JPS60227439A - 輸送装置 - Google Patents

輸送装置

Info

Publication number
JPS60227439A
JPS60227439A JP6400585A JP6400585A JPS60227439A JP S60227439 A JPS60227439 A JP S60227439A JP 6400585 A JP6400585 A JP 6400585A JP 6400585 A JP6400585 A JP 6400585A JP S60227439 A JPS60227439 A JP S60227439A
Authority
JP
Japan
Prior art keywords
piston
air
block
hole
bore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6400585A
Other languages
English (en)
Japanese (ja)
Inventor
ジヨージ・バンツ
ジヨージ・エス・イヴアルデイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Biosystems Inc
Original Assignee
Perkin Elmer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perkin Elmer Corp filed Critical Perkin Elmer Corp
Publication of JPS60227439A publication Critical patent/JPS60227439A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • B65G54/025—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic the load being magnetically coupled with a piston-like driver moved within a tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • De-Stacking Of Articles (AREA)
  • Actuator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP6400585A 1984-03-29 1985-03-29 輸送装置 Pending JPS60227439A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59500584A 1984-03-29 1984-03-29
US595005 1984-03-29

Publications (1)

Publication Number Publication Date
JPS60227439A true JPS60227439A (ja) 1985-11-12

Family

ID=24381310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6400585A Pending JPS60227439A (ja) 1984-03-29 1985-03-29 輸送装置

Country Status (3)

Country Link
JP (1) JPS60227439A (de)
DE (1) DE3504021A1 (de)
GB (1) GB2156582A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3608783A1 (de) * 1986-03-15 1987-09-17 Telefunken Electronic Gmbh Gasphasen-epitaxieverfahren und vorrichtung zu seiner durchfuehrung
JPS636857A (ja) * 1986-06-26 1988-01-12 Fujitsu Ltd ウエ−ハ移し替え装置
US4846626A (en) * 1987-02-09 1989-07-11 The Perkin-Elmer Corporation Wafer handling system
GB9006471D0 (en) * 1990-03-22 1990-05-23 Surface Tech Sys Ltd Loading mechanisms
USH1373H (en) * 1992-04-06 1994-11-01 American Telephone And Telegraph Company Wafer handling apparatus and method
GB2266992A (en) * 1992-05-06 1993-11-17 Surface Tech Sys Ltd Apparatus for loading semi-conductor wafers
US5377816A (en) * 1993-07-15 1995-01-03 Materials Research Corp. Spiral magnetic linear translating mechanism
US5711647A (en) * 1994-10-17 1998-01-27 Aesop, Inc. Method of and apparatus for locating and orientating a part on a gripper and transferring it to a tool while maintaining location and orientation on the tool
US6672819B1 (en) * 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
US5833426A (en) * 1996-12-11 1998-11-10 Applied Materials, Inc. Magnetically coupled wafer extraction platform
US6005226A (en) * 1997-11-24 1999-12-21 Steag-Rtp Systems Rapid thermal processing (RTP) system with gas driven rotating substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1317105A (en) * 1971-02-18 1973-05-16 Marine Eng Co Stockport Ltd Fluid operated device for moving articles
DE2948204C2 (de) * 1979-11-30 1982-06-16 Festo-Maschinenfabrik Gottlieb Stoll, 7300 Esslingen Druckmittelbetätigter Stellantrieb für eine Arbeits- oder Transportvorrichtung

Also Published As

Publication number Publication date
GB2156582A (en) 1985-10-09
GB8502074D0 (en) 1985-02-27
DE3504021A1 (de) 1985-10-03

Similar Documents

Publication Publication Date Title
JP4389424B2 (ja) 被処理体の搬送機構及び処理システム
JP3394293B2 (ja) 試料の搬送方法および半導体装置の製造方法
KR100329287B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법과 반도체 장치
JP3644036B2 (ja) 半導体装置の製造方法および半導体製造装置
JPS60227439A (ja) 輸送装置
EP0565001A1 (de) Geschlossener Behälter für Gebrauch in einem Reinraum
JPH0774227A (ja) マイクロ環境下のロードロック
JPH07115120A (ja) 基板搬送装置およびその方法
US6352265B1 (en) Seal ring using gas curtain
Cong et al. Coaxial twin-shaft magnetic fluid seals applied in vacuum wafer-handling robot
EP0528405A2 (de) Umgebungsluftfreies Verarbeitungssystem
KR960035792A (ko) 반도체 제조장치
US6443618B1 (en) Particulate free air bearing and seal
EP0106510B1 (de) Bearbeitungsgerät mit einer Vorrichtung zur Erzeugung eines lokalisierten Vakuums
JPH07122618A (ja) 真空処理装置
US11056277B2 (en) Magnetized substrate carrier apparatus with shadow mask for deposition
JPH0446781A (ja) 真空内磁気浮上搬送ロボット
JP2001233450A (ja) 横搬送機構
JPH0410553A (ja) 半導体基板搬送用チャッキング装置、半導体基板サセプタおよび半導体基板非接触クリーン搬送装置
JPS62264128A (ja) ウエハ真空処理装置
JP2003229476A (ja) 摩擦を生じないドア部材を有する基板収納容器
JPH06181249A (ja) 基板搬送システム
JPS61240647A (ja) 半導体製造装置
JPH081475A (ja) ターンテーブル装置
JPS62219509A (ja) 真空装置内の基板搬送機構