JPS6213823B2 - - Google Patents

Info

Publication number
JPS6213823B2
JPS6213823B2 JP55183967A JP18396780A JPS6213823B2 JP S6213823 B2 JPS6213823 B2 JP S6213823B2 JP 55183967 A JP55183967 A JP 55183967A JP 18396780 A JP18396780 A JP 18396780A JP S6213823 B2 JPS6213823 B2 JP S6213823B2
Authority
JP
Japan
Prior art keywords
weight
alloy
copper
conductivity
solderability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55183967A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57109357A (en
Inventor
Masahiro Tsuji
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Priority to JP18396780A priority Critical patent/JPS57109357A/ja
Publication of JPS57109357A publication Critical patent/JPS57109357A/ja
Publication of JPS6213823B2 publication Critical patent/JPS6213823B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP18396780A 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead Granted JPS57109357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18396780A JPS57109357A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18396780A JPS57109357A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Publications (2)

Publication Number Publication Date
JPS57109357A JPS57109357A (en) 1982-07-07
JPS6213823B2 true JPS6213823B2 (enrdf_load_stackoverflow) 1987-03-28

Family

ID=16144949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18396780A Granted JPS57109357A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Country Status (1)

Country Link
JP (1) JPS57109357A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007100145A (ja) * 2005-09-30 2007-04-19 Dowa Holdings Co Ltd 曲げ加工性と疲労特性を改善した銅合金板材

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR840001426B1 (ko) * 1982-10-20 1984-09-26 이영세 전기전자 부품용 동합금 및 동합금판의 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278621A (en) * 1975-12-26 1977-07-02 Tamagawa Kikai Kinzoku Kk Copper alloy for lead frames of semiconductor elements
JPS6034267B2 (ja) * 1976-07-28 1985-08-07 株式会社東芝 半導体装置
JPS54100257A (en) * 1978-01-25 1979-08-07 Toshiba Corp Lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007100145A (ja) * 2005-09-30 2007-04-19 Dowa Holdings Co Ltd 曲げ加工性と疲労特性を改善した銅合金板材

Also Published As

Publication number Publication date
JPS57109357A (en) 1982-07-07

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