JPS60206046A - 多層配線を有する半導体集積回路 - Google Patents

多層配線を有する半導体集積回路

Info

Publication number
JPS60206046A
JPS60206046A JP6249384A JP6249384A JPS60206046A JP S60206046 A JPS60206046 A JP S60206046A JP 6249384 A JP6249384 A JP 6249384A JP 6249384 A JP6249384 A JP 6249384A JP S60206046 A JPS60206046 A JP S60206046A
Authority
JP
Japan
Prior art keywords
electrode layer
region
wiring
cross
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6249384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222539B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Tetsuo Asano
哲郎 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP6249384A priority Critical patent/JPS60206046A/ja
Publication of JPS60206046A publication Critical patent/JPS60206046A/ja
Publication of JPH0222539B2 publication Critical patent/JPH0222539B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP6249384A 1984-03-29 1984-03-29 多層配線を有する半導体集積回路 Granted JPS60206046A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6249384A JPS60206046A (ja) 1984-03-29 1984-03-29 多層配線を有する半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6249384A JPS60206046A (ja) 1984-03-29 1984-03-29 多層配線を有する半導体集積回路

Publications (2)

Publication Number Publication Date
JPS60206046A true JPS60206046A (ja) 1985-10-17
JPH0222539B2 JPH0222539B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-05-18

Family

ID=13201748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6249384A Granted JPS60206046A (ja) 1984-03-29 1984-03-29 多層配線を有する半導体集積回路

Country Status (1)

Country Link
JP (1) JPS60206046A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5321584A (en) * 1976-08-12 1978-02-28 Toshiba Corp Wiring system of semiconductor device
JPS5512639U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1978-07-12 1980-01-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5321584A (en) * 1976-08-12 1978-02-28 Toshiba Corp Wiring system of semiconductor device
JPS5512639U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1978-07-12 1980-01-26

Also Published As

Publication number Publication date
JPH0222539B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-05-18

Similar Documents

Publication Publication Date Title
JPWO2021111604A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP4757660B2 (ja) 半導体装置
JPS60206046A (ja) 多層配線を有する半導体集積回路
JPH01225137A (ja) 半導体集積回路装置
US20080128830A1 (en) Semiconductor device and manufactruing method thereof
JPS58200526A (ja) 多層配線を有する半導体装置
JP3253549B2 (ja) 半導体集積回路装置
KR900000167B1 (ko) 다층배선을 가진 반도체 집적회로
US8044518B2 (en) Junction member comprising junction pads arranged in matrix and multichip package using same
JPS60206047A (ja) 多層配線を有する半導体集積回路
US5148249A (en) Semiconductor protection device
JPS60206048A (ja) 多層配線を有する半導体集積回路
JPS59181041A (ja) 半導体集積回路装置
JP2944295B2 (ja) 半導体集積回路装置
JPS60206049A (ja) 多層配線を有する半導体集積回路
JPH05226584A (ja) 集積回路装置
JP3053013B2 (ja) 半導体集積回路装置
JP2919162B2 (ja) Ｌｓｉパッケージの形成方法およびｌｓｉチップ
US4771329A (en) Wirings in semiconductor integrated circuit and method thereof
US6674176B2 (en) Wire bond package with core ring formed over I/O cells
JP2005116861A (ja) 半導体装置およびそのレイアウト方法
JPS60178641A (ja) 半導体装置
JPH065782A (ja) 半導体チップコーナー部のレイアウト方法、及び半導体集積回路装置
JPS63312661A (ja) 半導体装置用パッケ−ジ
JPS6189641A (ja) 混成集積回路の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term