JPS60180705A - ドリル折れ検出用プリント板 - Google Patents

ドリル折れ検出用プリント板

Info

Publication number
JPS60180705A
JPS60180705A JP2297184A JP2297184A JPS60180705A JP S60180705 A JPS60180705 A JP S60180705A JP 2297184 A JP2297184 A JP 2297184A JP 2297184 A JP2297184 A JP 2297184A JP S60180705 A JPS60180705 A JP S60180705A
Authority
JP
Japan
Prior art keywords
drill
drill breakage
board
printed board
breakage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2297184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6320646B2 (cs
Inventor
Keiji Kurosawa
黒澤　啓治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2297184A priority Critical patent/JPS60180705A/ja
Publication of JPS60180705A publication Critical patent/JPS60180705A/ja
Publication of JPS6320646B2 publication Critical patent/JPS6320646B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drilling And Boring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2297184A 1984-02-13 1984-02-13 ドリル折れ検出用プリント板 Granted JPS60180705A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2297184A JPS60180705A (ja) 1984-02-13 1984-02-13 ドリル折れ検出用プリント板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2297184A JPS60180705A (ja) 1984-02-13 1984-02-13 ドリル折れ検出用プリント板

Publications (2)

Publication Number Publication Date
JPS60180705A true JPS60180705A (ja) 1985-09-14
JPS6320646B2 JPS6320646B2 (cs) 1988-04-28

Family

ID=12097454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2297184A Granted JPS60180705A (ja) 1984-02-13 1984-02-13 ドリル折れ検出用プリント板

Country Status (1)

Country Link
JP (1) JPS60180705A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996033049A1 (en) * 1995-04-19 1996-10-24 Kimble Alvin J Locking ring vacuum clamping system with load/unload capabilities

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996033049A1 (en) * 1995-04-19 1996-10-24 Kimble Alvin J Locking ring vacuum clamping system with load/unload capabilities

Also Published As

Publication number Publication date
JPS6320646B2 (cs) 1988-04-28

Similar Documents

Publication Publication Date Title
CN109195313A (zh) 一种新型背钻测试孔制作方法
US6750405B1 (en) Two signal one power plane circuit board
JPH1187931A (ja) プリント配線板の製造方法
JPS60180705A (ja) ドリル折れ検出用プリント板
JP3991818B2 (ja) 多層配線付きテープキャリア
JP2654600B2 (ja) 試験用端子兼用型部品搭載位置認識マーク
JPS6320645B2 (cs)
JPH07112113B2 (ja) 多層回路板のバイアホール加工方法
JP3077776B2 (ja) プリント配線板の製造におけるスルーホール位置の検出機構、プリント配線板及びその製造方法
JPS59143394A (ja) 多層配線基板
JPH0719176Y2 (ja) 回路基板
JPS6317562B2 (cs)
JPS63100797A (ja) 多層プリント配線板の製造方法
JPS60172409A (ja) ドリル折れ検出要素及びプリント板孔明け方法
CN115682904A (zh) 一种任意层间介质厚度的检测方法
JPH114082A (ja) 印刷配線板の製造方法
JPS62155594A (ja) 多層プリント配線板
JPS61209805A (ja) プリント基板の穿孔検出方法
JPH05335749A (ja) プリント配線板及びその検査方法
JPS63124597A (ja) 印刷配線板の製造方法
JPH02271653A (ja) 半導体搭載用基板の製造方法
JPS58135697A (ja) 多層印刷配線板の穿孔方法
JPH04122508A (ja) プリント基板の穴開け加工方法
CN117545186A (zh) 一种焊盘位非镀孔的加工方法
JPH09199852A (ja) 多層プリント配線板及びその製造方法と製造装置