JPS60224248A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS60224248A JPS60224248A JP59080049A JP8004984A JPS60224248A JP S60224248 A JPS60224248 A JP S60224248A JP 59080049 A JP59080049 A JP 59080049A JP 8004984 A JP8004984 A JP 8004984A JP S60224248 A JPS60224248 A JP S60224248A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plating
- plated
- bump
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 230000004888 barrier function Effects 0.000 claims abstract description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 25
- 238000009792 diffusion process Methods 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 239000012190 activator Substances 0.000 abstract description 9
- 238000002161 passivation Methods 0.000 abstract description 4
- 238000000059 patterning Methods 0.000 abstract description 3
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 13
- 229910052718 tin Inorganic materials 0.000 description 10
- 229910000990 Ni alloy Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000013016 damping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012362 glacial acetic acid Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 208000025174 PANDAS Diseases 0.000 description 1
- 208000021155 Paediatric autoimmune neuropsychiatric disorders associated with streptococcal infection Diseases 0.000 description 1
- 240000000220 Panda oleosa Species 0.000 description 1
- 235000016496 Panda oleosa Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59080049A JPS60224248A (ja) | 1984-04-23 | 1984-04-23 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59080049A JPS60224248A (ja) | 1984-04-23 | 1984-04-23 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60224248A true JPS60224248A (ja) | 1985-11-08 |
| JPH0129064B2 JPH0129064B2 (enrdf_load_stackoverflow) | 1989-06-07 |
Family
ID=13707382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59080049A Granted JPS60224248A (ja) | 1984-04-23 | 1984-04-23 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60224248A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997003465A1 (en) * | 1995-07-12 | 1997-01-30 | Hitachi, Ltd. | Semiconductor pellet, method of its packaging, and bump electrode |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4847273A (enrdf_load_stackoverflow) * | 1971-10-15 | 1973-07-05 | ||
| JPS51117574A (en) * | 1975-04-08 | 1976-10-15 | Seiko Epson Corp | Semiconductor equipment |
| JPS5524414A (en) * | 1978-08-09 | 1980-02-21 | Hitachi Ltd | Electrode forming process |
-
1984
- 1984-04-23 JP JP59080049A patent/JPS60224248A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4847273A (enrdf_load_stackoverflow) * | 1971-10-15 | 1973-07-05 | ||
| JPS51117574A (en) * | 1975-04-08 | 1976-10-15 | Seiko Epson Corp | Semiconductor equipment |
| JPS5524414A (en) * | 1978-08-09 | 1980-02-21 | Hitachi Ltd | Electrode forming process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997003465A1 (en) * | 1995-07-12 | 1997-01-30 | Hitachi, Ltd. | Semiconductor pellet, method of its packaging, and bump electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129064B2 (enrdf_load_stackoverflow) | 1989-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3952404A (en) | Beam lead formation method | |
| US5492235A (en) | Process for single mask C4 solder bump fabrication | |
| US3761309A (en) | Ctor components into housings method of producing soft solderable contacts for installing semicondu | |
| US4182781A (en) | Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating | |
| US5208186A (en) | Process for reflow bonding of bumps in IC devices | |
| EP0382080A2 (en) | Bump structure for reflow bonding of IC devices | |
| US3760238A (en) | Fabrication of beam leads | |
| JPH05335313A (ja) | インジウムバンプの製造方法 | |
| JPS62145758A (ja) | パラジウムを用いる銅製ボンデイングパツドの酸化防止法 | |
| JPS63122248A (ja) | 半導体装置の製造方法 | |
| JPS6112047A (ja) | 半導体装置の製造方法 | |
| JPS60224248A (ja) | 半導体装置の製造方法 | |
| JP3446021B2 (ja) | 半導体装置のバンプ電極構造およびその形成方法 | |
| JPH0697663B2 (ja) | 半導体素子の製造方法 | |
| JPS636850A (ja) | 電子部品の製造方法 | |
| JP2730492B2 (ja) | 半導体装置 | |
| JPH02224336A (ja) | 半導体装置の製造方法 | |
| KR960011857B1 (ko) | 반도체 장치 및 그 제조방법 | |
| JPS6329940A (ja) | 半導体装置の製造方法 | |
| JPH0590271A (ja) | バンプ電極形成方法 | |
| JPH03190240A (ja) | 半導体装置の製造方法 | |
| JP3308882B2 (ja) | 半導体装置の電極構造の製造方法 | |
| JP2839513B2 (ja) | バンプの形成方法 | |
| JPH04278542A (ja) | 半導体装置及びその製造方法 | |
| JPH0684919A (ja) | フリップチップ形半導体装置のフェイスダウンボンディング用バンプ電極及びその作製方法 |