JPS6016517B2 - 無電解めつき制御方法 - Google Patents

無電解めつき制御方法

Info

Publication number
JPS6016517B2
JPS6016517B2 JP54172961A JP17296179A JPS6016517B2 JP S6016517 B2 JPS6016517 B2 JP S6016517B2 JP 54172961 A JP54172961 A JP 54172961A JP 17296179 A JP17296179 A JP 17296179A JP S6016517 B2 JPS6016517 B2 JP S6016517B2
Authority
JP
Japan
Prior art keywords
plating
plating solution
replenishment
electroless
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54172961A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5696065A (en
Inventor
建 荒木
裕允 酒井
裕 杉浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP54172961A priority Critical patent/JPS6016517B2/ja
Application filed by Uemera Kogyo Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to US06/204,084 priority patent/US4350717A/en
Priority to GB8036231A priority patent/GB2066510B/en
Priority to FR8024166A priority patent/FR2469466B1/fr
Priority to DE3043065A priority patent/DE3043065C3/de
Publication of JPS5696065A publication Critical patent/JPS5696065A/ja
Priority to US06/363,115 priority patent/US4406250A/en
Priority to SG193/84A priority patent/SG19384G/en
Priority to HK65/85A priority patent/HK6585A/xx
Publication of JPS6016517B2 publication Critical patent/JPS6016517B2/ja
Priority to MY516/85A priority patent/MY8500516A/xx
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D21/00—Control of chemical or physico-chemical variables, e.g. pH value
    • G05D21/02—Control of chemical or physico-chemical variables, e.g. pH value characterised by the use of electric means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Control Of Non-Electrical Variables (AREA)
JP54172961A 1979-11-14 1979-12-29 無電解めつき制御方法 Expired JPS6016517B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP54172961A JPS6016517B2 (ja) 1979-12-29 1979-12-29 無電解めつき制御方法
US06/204,084 US4350717A (en) 1979-12-29 1980-11-04 Controlling electroless plating bath
GB8036231A GB2066510B (en) 1979-12-29 1980-11-12 Method and apparatus for controlling electroless plating bath
FR8024166A FR2469466B1 (fr) 1979-11-14 1980-11-13 Procede et appareil pour la commande de bains utilises pour les revetements par voie non electrolytique
DE3043065A DE3043065C3 (de) 1979-12-29 1980-11-14 Verfahren und Vorrichtung zur Steuerung der Zusammensetzung eines Bades zur stromlosen Beschichtung
US06/363,115 US4406250A (en) 1979-12-29 1982-03-29 Apparatus for controlling electroless plating bath
SG193/84A SG19384G (en) 1979-12-29 1984-03-01 Method and apparatus for controlling electroless plating bath
HK65/85A HK6585A (en) 1979-12-29 1985-01-24 Method and apparatus for controlling electroless plating bath
MY516/85A MY8500516A (en) 1979-12-29 1985-12-30 Method and apparatus for controlling electroless plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54172961A JPS6016517B2 (ja) 1979-12-29 1979-12-29 無電解めつき制御方法

Publications (2)

Publication Number Publication Date
JPS5696065A JPS5696065A (en) 1981-08-03
JPS6016517B2 true JPS6016517B2 (ja) 1985-04-25

Family

ID=15951561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54172961A Expired JPS6016517B2 (ja) 1979-11-14 1979-12-29 無電解めつき制御方法

Country Status (7)

