JPS6016537U - 半導体ウエハの片面処理装置 - Google Patents

半導体ウエハの片面処理装置

Info

Publication number
JPS6016537U
JPS6016537U JP1983106956U JP10695683U JPS6016537U JP S6016537 U JPS6016537 U JP S6016537U JP 1983106956 U JP1983106956 U JP 1983106956U JP 10695683 U JP10695683 U JP 10695683U JP S6016537 U JPS6016537 U JP S6016537U
Authority
JP
Japan
Prior art keywords
utility
model registration
discs
pair
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983106956U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0140193Y2 (enrdf_load_stackoverflow
Inventor
相合　征一郎
Original Assignee
黒谷　巌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 黒谷　巌 filed Critical 黒谷　巌
Priority to JP1983106956U priority Critical patent/JPS6016537U/ja
Publication of JPS6016537U publication Critical patent/JPS6016537U/ja
Application granted granted Critical
Publication of JPH0140193Y2 publication Critical patent/JPH0140193Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP1983106956U 1983-07-09 1983-07-09 半導体ウエハの片面処理装置 Granted JPS6016537U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983106956U JPS6016537U (ja) 1983-07-09 1983-07-09 半導体ウエハの片面処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983106956U JPS6016537U (ja) 1983-07-09 1983-07-09 半導体ウエハの片面処理装置

Publications (2)

Publication Number Publication Date
JPS6016537U true JPS6016537U (ja) 1985-02-04
JPH0140193Y2 JPH0140193Y2 (enrdf_load_stackoverflow) 1989-12-01

Family

ID=30250084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983106956U Granted JPS6016537U (ja) 1983-07-09 1983-07-09 半導体ウエハの片面処理装置

Country Status (1)

Country Link
JP (1) JPS6016537U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148825A (ja) * 1989-11-06 1991-06-25 Ebara Corp ジェットスクラバー

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148825A (ja) * 1989-11-06 1991-06-25 Ebara Corp ジェットスクラバー

Also Published As

Publication number Publication date
JPH0140193Y2 (enrdf_load_stackoverflow) 1989-12-01

Similar Documents

Publication Publication Date Title
JPS6016537U (ja) 半導体ウエハの片面処理装置
JPS6016538U (ja) 半導体ウエハの片面処理装置
JPS5887340U (ja) 半導体装置の製造装置
JPS5991735U (ja) 半導体ウエ−ハ移し替え装置
JPS6031376U (ja) 導電性ペ−スト成形装置
JPS5844845U (ja) 吸着ステ−ジ
JPS585342U (ja) ウェハ−表面処理装置
JPS6039242U (ja) 液処理装置
JPS5984843U (ja) 半導体製造用キヤリアハンガ
JPS6094842U (ja) 半導体基板用研削装置
JPS6133870U (ja) エツチング装置
JPS62136432U (enrdf_load_stackoverflow)
JPS622766Y2 (enrdf_load_stackoverflow)
JPS6031964U (ja) ウエハ−ポリッシング装置用重り構造
JPS5846988U (ja) ラジエ−タ
JPS5985956U (ja) フロ−型イオン選択性電極
JPS5920629U (ja) 拡散治具
JPS6056461U (ja) 研磨治具
JPS6112674U (ja) ポリシング装置
JPS63147895U (enrdf_load_stackoverflow)
JPS60103142U (ja) ベルヌイ型半導体基板搬送装置
JPS59146944U (ja) ウエハチヤツク基台
JPS5967949U (ja) 液冷形サイリスタモジユ−ル
JPS60110464U (ja) 基板収容装置
JPS6016542U (ja) 半導体ウエ−ハ用ボ−ト