JPS60227439A - Transporting device - Google Patents
Transporting deviceInfo
- Publication number
- JPS60227439A JPS60227439A JP6400585A JP6400585A JPS60227439A JP S60227439 A JPS60227439 A JP S60227439A JP 6400585 A JP6400585 A JP 6400585A JP 6400585 A JP6400585 A JP 6400585A JP S60227439 A JPS60227439 A JP S60227439A
- Authority
- JP
- Japan
- Prior art keywords
- piston
- air
- block
- hole
- bore
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G54/00—Non-mechanical conveyors not otherwise provided for
- B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
- B65G54/025—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic the load being magnetically coupled with a piston-like driver moved within a tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- De-Stacking Of Articles (AREA)
- Actuator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 産業上の利用分野： ＩＣの製造は多数の処理工程を必要とする。[Detailed description of the invention] Industrial applications: Manufacturing ICs requires numerous processing steps.
たとえばシリコンウニノ・上に回路パターンを形成する
際ウェハはまず予備アライナ、次に作業部、最後に貯蔵
カセットへ送られる。同様ウェハはＩＣの重要製造工程
である被覆、現像およびエツチング過程の間、種々に処
理し、輸送しなければならない。For example, when forming circuit patterns on silicon wafers, the wafers are first sent to a pre-aligner, then to a working station, and finally to a storage cassette. Similarly, wafers must be handled and transported during the coating, developing, and etching steps that are critical to the fabrication of ICs.
従来の技術：
現在使用されている多（の輸送装置はクエ／’ｔを空気
膜上で処理部から処理部へ輸送する空気軌道を使用する
複雑な機械的配置である◇これらの装置はしばしば信頼
性に欠け、さらに重要なことにウニノ・のエツジが互い
に接触することに基（粒子発生により汚染が生ずる。こ
のように発生した粒子は空気流によって運ばれ、ウェハ
の表面に沈積する。PRIOR TECHNOLOGY: Current transport devices in use are complex mechanical arrangements that use air trajectories to transport the que/'t from treatment section to treatment section on an air film. These devices often It is unreliable and, more importantly, due to the contact of the edges of the wafers with each other, contamination occurs due to the generation of particles, which are carried by the air flow and deposited on the surface of the wafer.
発明が解決しようとする問題点：
本発明の目的は粒子による汚染を完全に除去した簡単で
精密な信頼性ある装置を得ることである。Problem to be solved by the invention: The object of the invention is to obtain a simple, precise and reliable device completely free of particle contamination.
問題点を解決するための手段：
本発明は空気ペアリングブδツクが空気ノセーに空気薄
膜により滑動可能に支持されるウニノ・輸送装置に関す
る。ブロックは１つまたは多数のマグネットを有する。Means for Solving the Problems: The present invention relates to a transport device in which an air pairing book is slidably supported by a thin air film in an air container. A block has one or multiple magnets.
空気パーは中心の孔内に配置したピストン装置を有する
。ピストン装置も１つまたは多数のマグネットを有し、
空気パーの中心孔内で運動する際ピストン装置と空気ベ
アリングブロックは磁気的に結合して空気ベアリングブ
ロックを空気・ぐ−に沿って空気膜を介してピストン装
置の運動と一体に運動させる。空気ベアリングブロック
はウェハまたは類似デ・々イスを支持するための延長部
を有する。The air par has a piston arrangement located within a central bore. The piston device also has one or multiple magnets,
During movement within the central hole of the air par, the piston device and the air bearing block are magnetically coupled to cause the air bearing block to move along the air gap through the air film in unison with the movement of the piston device. The air bearing block has an extension for supporting a wafer or similar device.
実施例： 第１図は本発明による輸送装置ｉｏを示す。Example: FIG. 1 shows a transport device io according to the invention.