Country Link
US (2) US4350717A (enExample)
JP (1) JPS6016517B2 (enExample)
DE (1) DE3043065C3 (enExample)
GB (1) GB2066510B (enExample)
HK (1) HK6585A (enExample)
MY (1) MY8500516A (enExample)
SG (1) SG19384G (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4479980A (en) * 1983-12-16 1984-10-30 International Business Machines Corporation Plating rate monitor
DE3404267A1 (de) * 1984-02-03 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zur vollautomatischen steuerung der galvanischen abscheidung von kupferueberzuegen aus sauren kupferbaedern
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
JPS61199069A (ja) * 1985-02-28 1986-09-03 C Uyemura & Co Ltd めっき液濃度自動連続管理装置
US5200047A (en) * 1985-02-28 1993-04-06 C. Uyemura & Co., Ltd. Plating solution automatic control
US4755744A (en) * 1986-01-21 1988-07-05 Rohrback Corporation Plated sensor for monitoring corrosion or electroplating
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
ES2039403T3 (es) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) Metodo para depositar sin electricidad cobre de alta calidad.
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4882537A (en) * 1988-05-09 1989-11-21 Rohrback Cosasco Systems, Inc. Method and apparatus for reducing interference in an electrical resistance probe during electrolytic plating
US5117370A (en) * 1988-12-22 1992-05-26 Ford Motor Company Detection system for chemical analysis of zinc phosphate coating solutions
US5631845A (en) * 1995-10-10 1997-05-20 Ford Motor Company Method and system for controlling phosphate bath constituents
US5993892A (en) * 1996-09-12 1999-11-30 Wasserman; Arthur Method of monitoring and controlling electroless plating in real time
US5843538A (en) * 1996-12-09 1998-12-01 John L. Raymond Method for electroless nickel plating of metal substrates
CN100399012C (zh) * 2000-05-22 2008-07-02 上村工业株式会社 用于无电复合镀敷溶液的自动分析和控制系统
US6524642B1 (en) 2001-04-21 2003-02-25 Omg Fidelity, Inc. Electroless metal-plating process
JP3704054B2 (ja) * 2001-05-01 2005-10-05 東京エレクトロン株式会社 処理液の濃度を変更する方法及び処理液供給装置
US6500482B1 (en) * 2001-08-31 2002-12-31 Boules H. Morcos Electroless nickel plating solution and process for its use
US7341634B2 (en) * 2002-08-27 2008-03-11 Ebara Corporation Apparatus for and method of processing substrate
WO2004031446A1 (en) * 2002-10-01 2004-04-15 Omg Americas, Inc. Electroless metal-plating baths
US6773760B1 (en) * 2003-04-28 2004-08-10 Yuh Sung Method for metallizing surfaces of substrates
US7465358B2 (en) * 2003-10-15 2008-12-16 Applied Materials, Inc. Measurement techniques for controlling aspects of a electroless deposition process
TWI250614B (en) * 2005-04-08 2006-03-01 Chung Cheng Inst Of Technology Method for preparing copper interconnections of ULSI
JP2012533683A (ja) * 2009-07-16 2012-12-27 ラム リサーチ コーポレーション 無電解析出溶液およびプロセス制御
JP6863170B2 (ja) * 2016-12-21 2021-04-21 住友金属鉱山株式会社 無電解めっき液のめっき処理時間の測定方法、無電解めっき液を評価するための試料を作製する試料作製方法、および無電解めっき液の評価方法
JP2024119125A (ja) * 2023-02-22 2024-09-03 上村工業株式会社 めっき析出状況の測定装置
US12473650B1 (en) * 2024-07-03 2025-11-18 The Boeing Company Electroless plating systems and methods
CN122284701B (zh) * 2026-05-26 2026-07-17 东北大学 镁合金化学镀液维护方法、装置、电子设备及存储介质

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2872353A (en) * 1954-01-12 1959-02-03 Gen Am Transport Processes of continuous chemical nickel plating
GB1011703A (en) 1962-11-06 1965-12-01 Jaroslav Prusek Aparatus for regulating the composition of electrolytes
FR1551275A (enExample) 1966-12-19 1968-12-27
CH563000A5 (enExample) 1973-03-09 1975-06-13 Plascon Ag
DE2538817C3 (de) * 1975-09-01 1980-11-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Bad und Verfahren zum stromlosen Vernickeln von Metall und Metallegierungen, insbesondere Aluminium und Aluminiumlegierungen
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
CA1093911A (en) * 1976-04-08 1981-01-20 George A. Butter Electroless copper plating
US4152164A (en) * 1976-04-26 1979-05-01 Michael Gulla Electroless nickel plating

Also Published As

Publication number Publication date
JPS5696065A (en) 1981-08-03
MY8500516A (en) 1985-12-31
GB2066510A (en) 1981-07-08
HK6585A (en) 1985-02-01
DE3043065A1 (de) 1981-07-02
DE3043065C2 (enExample) 1993-11-18
GB2066510B (en) 1983-11-02
US4406250A (en) 1983-09-27
US4350717A (en) 1982-09-21
SG19384G (en) 1985-01-04
DE3043065C3 (de) 1993-11-18

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