JPS60189930A - ウエハ−保持装置 - Google Patents

ウエハ−保持装置

Info

Publication number
JPS60189930A
JPS60189930A JP4556584A JP4556584A JPS60189930A JP S60189930 A JPS60189930 A JP S60189930A JP 4556584 A JP4556584 A JP 4556584A JP 4556584 A JP4556584 A JP 4556584A JP S60189930 A JPS60189930 A JP S60189930A
Authority
JP
Japan
Prior art keywords
quartz
cover
wafers
holding device
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4556584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0117244B2 (enrdf_load_stackoverflow
Inventor
Shinji Okumura
奥村　慎二
Yasumi Sasaki
佐々木　泰実
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Priority to JP4556584A priority Critical patent/JPS60189930A/ja
Publication of JPS60189930A publication Critical patent/JPS60189930A/ja
Publication of JPH0117244B2 publication Critical patent/JPH0117244B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP4556584A 1984-03-12 1984-03-12 ウエハ−保持装置 Granted JPS60189930A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4556584A JPS60189930A (ja) 1984-03-12 1984-03-12 ウエハ−保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4556584A JPS60189930A (ja) 1984-03-12 1984-03-12 ウエハ−保持装置

Publications (2)

Publication Number Publication Date
JPS60189930A true JPS60189930A (ja) 1985-09-27
JPH0117244B2 JPH0117244B2 (enrdf_load_stackoverflow) 1989-03-29

Family

ID=12722869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4556584A Granted JPS60189930A (ja) 1984-03-12 1984-03-12 ウエハ−保持装置

Country Status (1)

Country Link
JP (1) JPS60189930A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63104418A (ja) * 1986-10-14 1988-05-09 ヘレウス・クアルツシュメルツェ・ゲゼルシャフト・ミット・ベシュレンクタ−・ハフツング 垂直格子囲い
JPH029426U (enrdf_load_stackoverflow) * 1988-06-30 1990-01-22
JPH03201527A (ja) * 1989-12-28 1991-09-03 Toshiba Ceramics Co Ltd スタッキングボート
JPH067238U (ja) * 1992-06-29 1994-01-28 株式会社福井信越石英 半導体熱処理装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52145771U (enrdf_load_stackoverflow) * 1976-04-27 1977-11-04
JPS53148283A (en) * 1977-05-30 1978-12-23 Toshiba Ceramics Co Silicon wafer jig
JPS543647U (enrdf_load_stackoverflow) * 1977-06-11 1979-01-11
JPS5812730A (ja) * 1981-07-15 1983-01-24 Kurabo Ind Ltd 折り曲げ硬質発泡体複合板の製造方法
JPS5878423A (ja) * 1981-10-16 1983-05-12 ヘルムト・ザイエル・ゲ−エムベ−ハ− 半導体物品の熱処理方法及びその装置
JPS58108735A (ja) * 1981-12-23 1983-06-28 Fujitsu Ltd 縦型反応管用バスケツト
JPS5918434U (ja) * 1982-07-27 1984-02-04 株式会社東芝 半導体基板用加熱支持台

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52145771U (enrdf_load_stackoverflow) * 1976-04-27 1977-11-04
JPS53148283A (en) * 1977-05-30 1978-12-23 Toshiba Ceramics Co Silicon wafer jig
JPS543647U (enrdf_load_stackoverflow) * 1977-06-11 1979-01-11
JPS5812730A (ja) * 1981-07-15 1983-01-24 Kurabo Ind Ltd 折り曲げ硬質発泡体複合板の製造方法
JPS5878423A (ja) * 1981-10-16 1983-05-12 ヘルムト・ザイエル・ゲ−エムベ−ハ− 半導体物品の熱処理方法及びその装置
JPS58108735A (ja) * 1981-12-23 1983-06-28 Fujitsu Ltd 縦型反応管用バスケツト
JPS5918434U (ja) * 1982-07-27 1984-02-04 株式会社東芝 半導体基板用加熱支持台

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63104418A (ja) * 1986-10-14 1988-05-09 ヘレウス・クアルツシュメルツェ・ゲゼルシャフト・ミット・ベシュレンクタ−・ハフツング 垂直格子囲い
JPH029426U (enrdf_load_stackoverflow) * 1988-06-30 1990-01-22
JPH03201527A (ja) * 1989-12-28 1991-09-03 Toshiba Ceramics Co Ltd スタッキングボート
JPH067238U (ja) * 1992-06-29 1994-01-28 株式会社福井信越石英 半導体熱処理装置

Also Published As

Publication number Publication date
JPH0117244B2 (enrdf_load_stackoverflow) 1989-03-29

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