JPS60229352A - 樹脂封止形半導体装置および樹脂封止方法 - Google Patents

樹脂封止形半導体装置および樹脂封止方法

Info

Publication number
JPS60229352A
JPS60229352A JP59084898A JP8489884A JPS60229352A JP S60229352 A JPS60229352 A JP S60229352A JP 59084898 A JP59084898 A JP 59084898A JP 8489884 A JP8489884 A JP 8489884A JP S60229352 A JPS60229352 A JP S60229352A
Authority
JP
Japan
Prior art keywords
heat sink
resin
semiconductor device
heat radiating
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59084898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0318741B2 (enExample
Inventor
Shiyuuichirou Kuneta
久祢田　修一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP59084898A priority Critical patent/JPS60229352A/ja
Publication of JPS60229352A publication Critical patent/JPS60229352A/ja
Publication of JPH0318741B2 publication Critical patent/JPH0318741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W72/0198—
    • H10W74/111—
    • H10W72/01515—
    • H10W72/075—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59084898A 1984-04-26 1984-04-26 樹脂封止形半導体装置および樹脂封止方法 Granted JPS60229352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59084898A JPS60229352A (ja) 1984-04-26 1984-04-26 樹脂封止形半導体装置および樹脂封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59084898A JPS60229352A (ja) 1984-04-26 1984-04-26 樹脂封止形半導体装置および樹脂封止方法

Publications (2)

Publication Number Publication Date
JPS60229352A true JPS60229352A (ja) 1985-11-14
JPH0318741B2 JPH0318741B2 (enExample) 1991-03-13

Family

ID=13843554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59084898A Granted JPS60229352A (ja) 1984-04-26 1984-04-26 樹脂封止形半導体装置および樹脂封止方法

Country Status (1)

Country Link
JP (1) JPS60229352A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750030A (en) * 1983-01-17 1988-06-07 Nec Corporation Resin-molded semiconductor device having heat radiating plate embedded in the resin
JPH07130915A (ja) * 1993-11-04 1995-05-19 Goto Seisakusho:Kk 半導体装置用放熱板及びその製造方法
JP2018117019A (ja) * 2017-01-17 2018-07-26 三菱電機株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750030A (en) * 1983-01-17 1988-06-07 Nec Corporation Resin-molded semiconductor device having heat radiating plate embedded in the resin
JPH07130915A (ja) * 1993-11-04 1995-05-19 Goto Seisakusho:Kk 半導体装置用放熱板及びその製造方法
JP2018117019A (ja) * 2017-01-17 2018-07-26 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0318741B2 (enExample) 1991-03-13

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