JPS60223137A - 増加したボンデイング表面積を有するリ−ドワイヤボンデイング - Google Patents

増加したボンデイング表面積を有するリ−ドワイヤボンデイング

Info

Publication number
JPS60223137A
JPS60223137A JP60035402A JP3540285A JPS60223137A JP S60223137 A JPS60223137 A JP S60223137A JP 60035402 A JP60035402 A JP 60035402A JP 3540285 A JP3540285 A JP 3540285A JP S60223137 A JPS60223137 A JP S60223137A
Authority
JP
Japan
Prior art keywords
bonding
tool
bonding tool
wedge
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60035402A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0421341B2 (enExample
Inventor
ジヨン　エイ．カーツ
ドナルド　イー．コーセンズ
マーク　デイ．デユーフオー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
Original Assignee
Fairchild Camera and Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera and Instrument Corp filed Critical Fairchild Camera and Instrument Corp
Publication of JPS60223137A publication Critical patent/JPS60223137A/ja
Publication of JPH0421341B2 publication Critical patent/JPH0421341B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H10W72/07141—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP60035402A 1984-02-27 1985-02-26 増加したボンデイング表面積を有するリ−ドワイヤボンデイング Granted JPS60223137A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/584,083 US4597519A (en) 1984-02-27 1984-02-27 Lead wire bonding with increased bonding surface area
US584083 1984-02-27

Publications (2)

Publication Number Publication Date
JPS60223137A true JPS60223137A (ja) 1985-11-07
JPH0421341B2 JPH0421341B2 (enExample) 1992-04-09

Family

ID=24335867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60035402A Granted JPS60223137A (ja) 1984-02-27 1985-02-26 増加したボンデイング表面積を有するリ−ドワイヤボンデイング

Country Status (3)

Country Link
US (1) US4597519A (enExample)
EP (1) EP0154579A3 (enExample)
JP (1) JPS60223137A (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824005A (en) * 1986-08-13 1989-04-25 Orthodyne Electronics Corporation Dual mode ultrasonic generator in a wire bonding apparatus
JPS63194343A (ja) * 1987-02-09 1988-08-11 Toshiba Corp ワイヤボンディング装置の制御方法
US4817848A (en) * 1988-05-12 1989-04-04 Hughes Aircraft Company Compliant motion servo
JPH088285B2 (ja) * 1990-02-23 1996-01-29 株式会社東芝 ワイヤボンディング方法
US5459672A (en) * 1990-07-30 1995-10-17 Hughes Aircraft Company Electrical interconnect integrity measuring method
US5225647A (en) * 1991-11-04 1993-07-06 Unitek Equipment Inc. Motorized weld head
US5386092A (en) * 1991-11-04 1995-01-31 Unitek Equipment Inc. Fast response weld head
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
US5929521A (en) 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
JP3370551B2 (ja) * 1997-04-02 2003-01-27 株式会社新川 ワイヤボンディング装置及びそのボンディング荷重補正方法
US6079607A (en) * 1997-04-29 2000-06-27 Texas Instruments Incorporated Method for high frequency bonding
JP3370556B2 (ja) * 1997-05-14 2003-01-27 株式会社新川 ワイヤボンディング装置及びその制御方法
JPH1140595A (ja) * 1997-07-16 1999-02-12 Mitsubishi Electric Corp ワイヤ配線方法、このワイヤ配線方法に使用する配線分岐パッド、および、ボンディング装置、並びに、ワイヤ配線方法をコンピュータに実行させるためのプログラムを記録したコンピュータ読み取り可能な記録媒体
JPH11191568A (ja) * 1997-12-25 1999-07-13 Shinkawa Ltd ワイヤボンディング方法及び装置
US6039234A (en) * 1998-06-16 2000-03-21 Kulicke & Soffa Investments, Inc. Missing wire detector
US6279810B1 (en) * 2000-02-23 2001-08-28 Asm Assembly Automation Ltd Piezoelectric sensor for measuring bonding parameters
JP4202617B2 (ja) * 2001-03-16 2008-12-24 矢崎総業株式会社 被覆電線の超音波接合方法およびその方法を用いた超音波接合装置
EP1310319B1 (de) * 2001-11-07 2006-09-06 F & K Delvotec Bondtechnik GmbH Prüfverfahren für Bondverbindungen und Drahtbonder
KR20030066344A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
US7777321B2 (en) * 2002-04-22 2010-08-17 Gann Keith D Stacked microelectronic layer and module with three-axis channel T-connects
US6806559B2 (en) * 2002-04-22 2004-10-19 Irvine Sensors Corporation Method and apparatus for connecting vertically stacked integrated circuit chips
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
US8302840B2 (en) * 2007-05-16 2012-11-06 Kulicke And Soffa Industries, Inc. Closed loop wire bonding methods and bonding force calibration
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
US7669751B2 (en) 2007-09-25 2010-03-02 Silverbrook Research Pty Ltd Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards
US8023269B2 (en) * 2008-08-15 2011-09-20 Siemens Energy, Inc. Wireless telemetry electronic circuit board for high temperature environments
EP2199732B1 (de) * 2008-12-19 2017-10-11 Klingelnberg AG Vorrichtung mit Rauheitsmesstaster
KR101477520B1 (ko) * 2013-02-25 2014-12-30 아이엘지에너지기술(주) 이동식 온풍기
US9165902B2 (en) * 2013-12-17 2015-10-20 Kulicke And Soffa Industries, Inc. Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
CN108778601A (zh) * 2016-03-18 2018-11-09 本田技研工业株式会社 超声波焊接装置和超声波焊接方法
DE102021101654A1 (de) * 2021-01-26 2022-07-28 Hesse Gmbh Verfahren zum Betreiben einer Ultraschallverbindungsvorrichtung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
US4234117A (en) * 1978-05-26 1980-11-18 Foulke Richard F Vibration-free tailless wire bonder
US4390771A (en) * 1981-05-11 1983-06-28 Fairchild Camera & Instrument Corp. Bonding wire ball forming method and apparatus
US4438880A (en) * 1981-08-17 1984-03-27 Orthodyne Electronics Corporation Ultrasonic wire bond touchdown sensor