この装置は任意の所望長さの空気パー１１を有する。断
面が矩形の空気〕々−１１は硬質陽極酸化したアルミニ
ウムからなり、たとえばマサチューセッツのドーパ−社
（Ｄｏｖｅｒ Ｃｏｍｐ、）の製造する市販部材である
。空気−：−１１はピストン装置■３を収容するための
全長にわたって貫通する円形の中心孔１２を有し、ピス
トン装置は第２図によって後述するように孔１２内で往
復運動する。This device has an air par 11 of any desired length. The air holes 11, which are rectangular in cross section, are made of hard anodized aluminum, such as commercially available parts manufactured by Dover Comp of Massachusetts. Air:-11 has a circular central hole 12 extending throughout its length for housing a piston device 3, which reciprocates within the hole 12 as will be explained below with reference to FIG.
ピストン装置１３は非鉄金属スペーサ１５によって分離
された２つまたは多数の希土類マグネット１４からなる
。The piston device 13 consists of two or multiple rare earth magnets 14 separated by a non-ferrous metal spacer 15.
空気ベアリングブロック１６は空気ノζ−１１に、空気
ベアリングブロック１６と空気ノζ−３３が互いに物理
的に接触せず、摩擦のない相対運動が可能なように、滑
動可能に支持される。空気膜は２１〜２．８ ｋｇ／
ｔｙｉＹ （３０〜４０ ｐｓｉ ）の圧力の空気源（
図示されず）へ接続した導管１７によって得られる。Air bearing block 16 is slidably supported on air shaft ζ-11 such that air bearing block 16 and air shaft ζ-33 are not in physical contact with each other, allowing for frictionless relative movement. Air film is 21-2.8 kg/
Air source (30-40 psi) pressure
(not shown) by a conduit 17 connected to the
空気ベアリングブロック１６も非鉄金属スペーサ１９に
よって分離した２つまたは多数の希土類マグネット１８
からなる。The air bearing block 16 also includes two or multiple rare earth magnets 18 separated by a non-ferrous metal spacer 19.
Consisting of
ピストン装置１３と空気ベアリングブロック１６の間の
磁気的結合により、空気ベアリングブロック１６はピス
トン装置１３が空気ノζ−１１の孔１２内で往復運動す
る際その運動に正確に追ずいする。Due to the magnetic coupling between the piston arrangement 13 and the air bearing block 16, the air bearing block 16 precisely follows the movement of the piston arrangement 13 as it reciprocates within the bore 12 of the air hole ζ-11.
第１図によればピストン装置１３および空気ベアリング
ブロック１６は３つのマグネットおよび２つのスペーサ
からなるように示されるけれど、第２図で各装置が２つ
のマグネットおよび１つのススーサを有するように、所
望により増減して使用しうろことが指摘される。Although piston device 13 and air bearing block 16 are shown in FIG. 1 as consisting of three magnets and two spacers, it may be desired to have each device in FIG. It is pointed out that it may be used more or less depending on the situation.
さらに第１図にはウェハ２１または類似のデノ々イスを
輸送するため空気ベアリングブロック１６に固定した延
長部またはフィンが２０が示される。ウェハ２１は導管
２３を介して真空源（図示されず）へ接続した真空ポー
ト２２により延長部２０に支持される。Also shown in FIG. 1 are extensions or fins 20 secured to air bearing block 16 for transporting wafers 21 or similar devices. Wafer 21 is supported on extension 20 by a vacuum port 22 connected via conduit 23 to a vacuum source (not shown).
本発明の輸送装置の作業の場合、ウェハな貯蔵九セット
３０から取出し、それをたとえば予備アライナ３１また
は他の作業部へ輸送する。In operation of the transport device of the invention, a wafer is removed from the storage set 30 and transported, for example to a pre-aligner 31 or to another working station.
空気パー１１は十分長（選択され、ウェハは貯蔵力セラ
）３１から通路に沿った種々の作業部にそれを配置する
ように出口カセットへ送る。Air par 11 is sent from a sufficient length (selected, wafer storage cellar) 31 to an exit cassette to place it at various working stations along the path.
第２図は孔１２内に配置したピストン装置１３の詳細を
示すため空気パー１１の断面を示す。FIG. 2 shows a cross-section of the air par 11 to show details of the piston device 13 located within the bore 12. FIG.
