powerful solder melting device. 3. The hot air blowing part of the duct is configured to be detachable from the main body of the duct, and the shape of the hot air blowing part 1110 of the blowing part is configured to be replaceable according to the shape of the electronic component. A solder melting apparatus for electronic components according to claim 2. 4. In a device that uses hot air to melt the solder on the leads of electronic components that are soldered to or to be soldered to a printed circuit board and remove the electronic components from the printed circuit board or solder them to the printed circuit board, ~A heater that heats the air sent by the fan; and 1
A duct is provided which guides the hot air heated by the heater to the electronic components on the printed circuit board.1 The duct includes an outer flow path through which the hot air flows downward, A duct elevating mechanism that can move toward the electronic component or away from the electronic component is provided in the lead portion; A solder melting device for electronic components, characterized by being equipped with a suction mechanism for adding and removing solder from a board. 5. The solder for electronic components according to claim 4, wherein the adsorption mechanism includes a magnet that is provided in the inner flow path of the duct and can be arranged integrally with the duct. Melting equipment. 6. Claim 4, wherein the suction mechanism includes an air suction type suction cup that is installed in the inner flow path of the duct and can be raised integrally with the duct.
A solder melting device attached to electronic component 4 described in Section 4. 7 One screen u'l'FB soldered to the printed circuit board (
Shike i h Z+ In a device that melts the solder on the lead part of an electronic component using hot air to remove the electronic component from the printed circuit board or solder it to the printed circuit board, the fan of the blower and the air blown by the fan are heated. a duct that guides hot air heated by the heater to the electronic components on the printed circuit board, the duct has an outer flow path through which the hot air flows downward; The hot air blowing section is provided between the inner flow path in which the hot air flowing toward the lead portion of the electronic component flows in, rises, and is discharged to the outside, and the hot air blowing section and the fan. The main body includes a main channel that guides the air sent by the fan to the hot air blowing section, and a sub channel that allows a part of the air flowing through the main channel to escape to the outside. The heater is disposed in the main flow channel over a predetermined range, and the air sent by the fan is rapidly heated to a predetermined temperature 1 by the heater, and the heated hot air is heated to a predetermined temperature. A solder melting apparatus for electronic components, characterized in that a part of the solder melts from the sub flow path escapes to the outside, thereby uniformizing the flow velocity of the hot air as a whole and making the temperature distribution of the hot air uniform. (3) Lines 3 to 8 from the top of page 5 of the specification of the present application are amended as follows. [The present invention relates to a method and apparatus for melting solder to electronic components, and particularly relates to a solder melting method and apparatus for melting electronic components by hot air without adversely affecting adjacent electronic components. The present invention relates to a solder melting method and apparatus for removing an electronic component from the printed circuit board or soldering a new electronic component to the printed circuit board. (4) Similarly, make the following corrections from the 122nd line from the top of page 5. "1. The practice was to remove electronic components from the board or solder new electronic components there." (5) Similarly, from the 7th line from the bottom of page 8 to the 10th line from the top of page 11, Correct as shown below. [In short, the method of the present invention is a method in which the solder on the lead portion of an electronic component soldered to or to be soldered to a printed circuit board is melted with hot air, and the electronic component is removed from the printed circuit board or soldered to the printed circuit board. The method is characterized in that hot air is applied to a reed portion located around seven nuclear particles, the hot air is guided to a central portion surrounded by the reed portion, and some of the hot air is discharged above the central portion. be. The present invention (second invention) is to remove the electronic component from the printed circuit board or to remove the electronic component from the printed circuit board by melting the solder on the lead portion of the electronic component soldered to or to be soldered to the printed circuit board with hot air. The soldering apparatus includes a blower fan, a heater that heats the air sent by the fan, and a duct that guides hot air heated by the single-chain heater to the electronic components on the printed circuit board. an outer flow path configured to flow downward; and an inner flow path configured to allow hot air flowing from the outer flow path toward the lead portion of the electronic component to flow therein, double the flow, and be discharged to the outside. It is characterized by having the following. The present invention (third invention) is to remove the electronic component from the printed circuit board or to remove the electronic component from the printed circuit board by melting the solder on the lead part of the electronic component soldered to or to be soldered to the printed circuit board with hot air. The soldering apparatus includes a fan of an X blower, a heater that heats the air sent by the fan, and a duct that guides the hot air heated by the heater to the electronic components of the printed circuit board. An outer flow path in which the hot air flows downward, and an inner flow path in which the hot air flowing from the outer flow path toward the lead portion of the electronic component flows in, rises up, and is discharged to the outside. The duct can be moved in the direction toward or away from the electronic component, and the duct can be moved in the direction toward or away from the electronic component. The present invention (fourth invention) is characterized by comprising a suction mechanism for suctioning components and removing them from the printed circuit board. In an apparatus for melting the solder on the lead portion of an electronic component using hot air to remove the electronic component from the printed circuit board or solder it to the printed circuit board, the fan of an island blower and the heater that heats the