Also Published As

Publication number Publication date
JPH0421341B2 (enExample) 1992-04-09
EP0154579A2 (en) 1985-09-11
EP0154579A3 (en) 1987-07-29
US4597519A (en) 1986-07-01

Similar Documents

Publication Publication Date Title
JPS60223137A (ja) 増加したボンデイング表面積を有するリ−ドワイヤボンデイング
JPS60206036A (ja) ボンド力の変化及び制御
KR950009619B1 (ko) 반도체장치의 와이어 본딩방법
CN103069557B (zh) 引线环、形成引线环的方法及相关处理
JPS63194343A (ja) ワイヤボンディング装置の制御方法
US4053096A (en) Thermocompression welding device
US20010004991A1 (en) Wire bonding method and apparatus
US5221037A (en) Wire bonding method and apparatus
JPH02231736A (ja) ワイヤボンデイング方法
JPS5826524Y2 (ja) ハンドウタイワイヤボンダソウチ
JP3644575B2 (ja) ワイヤボンディング装置
JP2002076049A (ja) ワイヤボンディング装置及び電気部品の製造方法
JP3124653B2 (ja) ワイヤボンディング方法
JPH06291161A (ja) ワイヤボンディング装置
JP3221191B2 (ja) ボンディング装置及びボンディング方法
JPH02199846A (ja) ワイヤボンディング方法
JPH0786327A (ja) ワイヤボンディング方法および装置
JP2860650B2 (ja) ワイヤボンディング方法
JPH08236573A (ja) ワイヤボンディング装置
JPH0124931Y2 (enExample)
JP3060852B2 (ja) ワイヤボンディング方法
JPH07130785A (ja) ワイヤボンディング方法
JPH0653221A (ja) バンプ形成方法
JP2003273150A (ja) ワイヤボンディング方法及び装置
JP2767302B2 (ja) ワイヤボンディング方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term