JPS60170944A - 半導体装置と基板の取付方法 - Google Patents

半導体装置と基板の取付方法

Info

Publication number
JPS60170944A
JPS60170944A JP2773784A JP2773784A JPS60170944A JP S60170944 A JPS60170944 A JP S60170944A JP 2773784 A JP2773784 A JP 2773784A JP 2773784 A JP2773784 A JP 2773784A JP S60170944 A JPS60170944 A JP S60170944A
Authority
JP
Japan
Prior art keywords
semiconductor device
wiring board
pellet
substrate
electrode terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2773784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0520901B2 (enExample
Inventor
Yukio Kashio
幸雄 樫尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP2773784A priority Critical patent/JPS60170944A/ja
Publication of JPS60170944A publication Critical patent/JPS60170944A/ja
Publication of JPH0520901B2 publication Critical patent/JPH0520901B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2773784A 1984-02-16 1984-02-16 半導体装置と基板の取付方法 Granted JPS60170944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2773784A JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2773784A JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Publications (2)

Publication Number Publication Date
JPS60170944A true JPS60170944A (ja) 1985-09-04
JPH0520901B2 JPH0520901B2 (enExample) 1993-03-22

Family

ID=12229340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2773784A Granted JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Country Status (1)

Country Link
JP (1) JPS60170944A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62281360A (ja) * 1986-05-29 1987-12-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH08241937A (ja) * 1996-03-21 1996-09-17 Hitachi Ltd 半導体装置
JP2022026927A (ja) * 2020-07-31 2022-02-10 日本電気株式会社 ホルダ、量子デバイス、及び、量子デバイスの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62281360A (ja) * 1986-05-29 1987-12-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH08241937A (ja) * 1996-03-21 1996-09-17 Hitachi Ltd 半導体装置
JP2022026927A (ja) * 2020-07-31 2022-02-10 日本電気株式会社 ホルダ、量子デバイス、及び、量子デバイスの製造方法

Also Published As

Publication number Publication date
JPH0520901B2 (enExample) 1993-03-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term