air blown by the fan are used. 1. A duct that guides the hot air heated by the heater to the electronic components on the printed circuit board; a hot air blowing section consisting of an inner flow path through which hot air flowing toward the reed section flows in, rises and is discharged to the outside; and a main section provided between the hot air blowing section and the fan; 1. The main body has a double structure consisting of a main channel that guides the air sent by the fan to the hot air blowing section, and a sub-channel that allows a part of the air flowing through the main channel to escape to the outside. The heater is disposed over a predetermined range in the main flow path, and the air sent by the fan is rapidly heated to a predetermined temperature by the heater, and a part of the heated hot air is heated. The present invention is characterized in that the temperature distribution of the hot air is made uniform by uniformizing the flow velocity of the hot air as a whole while escaping from the sub-channel to the outside.-1 (6) Similarly, the eleventh On the 8th line from the bottom of the page, it says “Electronic components -1
The statement has been corrected to read "for electronic components." (7) Similarly, in the first line from the bottom of page 21, ``250'c'' is written, followed by - ``wo''. (8) Similarly, on page 26, change the next line to the 8th line from the bottom and add the following. [! In the method and apparatus of the present invention, not only the electronic component 3o fixed to the printed circuit board 32 is removed, but also a new electronic component coated with cream solder or the like is placed on the thus removed portion. By melting the cream solder in the same manner as described above, the new force sensor component can be soldered to the printed circuit board 32. (9) Similarly, on page 29, from the 5th line to the 6th line from the top, from the 1st line to the 12th line from the top, and from the 14th line from the top, the words ``for electronic parts'' are corrected to ``for electronic parts.'' 10-

Claims (1)

[Scope of Claims] 1. A method of removing the electronic component from the printed circuit board by melting the solder of the lead portion of the electronic component soldered to the printed circuit board with hot air, in which the electronic component is removed from the printed circuit board. 1. A method of melting solder for an electronic component, comprising: applying hot air to a lead portion, guiding the hot air to a central portion surrounded by the lead portion, and discharging the hot air above the central portion. 2. In a device that melts the solder on the lead part of an electronic component soldered to a printed circuit board with hot air and removes the electronic component from the printed circuit board, the fan of the blower and the air blown by the fan are heated. a duct that guides hot air heated by the heater to the electronic components on the printed circuit board, the duct includes an outer flow path through which the hot air flows downward; 1. An apparatus for melting solder for electronic components, comprising: an inner flow path through which hot air flowing toward the lead portion of the electronic component flows in, rises, and is discharged to the outside. 3. The hot air outlet of the duct is configured to be detachable from the main body of the duct, and the shape of the hot air outlet of the outlet is configured to be replaceable to match the shape of the electronic component. A solder melting apparatus for electronic components according to claim 2. 4. A device for removing the electronic component from the printed circuit board by melting the solder on the lead part of the electronic component soldered to the printed circuit board with hot air, which includes a fan of an air blower and a heater that heats the air blown by the fan. and a duct for guiding the hot air heated by the heater to the electronic components on the printed circuit board, the duct has an outer flow path through which the hot air flows downward, and a duct that directs the hot air from the core outer flow path to the electronic components. The duct is connected to an inner flow path through which hot air flowing toward the lead portion of the component flows in, rises, and is discharged to the outside, and the duct is directed toward the electronic component or away from the electronic component. It is characterized by comprising a movable duct lifting mechanism and a suction mechanism for sucking and removing the electronic component from the printed circuit board after the solder of the lead portion of the electronic component is melted by hot air. Solder melting equipment for electronic components. 5. Solder melting of electronic components according to claim 4, wherein the adsorption mechanism includes a magnet that is provided in the inner flow path of the duct and can be raised integrally with the duct. Device. 6. The electronic device according to claim 4, wherein the suction mechanism includes an air suction type suction cup that is provided in the inner flow path of the duct and can be raised integrally with the duct. Solder bath wf equipment for parts. 7. In an apparatus for removing half 81 of the lead portion of an electronic component soldered to a printed circuit board by melting it with hot air and removing the electronic component from the printed circuit board, a fan of an air blower;
The duct includes a heater that heats the air sent by the fan, and a duct that guides the heat generated by the heater to the electronic components on the printed circuit board, and the duct directs the hot air downward. a hot air blowing section consisting of an outer flow path through which hot air flows, and an inner flow path through which hot air flowing from the outside flow path toward the lead portion of the electronic component flows, rises, and is discharged to the outside; and a main section provided between the hot air blowing section and the fan, and the main section includes a main channel that guides the air sent by the fan to the hot air blowing section, and a main section that guides the air sent by the fan to the hot air blowing section, and a main section that guides the air sent by the fan to the hot air blowing section. It has a double structure with a sub-flow path through which a part of the flow escapes to the outside, and the heater is disposed in the main flow path over a predetermined range, and the air sent by the fan is directed to the heater. I) The hot air is rapidly heated to a predetermined temperature V, and a part of the heated hot air escapes from the sub-channel to the outside, thereby uniformizing the flow rate of the hot air as a whole and making the temperature distribution of the hot air uniform. 4t
Solder melting work for electronic parts for H&3.