図示のようにピストン装置１３は非鉄金属スペーサ１５
によって分離した２つの希土類マグネット１４からなる
。ピストン装置の終端部にはテフロンシール２５ 、２
６ カあり、このシールはピストン装置１３の気密シー
ルおよび支持体として役立つ。ピストン装置１３の各端
部のボルトおよびワッシャ２７および２８はピストン装
置を締付保持する。テフロンシール２５ 、２６、マグ
ネット１４およびスペーサ１５は円筒形非鉄金属ゼデー
２９を中心に配置したほぼ環状の部材である。As shown in the figure, the piston device 13 has a non-ferrous metal spacer 15
It consists of two rare earth magnets 14 separated by. At the end of the piston device there are Teflon seals 25, 2.
6, which serves as a gas-tight seal and support for the piston device 13. Bolts and washers 27 and 28 at each end of piston device 13 hold the piston device tightly. The Teflon seals 25 and 26, the magnet 14, and the spacer 15 are substantially annular members arranged around a cylindrical non-ferrous metal 29.
第２図の空気ベアリングブロック１６は空気パー１１に
配置した２つの希土類マグネット１８および非鉄金属ス
ペーサ１９からなる。前記のように空気ベアリングブロ
ック１６１はマグネット１４および１８の磁気的結合力
によりピストン装置１３とともに動（。The air bearing block 16 of FIG. 2 consists of two rare earth magnets 18 and a non-ferrous metal spacer 19 arranged on the air par 11. As mentioned above, the air bearing block 161 moves together with the piston device 13 due to the magnetic coupling force of the magnets 14 and 18.
孔１２内のピストン装置１３を動かす特殊な方法が輸送
装置１０の１つの側に対して示され、図示されない他の
側にも同様の配置がある。A special method of moving the piston device 13 within the bore 12 is shown for one side of the transport device 10, and there is a similar arrangement on the other side, not shown.
シール３２は空気・々−１１の端部を閉鎖する。Seal 32 closes off the end of air 11.
シール３２を貫通する導管３３は孔１２の内部をバルブ
装置３４を介して圧縮空気源３５と結合する。バルブ装
置３４は常用のものであり、遮断バルブ３７およびニー
ドル、２ルブ３６かもなる。図示されていないけれど、
シール３２およびバルブ装置３４と同様のシールおよび
バルブ装置が空気パー１１の他端に配置される。A conduit 33 passing through the seal 32 connects the interior of the bore 12 with a source of compressed air 35 via a valve arrangement 34 . The valve device 34 is conventional and also includes a shut-off valve 37 and a needle, 2-lube 36. Although not shown,
A seal and valve arrangement similar to seal 32 and valve arrangement 34 is located at the other end of air par 11.
ピストン装置１３したがって空気ベアリングブロック１
６を右側へ動かすため、圧縮空気が孔１２へ遮断弁３７
を介して供給され、ピストン装置１３の他の側の空気は
ニードルバルブ３６に対応するニードルバルブを介して
逃げる。Piston device 13 and therefore air bearing block 1
6 to the right, compressed air enters the hole 12 through the isolation valve 37.
The air on the other side of the piston device 13 escapes through a needle valve corresponding to the needle valve 36.
同様ピストン装置１３したがって空気ベアリングブロッ
ク１６を左側へ動かすため、圧縮空気が圧縮空気源３５
および遮断弁３７と同様の遮断弁３７を介してピストン
装置の右側へ供給される。空気はピストン装置が孔１２
内の空気ヲ押スので、ニードル、Ｓルゾ３６を介して逃
ケる。ニードルバルブの使用により空気は制御下に逃げ
ることができ、ピストン装置１３および空気ベアリング
ブロック１６のきわめて均一な運動が達成される。Similarly, in order to move the piston device 13 and therefore the air bearing block 16 to the left, compressed air is supplied to the compressed air source 35.
and is supplied to the right side of the piston device via a shut-off valve 37 similar to shut-off valve 37. Air is supplied to the piston device through hole 12.
