JPS60189950A - 静電チヤツクの帯電除去方法 - Google Patents
静電チヤツクの帯電除去方法Info
- Publication number
- JPS60189950A JPS60189950A JP4531084A JP4531084A JPS60189950A JP S60189950 A JPS60189950 A JP S60189950A JP 4531084 A JP4531084 A JP 4531084A JP 4531084 A JP4531084 A JP 4531084A JP S60189950 A JPS60189950 A JP S60189950A
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- container
- gas
- electrode
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000005530 etching Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract 2
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 101150009153 COG6 gene Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Jigs For Machine Tools (AREA)
- Elimination Of Static Electricity (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4531084A JPS60189950A (ja) | 1984-03-09 | 1984-03-09 | 静電チヤツクの帯電除去方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4531084A JPS60189950A (ja) | 1984-03-09 | 1984-03-09 | 静電チヤツクの帯電除去方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60189950A true JPS60189950A (ja) | 1985-09-27 |
| JPS6336138B2 JPS6336138B2 (enrdf_load_stackoverflow) | 1988-07-19 |
Family
ID=12715734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4531084A Granted JPS60189950A (ja) | 1984-03-09 | 1984-03-09 | 静電チヤツクの帯電除去方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60189950A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63160227A (ja) * | 1986-12-23 | 1988-07-04 | Nec Corp | ドライエッチング装置 |
| JPH0451542A (ja) * | 1990-06-19 | 1992-02-20 | Fujitsu Ltd | 静電吸着方法 |
| EP1739735A1 (en) * | 2005-06-30 | 2007-01-03 | Canon Kabushiki Kaisha | Container and method of transporting substrates using the same |
-
1984
- 1984-03-09 JP JP4531084A patent/JPS60189950A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63160227A (ja) * | 1986-12-23 | 1988-07-04 | Nec Corp | ドライエッチング装置 |
| JPH0451542A (ja) * | 1990-06-19 | 1992-02-20 | Fujitsu Ltd | 静電吸着方法 |
| EP1739735A1 (en) * | 2005-06-30 | 2007-01-03 | Canon Kabushiki Kaisha | Container and method of transporting substrates using the same |
| KR100774027B1 (ko) * | 2005-06-30 | 2007-11-06 | 캐논 가부시끼가이샤 | 용기 및 이것을 사용해서 기판을 반송하는 방법 |
| US7659966B2 (en) | 2005-06-30 | 2010-02-09 | Canon Kabushiki Kaisha | Container and method of transporting substrate using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6336138B2 (enrdf_load_stackoverflow) | 1988-07-19 |
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