JPH0146293B2 - - Google Patents

Info

Publication number
JPH0146293B2
JPH0146293B2 JP7702884A JP7702884A JPH0146293B2 JP H0146293 B2 JPH0146293 B2 JP H0146293B2 JP 7702884 A JP7702884 A JP 7702884A JP 7702884 A JP7702884 A JP 7702884A JP H0146293 B2 JPH0146293 B2 JP H0146293B2
Authority
JP
Japan
Prior art keywords
semiconductor wafer
wafer
thickness
dicing
suction table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7702884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60219013A (ja
Inventor
Jiro Oosedo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59077028A priority Critical patent/JPS60219013A/ja
Publication of JPS60219013A publication Critical patent/JPS60219013A/ja
Publication of JPH0146293B2 publication Critical patent/JPH0146293B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP59077028A 1984-04-16 1984-04-16 ダイシング装置 Granted JPS60219013A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59077028A JPS60219013A (ja) 1984-04-16 1984-04-16 ダイシング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59077028A JPS60219013A (ja) 1984-04-16 1984-04-16 ダイシング装置

Publications (2)

Publication Number Publication Date
JPS60219013A JPS60219013A (ja) 1985-11-01
JPH0146293B2 true JPH0146293B2 (enExample) 1989-10-06

Family

ID=13622289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59077028A Granted JPS60219013A (ja) 1984-04-16 1984-04-16 ダイシング装置

Country Status (1)

Country Link
JP (1) JPS60219013A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62297015A (ja) * 1986-06-14 1987-12-24 Kikukawa Tekkosho:Kk 多層基板用切断機
JP2579469B2 (ja) * 1986-09-18 1997-02-05 株式会社 東京精密 半導体ウエ−ハのダイシング方法及びその装置

Also Published As

Publication number Publication date
JPS60219013A (ja) 1985-11-01

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