JPS60169194A - ハイブリツド集積回路用基板 - Google Patents
ハイブリツド集積回路用基板Info
- Publication number
- JPS60169194A JPS60169194A JP59024801A JP2480184A JPS60169194A JP S60169194 A JPS60169194 A JP S60169194A JP 59024801 A JP59024801 A JP 59024801A JP 2480184 A JP2480184 A JP 2480184A JP S60169194 A JPS60169194 A JP S60169194A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- layer
- copper
- substrate
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 25
- 239000010949 copper Substances 0.000 claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 239000011521 glass Substances 0.000 claims description 34
- 239000004020 conductor Substances 0.000 claims description 32
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 7
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 42
- 239000000945 filler Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59024801A JPS60169194A (ja) | 1984-02-13 | 1984-02-13 | ハイブリツド集積回路用基板 |
| KR1019840005623A KR900004379B1 (ko) | 1983-09-16 | 1984-09-15 | 세라믹 다층기판 및 그 제조방법 |
| GB08423483A GB2149222B (en) | 1983-09-16 | 1984-09-17 | Multilatered ceramic substrate and method of making the same |
| DE19843434449 DE3434449A1 (de) | 1983-09-16 | 1984-09-17 | Keramisches mehrschichtsubstrat und verfahren zu seiner herstellung |
| US06/898,892 US4732798A (en) | 1983-09-16 | 1986-08-21 | Multilayer ceramic substrate and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59024801A JPS60169194A (ja) | 1984-02-13 | 1984-02-13 | ハイブリツド集積回路用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60169194A true JPS60169194A (ja) | 1985-09-02 |
| JPH0464198B2 JPH0464198B2 (enrdf_load_stackoverflow) | 1992-10-14 |
Family
ID=12148295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59024801A Granted JPS60169194A (ja) | 1983-09-16 | 1984-02-13 | ハイブリツド集積回路用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60169194A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07176864A (ja) * | 1993-12-21 | 1995-07-14 | Fujitsu Ltd | 多層セラミック基板の製造方法 |
| JP2013033894A (ja) * | 2011-06-27 | 2013-02-14 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、半導体装置 |
-
1984
- 1984-02-13 JP JP59024801A patent/JPS60169194A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07176864A (ja) * | 1993-12-21 | 1995-07-14 | Fujitsu Ltd | 多層セラミック基板の製造方法 |
| JP2013033894A (ja) * | 2011-06-27 | 2013-02-14 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0464198B2 (enrdf_load_stackoverflow) | 1992-10-14 |
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