JPS60169194A - ハイブリツド集積回路用基板 - Google Patents

ハイブリツド集積回路用基板

Info

Publication number
JPS60169194A
JPS60169194A JP59024801A JP2480184A JPS60169194A JP S60169194 A JPS60169194 A JP S60169194A JP 59024801 A JP59024801 A JP 59024801A JP 2480184 A JP2480184 A JP 2480184A JP S60169194 A JPS60169194 A JP S60169194A
Authority
JP
Japan
Prior art keywords
glass
layer
copper
substrate
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59024801A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0464198B2 (enrdf_load_stackoverflow
Inventor
徹 石田
菊池　立郎
泰治 菊池
泰彦 堀尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59024801A priority Critical patent/JPS60169194A/ja
Priority to KR1019840005623A priority patent/KR900004379B1/ko
Priority to GB08423483A priority patent/GB2149222B/en
Priority to DE19843434449 priority patent/DE3434449A1/de
Publication of JPS60169194A publication Critical patent/JPS60169194A/ja
Priority to US06/898,892 priority patent/US4732798A/en
Publication of JPH0464198B2 publication Critical patent/JPH0464198B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59024801A 1983-09-16 1984-02-13 ハイブリツド集積回路用基板 Granted JPS60169194A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59024801A JPS60169194A (ja) 1984-02-13 1984-02-13 ハイブリツド集積回路用基板
KR1019840005623A KR900004379B1 (ko) 1983-09-16 1984-09-15 세라믹 다층기판 및 그 제조방법
GB08423483A GB2149222B (en) 1983-09-16 1984-09-17 Multilatered ceramic substrate and method of making the same
DE19843434449 DE3434449A1 (de) 1983-09-16 1984-09-17 Keramisches mehrschichtsubstrat und verfahren zu seiner herstellung
US06/898,892 US4732798A (en) 1983-09-16 1986-08-21 Multilayer ceramic substrate and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59024801A JPS60169194A (ja) 1984-02-13 1984-02-13 ハイブリツド集積回路用基板

Publications (2)

Publication Number Publication Date
JPS60169194A true JPS60169194A (ja) 1985-09-02
JPH0464198B2 JPH0464198B2 (enrdf_load_stackoverflow) 1992-10-14

Family

ID=12148295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59024801A Granted JPS60169194A (ja) 1983-09-16 1984-02-13 ハイブリツド集積回路用基板

Country Status (1)

Country Link
JP (1) JPS60169194A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07176864A (ja) * 1993-12-21 1995-07-14 Fujitsu Ltd 多層セラミック基板の製造方法
JP2013033894A (ja) * 2011-06-27 2013-02-14 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07176864A (ja) * 1993-12-21 1995-07-14 Fujitsu Ltd 多層セラミック基板の製造方法
JP2013033894A (ja) * 2011-06-27 2013-02-14 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、半導体装置

Also Published As

Publication number Publication date
JPH0464198B2 (enrdf_load_stackoverflow) 1992-10-14

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