Since the air inside is pushed out, it escapes through the needle and S luzo 36. The use of needle valves allows air to escape in a controlled manner and a very uniform movement of the piston arrangement 13 and air bearing block 16 is achieved.
ピストン装置１３の運動のため圧縮空気以外の手段を使
用することができる。たとえばピストン１３はスクリュ
ー装置、チェーン、ケーブル等を介して動かすこともで
き、これらはすべて汚染要素がツク−内にシールされる
ので汚染が生じない。Means other than compressed air can be used for the movement of the piston device 13. For example, the piston 13 can also be moved via a screw device, chain, cable, etc., all of which are free from contamination since the contaminating elements are sealed within the gear.
第１図は本発明の装置の斜視図、第２図はピストン装置
を有する空気・々−の縦断面図である。
１０・・・輸送装置、１１・・・空気・々−１１２・・
・孔、１３・・・ピストン装置、１４．１８・・・マグ
ネット、１５．１９・・・スペーサ、１６・・・空気ヘ
アリングブロック、２０・・・延長部、２１・・・ウェ
ハ、２２・・・真空ポート、２５，２６．３２・・・シ
ール、３４・・・・ζルブ装置、３５・・・圧縮空気源
＝Ｎ Ｆｌ ４−づご二ｇよFIG. 1 is a perspective view of the device according to the invention, and FIG. 2 is a longitudinal sectional view of an air tank with a piston device. 10...Transport device, 11...Air, etc.-112...
- Hole, 13... Piston device, 14.18... Magnet, 15.19... Spacer, 16... Air hair ring block, 20... Extension part, 21... Wafer, 22... ...Vacuum port, 25, 26. 32... Seal, 34... Zeta-lube device, 35... Compressed air source = N Fl 4-Zugo 2g
Claims (1)
動可能に支持されるブロック装置、孔の中に配置したピ
ストン装置、孔の中のピストン装置を動かす装置、およ
びブロック装置をピストン装置と一体に動かすためピス
トン装置およびブロック装置に備えたマグネット装置か
らなることを特徴とする輸送装置。 ２、 マグネット装置がピストン装置およびブロック装
置のそれぞれに少なくとも２つのマグネットを有する特
許請求の範囲第１項記載の装置。 ３、 マグネットが非鉄金属材料によって分離されてい
る特許請求の範囲第２項記載の装置。 ４、 パー装置とブロック装置の間に空気の薄膜を形成
するため、ブロック装置に接続した装置を有する特許請
求の範囲第１項記載の装置。 ５ ブロック装置がブロック、ウニノ・または同様のデ
ノ々イスを支持するためこのブロックに固定した延長装
置、ウニノーまたは同様のデノ々イスをこの延長装置に
保持するため、延長装置に真空を適用する真空装置を有
する特許請求の範囲第１項記載の装置。 ６、 孔の中のピストンを動かす装置が圧縮空気源、圧
縮空気源とピストン装置の１つの側の孔の間に接続した
第１／々ルゾ装置、圧縮空気源とピストン装置の他の側
の孔の間に接続した第２ノ々ルプ装置を有し、第１およ
び第２バルブ装置のそれぞれが、ピストン装置を孔内で
第１または第２方向へ動かすようにこの孔へ空気を供給
する遮断ノζルブ装置およびピストン装置が第２または
第１方向へ動かされる際、空気を制御した速度で孔から
逃がす第１および第２二−ドルノ々ルプからなる特許請
求の範囲第１項記載の装置。 ７、ノζ−装置が矩形である特許請求の範囲第１項記載
の装置。 ８ パー装置が硬質陽極酸化したアルミニウムからなる
特許請求の範囲第７項記載の装置。[Claims] 1. A device having a hole passing through it, a block device slidably supported on this device, a piston device disposed in the hole, and a device for moving the piston device in the hole. 1. A transportation device comprising: a device; and a magnet device provided on the piston device and the block device for moving the block device together with the piston device. 2. The device according to claim 1, wherein the magnet device has at least two magnets in each of the piston device and the block device. 3. The device according to claim 2, wherein the magnets are separated by a non-ferrous metal material. 4. The apparatus of claim 1, further comprising a device connected to the block device for forming a thin film of air between the par device and the block device. 5 A block device is fixed to a block, an extension device for supporting a block, a unicorn or similar device, and a vacuum is applied to the extension device in order to hold the unicorn or similar device to this extension device. An apparatus according to claim 1, comprising a vacuum device for. 6. The device for moving the piston in the hole is a source of compressed air, a first/part Luso device connected between the source of compressed air and the hole on one side of the piston device, a source of compressed air and