JPS60227438A - ウェーハ取扱い装置 - Google Patents
ウェーハ取扱い装置Info
- Publication number
- JPS60227438A JPS60227438A JP60058667A JP5866785A JPS60227438A JP S60227438 A JPS60227438 A JP S60227438A JP 60058667 A JP60058667 A JP 60058667A JP 5866785 A JP5866785 A JP 5866785A JP S60227438 A JPS60227438 A JP S60227438A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chamber
- carrier
- integrated circuit
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims description 156
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 25
- 230000007246 mechanism Effects 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000001493 electron microscopy Methods 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Specific Conveyance Elements (AREA)
- Manipulator (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/593,287 US4604020A (en) | 1984-03-26 | 1984-03-26 | Integrated circuit wafer handling system |
| US593287 | 1984-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60227438A true JPS60227438A (ja) | 1985-11-12 |
| JPH0240216B2 JPH0240216B2 (enExample) | 1990-09-10 |
Family
ID=24374164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60058667A Granted JPS60227438A (ja) | 1984-03-26 | 1985-03-25 | ウェーハ取扱い装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4604020A (enExample) |
| JP (1) | JPS60227438A (enExample) |
| DE (1) | DE3510933C2 (enExample) |
| GB (1) | GB2156451B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787084B2 (ja) * | 1985-02-06 | 1995-09-20 | 株式会社日立製作所 | 真空装置の試料交換機構 |
| US4966519A (en) * | 1985-10-24 | 1990-10-30 | Texas Instruments Incorporated | Integrated circuit processing system |
| US6103055A (en) * | 1986-04-18 | 2000-08-15 | Applied Materials, Inc. | System for processing substrates |
| CA1331163C (en) * | 1986-04-18 | 1994-08-02 | Applied Materials, Inc. | Multiple-processing and contamination-free plasma etching system |
| US5102495A (en) * | 1986-04-18 | 1992-04-07 | General Signal Corporation | Method providing multiple-processing of substrates |
| US5308431A (en) * | 1986-04-18 | 1994-05-03 | General Signal Corporation | System providing multiple processing of substrates |
| US4699555A (en) * | 1986-05-08 | 1987-10-13 | Micrion Limited Partnership | Module positioning apparatus |
| US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
| US5098245A (en) * | 1989-02-24 | 1992-03-24 | U.S. Philips Corporation | High speed wafer handler |
| EP0384524A3 (en) * | 1989-02-24 | 1991-10-23 | North American Philips Corporation | Wafer transfer system |
| KR0170391B1 (ko) * | 1989-06-16 | 1999-03-30 | 다카시마 히로시 | 피처리체 처리장치 및 처리방법 |
| US5248371A (en) * | 1992-08-13 | 1993-09-28 | General Signal Corporation | Hollow-anode glow discharge apparatus |
| JP3021359U (ja) * | 1995-03-28 | 1996-02-20 | 有限会社ユニ | 鞄 |
| US5833426A (en) * | 1996-12-11 | 1998-11-10 | Applied Materials, Inc. | Magnetically coupled wafer extraction platform |
| DE19956982C2 (de) * | 1998-11-28 | 2002-11-14 | Mirae Corp | Trägerhandhabungsvorrichtung für eine IC-Baustein-Handhabungseinrichtung |
| US6271606B1 (en) * | 1999-12-23 | 2001-08-07 | Nikon Corporation | Driving motors attached to a stage that are magnetically coupled through a chamber |
| US6977014B1 (en) | 2000-06-02 | 2005-12-20 | Novellus Systems, Inc. | Architecture for high throughput semiconductor processing applications |
| US6712907B1 (en) * | 2000-06-23 | 2004-03-30 | Novellus Systems, Inc. | Magnetically coupled linear servo-drive mechanism |
| US6860965B1 (en) | 2000-06-23 | 2005-03-01 | Novellus Systems, Inc. | High throughput architecture for semiconductor processing |
| US6444935B1 (en) * | 2000-10-18 | 2002-09-03 | Electro Scientific Industries, Inc. | High speed track shutter system for semi-conductor inspection |
| JP2002261147A (ja) * | 2001-03-02 | 2002-09-13 | Seiko Instruments Inc | 真空装置および搬送装置 |
| CN1996552B (zh) * | 2001-08-31 | 2012-09-05 | 克罗辛自动化公司 | 晶片机 |
| US7893313B2 (en) * | 2001-12-18 | 2011-02-22 | Artley John W | Reusable incontinence product with insolubilized polyethylene glycol and DMDHEU |
| USD530352S1 (en) * | 2005-02-25 | 2006-10-17 | Harmotec Co., Ltd. | Bernoulli effect air nozzle for silicone wafer pickup tool |
| US20140064888A1 (en) * | 2012-09-06 | 2014-03-06 | Texas Instruments Incorporated | Appartaus for handling an electronic device and related methodology |
| CN112928049B (zh) * | 2021-01-31 | 2022-08-05 | 红蜂维尔(山东)自动化技术有限公司 | 一种晶片压覆装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US654134A (en) * | 1900-05-17 | 1900-07-24 | Abner G Clark | Sawbuck. |
| US3202406A (en) * | 1960-07-27 | 1965-08-24 | Clevite Corp | Furnace apparatus and conveyor therefor |
| US3968885A (en) * | 1973-06-29 | 1976-07-13 | International Business Machines Corporation | Method and apparatus for handling workpieces |
| US3993018A (en) * | 1975-11-12 | 1976-11-23 | International Business Machines Corporation | Centrifugal support for workpieces |
| US4392435A (en) * | 1979-08-03 | 1983-07-12 | United Kingdom Atomic Energy Authority | Transport apparatus |
| US4306731A (en) * | 1979-12-21 | 1981-12-22 | Varian Associates, Inc. | Wafer support assembly |
| JPS57194531A (en) * | 1981-05-26 | 1982-11-30 | Toshiba Corp | Electron beam transfer device |
| US4465416A (en) * | 1982-05-17 | 1984-08-14 | The Perkin-Elmer Corporation | Wafer handling mechanism |
| JPS59222922A (ja) * | 1983-06-01 | 1984-12-14 | Nippon Telegr & Teleph Corp <Ntt> | 気相成長装置 |
| US4500407A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Disk or wafer handling and coating system |
-
1984
- 1984-03-26 US US06/593,287 patent/US4604020A/en not_active Expired - Fee Related
-
1985
- 1985-03-12 GB GB08506310A patent/GB2156451B/en not_active Expired
- 1985-03-25 JP JP60058667A patent/JPS60227438A/ja active Granted
- 1985-03-26 DE DE3510933A patent/DE3510933C2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| GB8506310D0 (en) | 1985-04-11 |
| DE3510933C2 (de) | 1995-08-24 |
| JPH0240216B2 (enExample) | 1990-09-10 |
| US4604020A (en) | 1986-08-05 |
| DE3510933A1 (de) | 1985-11-14 |
| GB2156451B (en) | 1987-08-05 |
| GB2156451A (en) | 1985-10-09 |
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