JPS60219013A - ダイシング装置 - Google Patents

ダイシング装置

Info

Publication number
JPS60219013A
JPS60219013A JP59077028A JP7702884A JPS60219013A JP S60219013 A JPS60219013 A JP S60219013A JP 59077028 A JP59077028 A JP 59077028A JP 7702884 A JP7702884 A JP 7702884A JP S60219013 A JPS60219013 A JP S60219013A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
thickness
dicing
wafer
suction table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59077028A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0146293B2 (enExample
Inventor
大施戸　治郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59077028A priority Critical patent/JPS60219013A/ja
Publication of JPS60219013A publication Critical patent/JPS60219013A/ja
Publication of JPH0146293B2 publication Critical patent/JPH0146293B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP59077028A 1984-04-16 1984-04-16 ダイシング装置 Granted JPS60219013A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59077028A JPS60219013A (ja) 1984-04-16 1984-04-16 ダイシング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59077028A JPS60219013A (ja) 1984-04-16 1984-04-16 ダイシング装置

Publications (2)

Publication Number Publication Date
JPS60219013A true JPS60219013A (ja) 1985-11-01
JPH0146293B2 JPH0146293B2 (enExample) 1989-10-06

Family

ID=13622289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59077028A Granted JPS60219013A (ja) 1984-04-16 1984-04-16 ダイシング装置

Country Status (1)

Country Link
JP (1) JPS60219013A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62297015A (ja) * 1986-06-14 1987-12-24 Kikukawa Tekkosho:Kk 多層基板用切断機
JPS6374605A (ja) * 1986-09-18 1988-04-05 株式会社　東京精密 半導体ウエ−ハのダイシング方法及びその装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62297015A (ja) * 1986-06-14 1987-12-24 Kikukawa Tekkosho:Kk 多層基板用切断機
JPS6374605A (ja) * 1986-09-18 1988-04-05 株式会社　東京精密 半導体ウエ−ハのダイシング方法及びその装置

Also Published As

Publication number Publication date
JPH0146293B2 (enExample) 1989-10-06

Similar Documents

Publication Publication Date Title
US9446522B2 (en) Presence sensing and position correction for wafer on a carrier ring
JP5948034B2 (ja) アライメント方法
US6195619B1 (en) System for aligning rectangular wafers
CN102696093B (zh) 包含视觉系统的晶片装卸器
US9418908B2 (en) Wafer processing method
CN102347276A (zh) 切削方法
CN117878017B (zh) 一种晶圆定位纠偏方法、系统及装置
TW201737377A (zh) 封裝晶圓之加工方法
KR20110122447A (ko) 반도체 패키지 집합체 정렬방법
US6943364B2 (en) Multi-functioned wafer aligner
JP2995435B2 (ja) チップ自動選別搬送装置
US10553490B2 (en) Processing method for wafer
US6682295B2 (en) Flatted object passive aligner
SG185017A1 (en) Method for aligning semiconductor materials
JPH0146293B2 (enExample)
JPH08124994A (ja) ペレット分類装置
US12374587B2 (en) Method of processing workpiece
TWI810429B (zh) 切割裝置的原點位置登錄方法
JPH10118891A (ja) ベアリング内外輪の切削装置
JPH09260460A (ja) ウエハ搬送装置および方法ならびに半導体露光装置
US12573090B2 (en) Encapsulation positioning mark method
JPH0312919A (ja) サセプタの回転停止位置検出方法及び気相成長装置
JP3931121B2 (ja) 被検査品の外観検査方法
JPH07130806A (ja) カーフチェック方法
JPH01209740A (ja) 半導体基板の位置決め方法