JPS6016537U - Single-sided processing equipment for semiconductor wafers - Google Patents

Single-sided processing equipment for semiconductor wafers

Info

Publication number
JPS6016537U
JPS6016537U JP1983106956U JP10695683U JPS6016537U JP S6016537 U JPS6016537 U JP S6016537U JP 1983106956 U JP1983106956 U JP 1983106956U JP 10695683 U JP10695683 U JP 10695683U JP S6016537 U JPS6016537 U JP S6016537U
Authority
JP
Japan
Prior art keywords
utility
model registration
discs
pair
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983106956U
Other languages
Japanese (ja)
Other versions
JPH0140193Y2 (en
Inventor
相合　征一郎
Original Assignee
黒谷　巌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 黒谷　巌 filed Critical 黒谷　巌
Priority to JP1983106956U priority Critical patent/JPS6016537U/en
Publication of JPS6016537U publication Critical patent/JPS6016537U/en
Application granted granted Critical
Publication of JPH0140193Y2 publication Critical patent/JPH0140193Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一例による半導体ウェハの片面処理装
置の縦断面図、第２図はその装置に含まれる一対の円板
の分解平面図、第３図は一対の円板が重ねられた状態を
示す一部の拡大平面図、第４図は他の実施例を示す縦断
面図、−第５図は別の実施例を示す第３図に類似の平面
図である。Fig. 1 is a vertical cross-sectional view of a semiconductor wafer single-sided processing apparatus according to an example of the present invention, Fig. 2 is an exploded plan view of a pair of disks included in the apparatus, and Fig. 3 is an exploded plan view of a pair of disks stacked on top of each other. FIG. 4 is a longitudinal sectional view showing another embodiment, and FIG. 5 is a plan view similar to FIG. 3 showing another embodiment.

Claims (5)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）底部に処理液導入用の通路が備えられたカップ状
の槽と、前記槽の上に近接して設けられ且つ処理すべき
片面を下向きにして半導体ウェハを支持するチャックを
含む処理装置において、前記通路の頂部には互に相対的
に回動し得る一対の円板が設置され、各前記円板には空
所が設けられ、前記円板相互の空所の整合度によってそ
こを通過して半導体ウェハの下面に対し吹上げられる処
理液の流量が調整されることを特徴とする半導体ウェハ
の片面処理装置。(1) A processing device that includes a cup-shaped tank with a passage for introducing a processing liquid at the bottom, and a chuck that is provided close to the top of the tank and supports a semiconductor wafer with one side to be processed facing downward. A pair of discs that can rotate relative to each other are installed at the top of the passage, and each of the discs is provided with a cavity, which can be adjusted depending on the degree of alignment of the cavities between the discs. A single-side processing apparatus for semiconductor wafers, characterized in that the flow rate of processing liquid that passes through and is blown up against the lower surface of the semiconductor wafer is adjusted. （２）実用新案登録請求の範囲第（１）項に記載の装置
において、前記一対の円板の各空所は同じ形状に形成さ
れている半導体ウェハの片面処理装置。(2) Utility Model Registration The apparatus according to claim (1), wherein each of the spaces in the pair of discs is formed in the same shape. （３）実用新案登録請求の範囲第（１）項に記載の装置
において、前記一対の円板は中央に設けられたピンによ
り互に連結されている半導体ウェハの片面処理装置。(3) Utility Model Registration The device according to claim (1), wherein the pair of disks are connected to each other by a pin provided in the center. （４）実用新案登録請求の範囲第（１）項に記載の装置
において、各前記空所は孔である半導体ウェハ　　　　
　。 の片面処理装置。(4) Utility Model Registration Scope of Claims In the device according to claim (1), each of the voids is a hole, and the semiconductor wafer is
. single-sided processing equipment. （５）実用新案登録請求の範囲第（１）項に記載の装置
において、各前記空所は切欠きである半導体ウェハの片
面処理装置。(5) Utility Model Registration The apparatus according to claim (1), wherein each of the voids is a cutout.
JP1983106956U 1983-07-09 1983-07-09 Single-sided processing equipment for semiconductor wafers Granted JPS6016537U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983106956U JPS6016537U (en) 1983-07-09 1983-07-09 Single-sided processing equipment for semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983106956U JPS6016537U (en) 1983-07-09 1983-07-09 Single-sided processing equipment for semiconductor wafers

Publications (2)

Publication Number Publication Date
JPS6016537U true JPS6016537U (en) 1985-02-04
JPH0140193Y2 JPH0140193Y2 (en) 1989-12-01

Family

ID=30250084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983106956U Granted JPS6016537U (en) 1983-07-09 1983-07-09 Single-sided processing equipment for semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS6016537U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148825A (en) * 1989-11-06 1991-06-25 Ebara Corp Jet scrubber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148825A (en) * 1989-11-06 1991-06-25 Ebara Corp Jet scrubber

Also Published As

Publication number Publication date
JPH0140193Y2 (en) 1989-12-01

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