a first Luzo device connected between the source of compressed air and the hole on the other side of the piston device; a second valve device connected between the bore, each of the first and second valve devices supplying air to the bore to move the piston device in the first or second direction within the bore; Claim 1 comprising first and second second-door nodules for allowing air to escape from the bore at a controlled rate when the shutoff nozzle device and the piston device are moved in the second or first direction. Device. 7. The device according to claim 1, wherein the device is rectangular. 8. The device of claim 7, wherein the par device is made of hard anodized aluminum.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US595005 | 1975-07-11 | ||
| US59500584A | 1984-03-29 | 1984-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60227439A true JPS60227439A (en) | 1985-11-12 |
Family
ID=24381310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6400585A Pending JPS60227439A (en) | 1984-03-29 | 1985-03-29 | Transporting device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS60227439A (en) |
| DE (1) | DE3504021A1 (en) |
| GB (1) | GB2156582A (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3608783A1 (en) * | 1986-03-15 | 1987-09-17 | Telefunken Electronic Gmbh | Gas-phase epitaxial method and apparatus for carrying it out |
| JPS636857A (en) * | 1986-06-26 | 1988-01-12 | Fujitsu Ltd | Wafer transfer device |
| US4846626A (en) * | 1987-02-09 | 1989-07-11 | The Perkin-Elmer Corporation | Wafer handling system |
| GB9006471D0 (en) * | 1990-03-22 | 1990-05-23 | Surface Tech Sys Ltd | Loading mechanisms |
| USH1373H (en) * | 1992-04-06 | 1994-11-01 | American Telephone And Telegraph Company | Wafer handling apparatus and method |
| GB2266992A (en) * | 1992-05-06 | 1993-11-17 | Surface Tech Sys Ltd | Apparatus for loading semi-conductor wafers |
| US5377816A (en) * | 1993-07-15 | 1995-01-03 | Materials Research Corp. | Spiral magnetic linear translating mechanism |
| US5711647A (en) * | 1994-10-17 | 1998-01-27 | Aesop, Inc. | Method of and apparatus for locating and orientating a part on a gripper and transferring it to a tool while maintaining location and orientation on the tool |
| US6672819B1 (en) * | 1995-07-19 | 2004-01-06 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
| US5833426A (en) * | 1996-12-11 | 1998-11-10 | Applied Materials, Inc. | Magnetically coupled wafer extraction platform |
| US6005226A (en) * | 1997-11-24 | 1999-12-21 | Steag-Rtp Systems | Rapid thermal processing (RTP) system with gas driven rotating substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1317105A (en) * | 1971-02-18 | 1973-05-16 | Marine Eng Co Stockport Ltd | Fluid operated device for moving articles |
| DE2948204C2 (en) * | 1979-11-30 | 1982-06-16 | Festo-Maschinenfabrik Gottlieb Stoll, 7300 Esslingen | Pressure medium-operated actuator for a work or transport device |
-
1985
- 1985-01-28 GB GB08502074A patent/GB2156582A/en not_active Withdrawn
- 1985-02-06 DE DE19853504021 patent/DE3504021A1/en not_active Withdrawn
- 1985-03-29 JP JP6400585A patent/JPS60227439A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3504021A1 (en) | 1985-10-03 |
| GB8502074D0 (en) | 1985-02-27 |
| GB2156582A (en) | 1985-10-09 |
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