JPS60215723A - 半導体機器のリード材用銅合金 - Google Patents

半導体機器のリード材用銅合金

Info

Publication number
JPS60215723A
JPS60215723A JP5345185A JP5345185A JPS60215723A JP S60215723 A JPS60215723 A JP S60215723A JP 5345185 A JP5345185 A JP 5345185A JP 5345185 A JP5345185 A JP 5345185A JP S60215723 A JPS60215723 A JP S60215723A
Authority
JP
Japan
Prior art keywords
alloy
lead material
strength
copper alloy
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5345185A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0218376B2 (enrdf_load_stackoverflow
Inventor
Masahiro Tsuji
正博 辻
Michiharu Yamamoto
山本 道晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Kogyo KK
Eneos Corp
Original Assignee
Nihon Kogyo KK
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Kogyo KK, Nippon Mining Co Ltd filed Critical Nihon Kogyo KK
Priority to JP5345185A priority Critical patent/JPS60215723A/ja
Publication of JPS60215723A publication Critical patent/JPS60215723A/ja
Publication of JPH0218376B2 publication Critical patent/JPH0218376B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
JP5345185A 1985-03-19 1985-03-19 半導体機器のリード材用銅合金 Granted JPS60215723A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5345185A JPS60215723A (ja) 1985-03-19 1985-03-19 半導体機器のリード材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5345185A JPS60215723A (ja) 1985-03-19 1985-03-19 半導体機器のリード材用銅合金

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP23370183A Division JPS59145748A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS60215723A true JPS60215723A (ja) 1985-10-29
JPH0218376B2 JPH0218376B2 (enrdf_load_stackoverflow) 1990-04-25

Family

ID=12943217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5345185A Granted JPS60215723A (ja) 1985-03-19 1985-03-19 半導体機器のリード材用銅合金

Country Status (1)

Country Link
JP (1) JPS60215723A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114981459A (zh) * 2020-12-23 2022-08-30 韩国材料研究院 包含g相的铜-镍-硅-锰合金及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54402A (en) * 1977-06-02 1979-01-05 Kokusai Kikou Kk Work of protecting normal plane suitable for planting and its method of construction
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS57116738A (en) * 1981-01-10 1982-07-20 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor apparatus
JPS58124257A (ja) * 1982-01-20 1983-07-23 Kobe Steel Ltd 熱間加工性に優れた集積回路のリ−ドフレ−ム用銅合金
JPS58177442A (ja) * 1982-04-08 1983-10-18 Kobe Steel Ltd リ−ドフレ−ム用高強度銅合金の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54402A (en) * 1977-06-02 1979-01-05 Kokusai Kikou Kk Work of protecting normal plane suitable for planting and its method of construction
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS57116738A (en) * 1981-01-10 1982-07-20 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor apparatus
JPS58124257A (ja) * 1982-01-20 1983-07-23 Kobe Steel Ltd 熱間加工性に優れた集積回路のリ−ドフレ−ム用銅合金
JPS58177442A (ja) * 1982-04-08 1983-10-18 Kobe Steel Ltd リ−ドフレ−ム用高強度銅合金の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114981459A (zh) * 2020-12-23 2022-08-30 韩国材料研究院 包含g相的铜-镍-硅-锰合金及其制备方法

Also Published As

Publication number Publication date
JPH0218376B2 (enrdf_load_stackoverflow) 1990-04-25

Similar Documents

Publication Publication Date Title
JPS6045698B2 (ja) 半導体機器用リ−ド材
JPS6314056B2 (enrdf_load_stackoverflow)
JPS5834537B2 (ja) 耐熱性の良好な高力導電用銅合金
JPS6058783B2 (ja) 半導体機器のリ−ド材用銅合金の製造方法
JPS59170231A (ja) 高力導電銅合金
JPS60218440A (ja) リ−ドフレ−ム用銅合金
JPS59145749A (ja) 半導体機器のリ−ド材用銅合金
JPS6239218B2 (enrdf_load_stackoverflow)
JP3049137B2 (ja) 曲げ加工性が優れた高力銅合金及びその製造方法
JPS6215621B2 (enrdf_load_stackoverflow)
JPS594493B2 (ja) 半導体機器のリ−ド材用銅合金
JPH02118037A (ja) 酸化膜密着性に優れた高力高導電性銅合金
JPS6256937B2 (enrdf_load_stackoverflow)
JPS60215723A (ja) 半導体機器のリード材用銅合金
JPS6157379B2 (enrdf_load_stackoverflow)
JPS6142772B2 (enrdf_load_stackoverflow)
JPS59145748A (ja) 半導体機器のリ−ド材用銅合金
JPS6393835A (ja) 半導体機器のリ−ド材用銅合金
JP2597773B2 (ja) 異方性が少ない高強度銅合金の製造方法
JPS6213823B2 (enrdf_load_stackoverflow)
JPS5853700B2 (ja) 半導体機器のリ−ド材用銅合金
JPH0310036A (ja) 半導体機器用リード材
JPS5818981B2 (ja) 半導体機器のリ−ド材用銅合金
JPH0219432A (ja) 半導体機器リード材又は導電性ばね材用高力高導電銅合金
JPH02129326A (ja) 高力銅合金